公开(公告)号：US07072016B2

公开(公告)日：2006-07-04

申请号：US10817581

申请日：2004-04-02

申请人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

发明人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

IPC分类号： G02F1/1337

CPC分类号： G02F1/133784

摘要： The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a conditioning roller, in addition to the rubbing roller, to rejuvenate the rubbing roller in real time so as to lengthen the roller lifetime in the rubbing process and increase the rubbing rate. By employing the conditioning roller along with the rubbing roller, the rubbing process includes an extra conditioning step for conditioning the rubbing roller, thus shortening the production cycle time and increasing the throughput.

摘要翻译： 本发明提供一种用于摩擦LCD基板中的取向层的装置和方法。 本发明的摩擦装置还包括除了摩擦辊之外的调节辊，以实时地使摩擦辊振动，从而延长摩擦过程中的辊寿命并提高摩擦速率。 通过与摩擦辊一起使用调节辊，摩擦处理包括用于调节摩擦辊的额外的调节步骤，从而缩短生产周期时间并增加生产量。

公开(公告)号：US07016000B2

公开(公告)日：2006-03-21

申请号：US11231222

申请日：2005-09-19

申请人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

发明人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

IPC分类号： G02F1/1337

CPC分类号： G02F1/133784

摘要： The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a second rolling apparatus for conditioning, in addition to the first rolling apparatus for rubbing, to rejuvenate the first rolling apparatus in real time so as to lengthen the lifetime of the rolling apparatus in the rubbing process and increase the rubbing rate. By employing the second rolling apparatus along with the first rolling apparatus, the rubbing process includes an extra conditioning step for conditioning the first rolling apparatus, thus shortening the production cycle time and increasing the throughput.

摘要翻译： 本发明提供一种用于摩擦LCD基板中的取向层的装置和方法。 本发明的摩擦装置还包括第二滚动装置，除了第一滚动滚动装置之外，还可实时振动第一滚动装置，以延长滚动装置在摩擦过程中的寿命， 提高摩擦率。 通过与第一轧制设备一起使用第二轧制设备，摩擦处理包括用于调节第一轧制设备的额外的调节步骤，从而缩短生产周期时间并增加生产量。

公开(公告)号：US07006191B2

公开(公告)日：2006-02-28

申请号：US10410807

申请日：2003-04-09

申请人： Sheng-Lung Chen ,  Da-Shuang Kuan

发明人： Sheng-Lung Chen ,  Da-Shuang Kuan

IPC分类号： G02F1/1333 ,  G02F1/13 ,  G02F1/1339

CPC分类号： G02F1/1341 ,  G02F1/136277

摘要： The present invention provides a manufacturing method for a microdisplay. After providing a wafer with a plurality of pixel structures on the front side, trenches with a pattern are formed on the backside of the wafer. A transparent plate is disposed above the front side of the wafer and a sealant is applied to join the wafer and the transparent plate. After cutting the wafer and the transparent plate into display cells of suitable sizes, liquid crystal is then introduced in-between the sealant of the display cells.

摘要翻译： 本发明提供一种微显示器的制造方法。 在前面提供具有多个像素结构的晶片之后，在晶片的背面形成具有图案的沟槽。 透明板设置在晶片的前侧上方，并施加密封剂以接合晶片和透明板。 在将晶片和透明板切割成适当尺寸的显示单元之后，将液晶引入显示单元的密封剂之间。

公开(公告)号：US20050102827A1

公开(公告)日：2005-05-19

申请号：US10718455

申请日：2003-11-19

申请人： Neng-Yu Tseng ,  Da-Shuang Kuan ,  Chia-Te Lin ,  Sheng-Lung Chen ,  Dylan Yu

发明人： Neng-Yu Tseng ,  Da-Shuang Kuan ,  Chia-Te Lin ,  Sheng-Lung Chen ,  Dylan Yu

IPC分类号： H01L23/495 ,  H05K3/36

CPC分类号： H01L27/14683 ,  Y10T29/49126 ,  Y10T29/4913

摘要： A frame attaching process is described. The frame attaching process is adapted for attaching a transparent substrate to an active area of a chip using a frame, wherein the active area of the chip has a functional area. In the frame attaching process, the frame can be formed on the attaching surface of the transparent substrate or on the active area of the chip. Then, the attaching surface of the transparent substrate is attached to the active area of the chip using the frame under a negative pressure. Finally, the frame is solidified. Therefore, in the frame attaching process, the possibility of frame cracking can be reduced and the yield of the frame attaching process can be improved.

