Transient defect detection algorithm
    1.
    发明授权
    Transient defect detection algorithm 失效
    瞬态缺陷检测算法

    公开(公告)号:US07591583B2

    公开(公告)日:2009-09-22

    申请号:US11131628

    申请日:2005-05-18

    IPC分类号: G01N25/72

    摘要: The invention provides an apparatus and method for detecting flaws in an object. The method includes the step of heating a portion of a surface of an object wherein the surface is defined by a plurality of individual surface elements. The method also includes the step of recording a plurality of thermal images of the portion over time with a thermal imaging device. Each of the plurality of thermal images is defined by a plurality of pixels. Each of the plurality of pixels has an individual pixel address and corresponds to one of the plurality of individual surface elements. The method also includes the step of determining a pixel intensity for each of the plurality pixels in each of the plurality of thermal images. The method also includes the step of integrating the pixel intensity of each of the plurality of pixels having the same individual address from respective thermal images to establish elements within an array of integrated pixel intensity. The method also includes the step of using the array of integrated pixel intensity to detect a flaw in the object.

    摘要翻译: 本发明提供一种用于检测物体中的瑕疵的装置和方法。 该方法包括加热物体的表面的一部分的步骤,其中表面由多个单独的表面元件限定。 该方法还包括用热成像装置随时间记录该部分的多个热图像的步骤。 多个热图像中的每一个由多个像素限定。 多个像素中的每一个具有单个像素地址,并且对应于多个单独表面元素中的一个。 该方法还包括确定多个热图像中的每一个中的多个像素中的每一个的像素强度的步骤。 该方法还包括将来自相应热图像的具有相同单独地址的多个像素中的每一个的像素强度积分成在集成像素强度阵列内建立元素的步骤。 该方法还包括使用集成像素强度阵列来检测对象中的缺陷的步骤。

    Transient defect detection algorithm

    公开(公告)号:US20060262971A1

    公开(公告)日:2006-11-23

    申请号:US11131628

    申请日:2005-05-18

    IPC分类号: G06K9/00

    摘要: The invention provides an apparatus and method for detecting flaws in an object. The method includes the step of heating a portion of a surface of an object wherein the surface is defined by a plurality of individual surface elements. The method also includes the step of recording a plurality of thermal images of the portion over time with a thermal imaging device. Each of the plurality of thermal images is defined by a plurality of pixels. Each of the plurality of pixels has an individual pixel address and corresponds to one of the plurality of individual surface elements. The method also includes the step of determining a pixel intensity for each of the plurality pixels in each of the plurality of thermal images. The method also includes the step of integrating the pixel intensity of each of the plurality of pixels having the same individual address from respective thermal images to establish elements within an array of integrated pixel intensity. The method also includes the step of using the array of integrated pixel intensity to detect a flaw in the object.

    Diffraction method for measuring thickness of a workpart
    3.
    发明授权
    Diffraction method for measuring thickness of a workpart 有权
    用于测量工件厚度的衍射方法

    公开(公告)号:US07400417B2

    公开(公告)日:2008-07-15

    申请号:US11135469

    申请日:2005-05-23

    申请人: Scott Foes

    发明人: Scott Foes

    IPC分类号: G01B11/28

    CPC分类号: G01B11/0633

    摘要: The thickness of a workpart (10) is measured to a high degree of accuracy by passing a coherent light beam (20) through an aperture (16) in the workpart (10). The aperture (16′) can alternatively be created between an edge of the workpart (10) and an external reference plate (30). The light is diffracted on the far side of the workpart (10) and its diffraction pattern captured by a CCD camera (22). The captured image is analyzed by a computer (24) which compares the captured diffraction pattern to a stored referenced value to determine whether the thickness of the workpart (10) is within an acceptable range. The method is capable of returning measurements with micron or submicron resolution, and is a robust process readily adaptable to high volume production quality control applications.

    摘要翻译: 通过使相干光束(20)穿过工件(10)中的孔(16),高精度地测量工件(10)的厚度。 可选择地,在工件(10)的边缘和外部参考板(30)之间形成孔(16')。 光在工件(10)的远侧衍射,其衍射图由CCD照相机(22)捕获。 通过计算机(24)对拍摄图像进行分析,计算机将捕获的衍射图与​​存储的参考值进行比较,以确定工件(10)的厚度是否在可接受的范围内。 该方法能够以微米或亚微米分辨率返回测量值,并且是一种易于适应大批量生产质量控制应用的鲁棒过程。

    Diffraction method for measuring thickness of a workpart
    4.
    发明申请
    Diffraction method for measuring thickness of a workpart 有权
    用于测量工件厚度的衍射方法

    公开(公告)号:US20060262327A1

    公开(公告)日:2006-11-23

    申请号:US11135469

    申请日:2005-05-23

    申请人: Scott Foes

    发明人: Scott Foes

    IPC分类号: G01B11/06

    CPC分类号: G01B11/0633

    摘要: The thickness of a workpart (10) is measured to a high degree of accuracy by passing a coherent light beam (20) through an aperture (16) in the workpart (10). The aperture (16′) can alternatively be created between an edge of the workpart (10) and an external reference plate (30). The light is diffracted on the far side of the workpart (10) and its diffraction pattern captured by a CCD camera (22). The captured image is analyzed by a computer (24) which compares the captured diffraction pattern to a stored referenced value to determine whether the thickness of the workpart (10) is within an acceptable range. The method is capable of returning measurements with micron or submicron resolution, and is a robust process readily adaptable to high volume production quality control applications.

    摘要翻译: 通过使相干光束(20)穿过工件(10)中的孔(16),高精度地测量工件(10)的厚度。 可选择地,在工件(10)的边缘和外部参考板(30)之间形成孔(16')。 光在工件(10)的远侧衍射,其衍射图由CCD照相机(22)捕获。 通过计算机(24)对拍摄图像进行分析,计算机将捕获的衍射图与​​存储的参考值进行比较,以确定工件(10)的厚度是否在可接受的范围内。 该方法能够以微米或亚微米分辨率返回测量值,并且是一种易于适应大批量生产质量控制应用的鲁棒过程。