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1.发明授权Method of forming CNT containing wiring material and sputtering target material used for the method 失效形成CNT的布线材料的方法和用于该方法的溅射靶材料公开(公告)号：US07578909B2
公开(公告)日：2009-08-25
申请号：US11076024
申请日：2005-03-10
申请人： Satoru Mano , Harunori Sakaguchi
发明人： Satoru Mano , Harunori Sakaguchi
IPC分类号： C23C14/34
CPC分类号： H05K1/09 , B22F2998/10 , B82Y10/00 , C23C14/06 , C23C14/3414 , C23C14/352 , H05K2201/026 , H05K2201/0317 , H05K2201/0323 , B22F1/0003 , B22F3/04 , B22F3/15 , B22F3/02
摘要： A method of forming a CNT containing wiring material is conducted by sputtering simultaneously CNT and a metal material on a surface of a substrate to form a CNT containing metal layer, then pattern-etching the CNT containing metal layer to form a wiring pattern. A sputtering target material having a metal material and CNT is used in the method.
摘要翻译： 通过在基板的表面上同时溅射CNT和金属材料来进行形成含CNT的布线材料的方法，以形成含有CNT的金属层，然后对包含CNT的金属层进行图案蚀刻以形成布线图案。 在该方法中使用具有金属材料和CNT的溅射靶材料。
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2.发明申请公开(公告)号：US20060057742A1
公开(公告)日：2006-03-16
申请号：US11076024
申请日：2005-03-10
申请人： Satoru Mano , Harunori Sakaguchi
发明人： Satoru Mano , Harunori Sakaguchi
IPC分类号： H01L21/00
CPC分类号： H05K1/09 , B22F2998/10 , B82Y10/00 , C23C14/06 , C23C14/3414 , C23C14/352 , H05K2201/026 , H05K2201/0317 , H05K2201/0323 , B22F1/0003 , B22F3/04 , B22F3/15 , B22F3/02
摘要： A method of forming a CNT containing wiring material is conducted by sputtering simultaneously CNT and a metal material on a surface of a substrate to form a CNT containing metal layer, then pattern-etching the CNT containing metal layer to form a wiring pattern. A sputtering target material having a metal material and CNT is used in the method.
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