公开(公告)号：US20060273138A1

公开(公告)日：2006-12-07

申请号：US11445203

申请日：2006-06-02

申请人： Seung-hoon Lee ,  Suk-young Kang ,  Il-jin Kim ,  Jun-chul Shin ,  Sang-kyoon Yoon

发明人： Seung-hoon Lee ,  Suk-young Kang ,  Il-jin Kim ,  Jun-chul Shin ,  Sang-kyoon Yoon

IPC分类号： A47J36/02

CPC分类号： H05K3/3415 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2203/0126 ,  H05K2203/1476 ,  H05K2203/1563 ,  Y02P70/613

摘要： Provided is a soldering apparatus for a printed circuit board (PCB) for soldering the PCB and one or more electronic components populated on the PCB, the PCB having an upper side and a bottom side that is opposite the upper side, including a PCB INVERTING UNIT for rotatably supporting the PCB; a soldering cream PRINTING UNIT for printing on the lower side of the PCB a soldering cream substantially on a plurality of lead holes formed in the PCB in an inverted state, wherein in the inverted state a position of the PCB is inverted by the PCB INVERTING UNIT such that the lower side of the PCB faces in an upward direction; and a hardener for hardening the printed soldering cream while the one or more electronic components are inserted into the lead holes in a reverted state, wherein in the reverted state a position of the PCB is reverted by the PCB inverter such that the upper side of the PCB faces in a upward direction. Thus, provided is a soldering apparatus for a PCB, a soldering method for the PCB, and a soldering cream PRINTING UNIT for soldering on the PCB electronic components that are soldered on the PCB in high density and more reliability.

摘要翻译： 本发明提供一种用于焊接印刷电路板的印刷电路板（PCB）和PCB上的一个或多个电子元件的焊接装置，PCB具有与上侧相对的上侧和底侧，包括PCB反相单元 用于可旋转地支撑PCB; 一种焊膏印刷单元，用于在PCB的下侧印刷基本上在反相状态下形成在PCB中的多个引线孔上的焊膏，其中在倒置状态下，PCB的位置被PCB反相单元反转 使得PCB的下侧面向上方向; 以及用于在所述一个或多个电子部件以回复状态插入所述引线孔中时硬化所述印刷焊膏的硬化剂，其中在所述还原状态下，所述PCB的位置由所述PCB逆变器回复，使得所述PCB逆变器的上侧 PCB面向上方。 因此，提供了用于PCB的焊接装置，用于PCB的焊接方法以及用于以高密度和更可靠的方式焊接在PCB上焊接在PCB上的PCB电子部件的焊膏印刷单元。