摘要:
A CMOS image sensor is provided. The CMOS image sensor includes a photodiode receiving light and generating photocharges, a transfer transistor connected to the photodiode and transferring the photocharges, a floating diffusion accumulating the photocharges transferred from the transfer transistor, a reset transistor discharging the photocharges accumulated in the floating diffusion, and a merge gate transistor controlling capacitance of the floating diffusion. The CMOS image sensor may obtain a wide dynamic range signal without an increase in size of a pixel.
摘要:
An output-compensated buffer includes a buffer circuit that receives an input signal and produces an output signal responsive thereto at an output terminal, the buffer circuit including an input source-follower circuit that receives the input signal. A feedback circuit is connected to the output terminal and to the input source follower circuit and operative to vary an input capacitance of the source follower circuit responsive to the output signal at the output terminal. The input source follower circuit preferably includes a bias terminal coupled to a power source, and the feedback circuit is preferably capacitively coupled to the bias terminal. According to another aspect, an image capture device includes a charged coupled device (CCD) that generates a video signal. A buffer circuit is responsive to the CCD and operative to receives the video signal and produce an output signal responsive thereto at an output terminal, the buffer circuit including an input source-follower circuit that receives the video signal. A feedback circuit is connected to the output terminal and to the input source follower circuit and operative to vary an input capacitance of the source follower circuit responsive to the output signal at the output terminal.
摘要:
In a method for manufacturing a solid state image pick up device capable of improving gettering efficiency a semiconductor substrate having a front side on which a solid state image pick-up device may be formed, and a rear side opposite to the front side is provided. Subsequently, a polysilicon layer including impurities for gettering having a predetermined concentration is formed on the rear side of the semiconductor substrate. Next, a predetermined thickness of the polysilicon layer including the impurities for gettering is oxidized, and the impurities for gettering are condensed into the reduced polysilicon layer.