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公开(公告)号:US07557051B2
公开(公告)日:2009-07-07
申请号:US11078907
申请日:2005-03-11
申请人: WonHyoung Ryu , Seoung Jai Bai , Kyle Hammerick , Robert Lane Smith , Ralph S. Greco , Friedrich B. Prinz , Rainer J. Fasching
发明人: WonHyoung Ryu , Seoung Jai Bai , Kyle Hammerick , Robert Lane Smith , Ralph S. Greco , Friedrich B. Prinz , Rainer J. Fasching
CPC分类号: B29C43/021 , B01L3/5027 , B01L3/5085 , B29C33/0033 , B29C33/424 , B29C43/003 , B29C59/02 , B29C59/022 , B29C59/04 , B29C2043/025 , B29C2043/463 , B29C2043/5883 , B29C2059/023 , B29L2031/7532
摘要: Methods for compression molding through holes in polymer layers are provided, as are the resulting patterned polymer layers. Two key aspects of the invention are provision of a mold and substrate having different mechanical hardness, and provision of room for local flow of material. These aspects of the invention facilitate formation of through holes by compression molding that are not blocked or partially blocked by undesirable material. These polymer layers can be formed into three dimensional patterned structures by bonding patterned layers together. Since the layers include through holes, a three-dimensional polymer pattern can be formed. These patterned polymer layers and three dimensionally patterned polymer constructs have a wide variety of applications. For example, these constructs can be used for fabrication of micro-fluidic devices, and/or can be used for various medical and biological applications including drug delivery devices and tissue engineering devices.
摘要翻译: 提供了聚合物层中的孔的压缩模塑方法,以及所形成的图案化聚合物层。 本发明的两个关键方面是提供具有不同机械硬度的模具和基材,并提供用于局部流动材料的空间。 本发明的这些方面有助于通过压缩成型形成未被不期望的材料阻挡或部分阻挡的通孔。 这些聚合物层可以通过将图案化层结合在一起而形成三维图案化结构。 由于层包括通孔,因此可以形成三维聚合物图案。 这些图案化的聚合物层和三维图案化的聚合物构造物具有广泛的应用。 例如,这些构建体可用于制造微流体装置,和/或可用于各种医疗和生物应用,包括药物递送装置和组织工程装置。