公开(公告)号：US20240192443A1

公开(公告)日：2024-06-13

申请号：US18556103

申请日：2022-04-29

申请人： Sentea NV

发明人： Ronny BOCKSTAELE ,  Karsten VERHAEGEN ,  Thijs SPUESENS

IPC分类号： G02B6/126 ,  G02B6/12 ,  G02B6/35 ,  G02B27/10 ,  G02B27/28

CPC分类号： G02B6/126 ,  G02B6/3548 ,  G02B27/1006 ,  G02B27/283 ,  G02B2006/12085 ,  G02B2006/12104 ,  G02B2006/12116 ,  G02B2006/12145 ,  G02B2006/12147 ,  G02B2006/1215

摘要： Provided herein is a depolarizer circuit having an input waveguide configured to receive light from a light source; a splitter configured to provide light from the input waveguide in a first and second polarization states; a first rotator configured to rotate the light from the first polarization state to the second polarization state; a first delay line configured to delay the light in the second polarization state; a coupler configured to couple the rotated and delayed light; a second rotator configured to rotate the coupled light back to the first polarization state; a second delay line configured to delay the coupled light in the second polarization state; and a combiner configured to combine light from second rotator and delay line as depolarized light, where the first and second delay lines provide a phase delay difference therebetween greater than or equal to a coherence of the light source.

公开(公告)号：US20240184067A1

公开(公告)日：2024-06-06

申请号：US18556117

申请日：2022-04-29

申请人： Sentea NV

发明人： Ronny BOCKSTAELE ,  Karsten VERHAEGEN ,  Thijs SPUESENS

IPC分类号： G02B6/42

CPC分类号： G02B6/428 ,  G02B6/424 ,  G02B6/4271 ,  G02B6/4272

摘要： Provided herein is an optoelectronic device having a printed circuit board (PCB) with a planar PCB surface; a photonic integrated circuit (PIC) with a fiber attach region for attachment to a fiber array (FA) and an electronic interface for connecting to the PCB. The PIC is mounted on a portion of the PCB surface being an integral part of the PCB surface. The PCB has an opening preferably circumferentially surrounded by portions of the PCB and dividing the PCB surface in a first and second region for thermally insulating the first region and the second region from one another. The portion of the PCB surface on which the PIC is mounted belongs to the first region, and the connecting of the electronic interface to the PCB relates to at least one wire bond extending to the second region, preferably in the optoelectronic device.