摘要翻译： 描述框架附接过程。 框架附接工艺适于使用框架将透明衬底附接到芯片的有源区域，其中芯片的有源区域具有功能区域。 在框架固定过程中，框架可以形成在透明基板的附着表面或芯片的有效区域上。 然后，使用框架在负压下将透明基板的安装面安装在芯片的有源区域上。 最后，框架固化。 因此，在框架固定过程中，可以减少框架破裂的可能性，并且可以提高框架附接过程的收益。

公开(公告)号：US20060012740A1

公开(公告)日：2006-01-19

申请号：US11231222

申请日：2005-09-19

申请人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

发明人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

IPC分类号： G02F1/1337

CPC分类号： G02F1/133784

摘要： The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a second rolling apparatus for conditioning, in addition to the first rolling apparatus for rubbing, to rejuvenate the first rolling apparatus in real time so as to lengthen the lifetime of the rolling apparatus in the rubbing process and increase the rubbing rate. By employing the second rolling apparatus along with the first rolling apparatus, the rubbing process includes an extra conditioning step for conditioning the first rolling apparatus, thus shortening the production cycle time and increasing the throughput.

摘要翻译： 本发明提供一种用于摩擦LCD基板中的取向层的装置和方法。 本发明的摩擦装置还包括第二滚动装置，除了第一滚动滚动装置之外，还可实时振动第一滚动装置，以延长滚动装置在摩擦过程中的寿命， 提高摩擦率。 通过与第一轧制设备一起使用第二轧制设备，摩擦处理包括用于调节第一轧制设备的额外的调节步骤，从而缩短生产周期时间并增加生产量。

公开(公告)号：US06972817B2

公开(公告)日：2005-12-06

申请号：US10936923

申请日：2004-09-08

申请人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

发明人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

IPC分类号： B24B1/00 ,  B24B49/00 ,  G02F1/1337

CPC分类号： G02F1/133784

摘要： The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a second rolling apparatus for conditioning, in addition to the first rolling apparatus for rubbing, to rejuvenate the first rolling apparatus in real time so as to lengthen the lifetime of the rolling apparatus in the rubbing process and increase the rubbing rate. By employing the second rolling apparatus along with the first rolling apparatus, the rubbing process includes an extra conditioning step for conditioning the first rolling apparatus, thus shortening the production cycle time and increasing the throughput.

公开(公告)号：US20050057718A1

公开(公告)日：2005-03-17

申请号：US10956418

申请日：2004-10-01

申请人： Sheng-Lung Chen ,  Da-Shuang Kuan

发明人： Sheng-Lung Chen ,  Da-Shuang Kuan

IPC分类号： G02F1/1341 ,  G02F1/1362 ,  G02F1/1333

CPC分类号： G02F1/1341 ,  G02F1/136277

摘要： The present invention provides a manufacturing method for a microdisplay. After providing a wafer with a plurality of pixel structures on the front side, trenches with a pattern are formed on the backside of the wafer. A transparent plate is disposed above the front side of the wafer and a sealant is applied to join the wafer and the transparent plate. After cutting the wafer and the transparent plate into display cells of suitable sizes, liquid crystal is then introduced in-between the sealant of the display cells.

