公开(公告)号：US06334453B1

公开(公告)日：2002-01-01

申请号：US09503784

申请日：2000-02-14

申请人： Raymon F. Thompson ,  Scott Bruner

发明人： Raymon F. Thompson ,  Scott Bruner

IPC分类号： B08B1300

CPC分类号： H01L21/67126 ,  Y10S134/902

摘要： An apparatus for processing a microelectronic workpiece, such as a semiconductor wafer, is set forth. The apparatus comprises a processing bowl that defines a processing chamber. A seal is provided to assist in removing fluids, such as processing fluids, from the processing chamber that are in the proximity of the seal. Further, the seal is provided to assist in preventing the fluids from entering the motor. To this end, flow generating threads and expulsion threads are provided at an end of a shaft assembly that is connected to be driven by the motor. A member substantially surrounds at least a portion of the flow generating threads and at least a portion of the expulsion threads. Together, the member defines a chamber with the shaft assembly. Rotation of the shaft assembly results in corresponding rotation of the flow generating threads and expulsion threads to drive fluids proximate the shaft assembly to an exhaust while concurrently assisting in preventing such fluids from entering the motor.

摘要翻译： 阐述了一种用于处理诸如半导体晶片的微电子工件的装置。 该装置包括限定处理室的处理碗。 提供密封件以帮助从位于密封件附近的处理室中除去诸如处理流体的流体。 此外，设置密封件以帮助防止流体进入马达。 为此，在轴组件的端部设置有流动产生螺纹和排出螺纹，该组件的连接部由马达驱动。 构件基本上围绕流动产生螺纹的至少一​​部分和排出螺纹的至少一​​部分。 构件一起定义了具有轴组件的腔室。 轴组件的旋转导致流动产生螺纹和排出螺纹的相应旋转，以将靠近轴组件的流体驱动到排气，同时辅助防止这种流体进入马达。

公开(公告)号：US20190267698A1

公开(公告)日：2019-08-29

申请号：US16287126

申请日：2019-02-27

申请人： Somnath MUKHERJEE ,  Aditi CHANDRA ,  Mao ITO ,  Arvind KAMATH ,  Scott BRUNER ,  Sambhu KUNDU ,  Anand DESHPANDE

发明人： Somnath MUKHERJEE ,  Aditi CHANDRA ,  Mao ITO ,  Arvind KAMATH ,  Scott BRUNER ,  Sambhu KUNDU ,  Anand DESHPANDE

IPC分类号： H01Q1/22 ,  H01L23/532 ,  H01L23/66 ,  H01L23/64 ,  H01L23/522 ,  H01L23/528

摘要： A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap