摘要:
A chemical amplified photoresist composition comprising a photosensitive polymer containing the following structure unit of formula (II): Wherein R is hydrogen or C1-C4 alkyl group; R′ is C1-C4 alkyl group; n is an integer of 2, 3, 4, 5 or 6. This chemical amplified photoresist composition can be applied to general lithography processes, especially in 193 nm lithography and the patterns formed from the photoresist exhibit excellent resolution and photosensitivity.
摘要:
A positive photoresist composition comprising a polymer, a photoactived agent and an dissolution inhibitor represented by the following formula (1): wherein R1 and R2 each independently is a hydroxyl group, a C1-8 hydroxyalkyl group, or a C3-8 hydroxycycloalkyl group; R3, R4 and R5 each independently is a hydrogen, a C1-8 hydroxyalkyl group, a C1-6 carboxylic acid or a C3-8 carboxylic acid ester; k is an integer of 0, 1, 2, 3, 4, 5 or 6. The photoresist composition has high transparency to deep UV light and is capable of forming good fine patterns, roughness and high sensitivity, thus being useful as a chemically amplified type resist when exposed to deep UV light from an KrF and ArF excimer laser.
摘要翻译:一种正型光致抗蚀剂组合物,其包含聚合物,光活化剂和由下式(1)表示的溶解抑制剂:其中R1和R2各自独立地为羟基,C1-8羟基烷基或C3-8羟基环烷基; R 3,R 4和R 5各自独立地为氢,C 1-8羟基烷基,C 1-6羧酸或C 3-8羧酸酯; k为0,1,2,3,4,5或6的整数。光致抗蚀剂组合物对深紫外光具有高透明度,并且能够形成良好的精细图案,粗糙度和高灵敏度,因此可用作化学放大 当暴露于来自KrF和ArF准分子激光器的深紫外光下时,抗蚀剂。
摘要:
An alicyclic compound of the formula (1) is disclosed: wherein R1 and R2 each independently is a hydroxyl group, a C1-8 hydroxyalkyl group, or a C3-8 hydroxycycloalkyl group; R3, R4 and R5 each independently is a hydrogen, a C1-8 hydroxyalkyl group, a C1-6 carboxylic acid or a C3-8 carboxylic acid ester; k is an integer of 0, 1, 2, 3, 4, 5 or 6. The compound of the formula (1) can be applied to dissolution inhibitors for preparing positive photoresist composition.
摘要翻译:公开了式(1)的脂环族化合物:其中R1和R2各自独立地是羟基,C1-8羟基烷基或C3-8羟基环烷基; R 3,R 4和R 5各自独立地为氢,C 1-8羟基烷基,C 1-6羧酸或C 3-8羧酸酯; k是0,1,2,3,4,5或6的整数。式(1)的化合物可以用于制备正性光致抗蚀剂组合物的溶解抑制剂。
摘要:
A positive photoresist composition comprising a polymer, a photoactived agent and an dissolution inhibitor represented by the following formula (1): wherein R1, R2, R3, R4, R5 and k are defined in the specification. The photoresist composition of the present invention is useful as a chemically amplified type resist when exposed to deep UV light from a KrF and ArF excimer laser.
摘要:
The present invention provides a photosensitive polymer containing the following structure unit of formula (II): Wherein R is hydrogen or C1-C4 alkyl group; R′ is C1-C4 alkyl group; n is an integer of 2, 3, 4, 5 or 6. This photosensitive polymer also relates to chemical amplified photoresist composition. This chemical amplified photoresist composition can be applied to general lithography processes, especially in 193 nm lithography and the patterns formed from the photoresist composition exhibit excellent resolution and photosensitivity.
摘要:
This invention provides a compound of the formula (I): wherein R is hydrogen or C1-C4 alkyl group; R′ is C1-C4 alkyl group; n is an integer of 2, 3, 4, 5 or 6. The compound of formula (I) can be polymerized or copolymerized to form a photosensitive polymer or copolymer.