摘要翻译： 本发明提供一种微显示器的制造方法。 在前面提供具有多个像素结构的晶片之后，在晶片的背面形成具有图案的沟槽。 透明板设置在晶片的前侧上方，并施加密封剂以接合晶片和透明板。 在将晶片和透明板切割成适当尺寸的显示单元之后，将液晶引入显示单元的密封剂之间。

公开(公告)号：US6165852A

公开(公告)日：2000-12-26

申请号：US557343

申请日：2000-04-25

申请人： Sheng-Lung Chen ,  Sheng-Hsing Yang

发明人： Sheng-Lung Chen ,  Sheng-Hsing Yang

IPC分类号： H01L21/8238 ,  H01L21/8234

CPC分类号： H01L21/823857 ,  H01L21/82385

摘要： The invention describes a method of fabricating the integration of high-voltage devices and low-voltage devices. The ion implantation steps for forming the isolation doping regions and the drafting doping regions in the high-voltage device are used to form simultaneously the anti-punch-through regions in the low-voltage device. The production of the integrated circuit is then finished with other process steps.

摘要翻译： 本发明描述了一种制造高压器件和低电压器件集成的方法。 用于形成高压装置中的隔离掺杂区域和牵伸掺杂区域的离子注入步骤用于同时形成低压装置中的抗穿通区域。 然后通过其他工艺步骤完成集成电路的生产。

公开(公告)号：US20060079022A1

公开(公告)日：2006-04-13

申请号：US11280047

申请日：2005-11-15

申请人： Neng-Yu Tseng ,  Da-Shuang Kuan ,  Chia-Te Lin ,  Sheng-Lung Chen ,  Dylan Yu

发明人： Neng-Yu Tseng ,  Da-Shuang Kuan ,  Chia-Te Lin ,  Sheng-Lung Chen ,  Dylan Yu

IPC分类号： H01L21/48

CPC分类号： H01L27/14683 ,  Y10T29/49126 ,  Y10T29/4913

摘要： A frame attaching process is described. The frame attaching process is adapted for attaching a transparent substrate to an active area of a chip using a frame, wherein the active area of the chip has a functional area. In the frame attaching process, the frame can be formed on the attaching surface of the transparent substrate or on the active area of the chip. Then, the attaching surface of the transparent substrate is attached to the active area of the chip using the frame under a negative pressure. Finally, the frame is solidified. Therefore, in the frame attaching process, the possibility of frame cracking can be reduced and the yield of the frame attaching process can be improved.

摘要翻译： 描述框架附接过程。 框架附接工艺适于使用框架将透明衬底附接到芯片的有源区域，其中芯片的有源区域具有功能区域。 在框架固定过程中，框架可以形成在透明基板的附着表面或芯片的有效区域上。 然后，使用框架在负压下将透明基板的安装面安装在芯片的有源区域上。 最后，框架固化。 因此，在框架固定过程中，可以减少框架破裂的可能性，并且可以提高框架附接过程的收益。

公开(公告)号：US20050030457A1

公开(公告)日：2005-02-10

申请号：US10936923

申请日：2004-09-08

申请人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

发明人： Da-Shuang Kuan ,  Yi-Cheng Lan ,  Sheng-Lung Chen

IPC分类号： B24B1/00 ,  B24B49/00 ,  G02F1/1337

CPC分类号： G02F1/133784

摘要： The invention provides an apparatus and a method for rubbing the alignment layer in the LCD substrate. The rubbing apparatus of the present invention further includes a second rolling apparatus for conditioning, in addition to the first rolling apparatus for rubbing, to rejuvenate the first rolling apparatus in real time so as to lengthen the lifetime of the rolling apparatus in the rubbing process and increase the rubbing rate. By employing the second rolling apparatus along with the first rolling apparatus, the rubbing process includes an extra conditioning step for conditioning the first rolling apparatus, thus shortening the production cycle time and increasing the throughput.

摘要翻译： 本发明提供一种用于摩擦LCD基板中的取向层的装置和方法。 本发明的摩擦装置还包括第二滚动装置，除了第一滚动滚动装置之外，还可实时振动第一滚动装置，以延长滚动装置在摩擦过程中的寿命， 提高摩擦率。 通过与第一轧制设备一起使用第二轧制设备，摩擦处理包括用于调节第一轧制设备的额外的调节步骤，从而缩短生产周期时间并增加生产量。