公开(公告)号：US06696755B2

公开(公告)日：2004-02-24

申请号：US10389121

申请日：2003-03-14

申请人： Nobuharu Kami ,  Kazuhiko Kurata ,  Satoshi Doumae ,  Takara Sugimoto

发明人： Nobuharu Kami ,  Kazuhiko Kurata ,  Satoshi Doumae ,  Takara Sugimoto

IPC分类号： H01L2334

CPC分类号： G02B6/4201 ,  G02B6/4214 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/10253 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer; a conductor provided in a hole formed in the flexible film and making connection between the wiring pattern formed in the first conductive layer and the wiring pattern formed in the second wiring pattern; a stiffener; and a heat spreader. A part of the wiring pattern constituted by each of the first conductive layer and the second wiring pattern is a conductive wiring, whose characteristic impedance is previously calculated, for a high-speed signal and a connection portion for making connection to a mother board is provided on an end of the conductive wiring for a high-speed signal. Thus the semiconductor device is able to have a high heat removal ability without sacrificing its electrical performance and enables time efficiency in package design associated with package assembly and reduced assembly cost.

摘要翻译： 半导体器件包括：能够改变其形状的绝缘柔性膜; 设置在柔性膜的两个表面上并构成布线图案的第一和第二导电层; 安装在第一导电层上的LSI; 设置在形成在所述柔性膜中的孔中并且形成在所述第一导电层中形成的布线图案与形成在所述第二布线图案中的布线图案之间的连接的导体; 加强筋 和散热器。 由第一导电层和第二布线图案中的每一个构成的布线图形的一部分是针对高速信号预先计算其特性阻抗的导电布线和用于连接到母板的连接部分 在用于高速信号的导电布线的一端。 因此，半导体器件能够具有高的除热能力，而不牺牲其电性能，并且能够实现与封装组装相关的封装设计中的时间效率并降低组装成本。