摘要:
An embodiment of the invention relates to an epoxy resin composition for fiber reinforced composite material having an epoxy resin that is liquid at room temperature (component 1), aromatic polyamine that is liquid at room temperature (component 2) and diaminodiphenylsulfone (component 3). The proportion of component (1) relative to the entire epoxy resin in the composition is 60-100 wt %. The sum of the proportions of components (2) and (3) relative to the entire polyamine in the composition is 70-100 wt %. The proportion of component (3) relative to the entire polyamine in the composition is 25-60 wt %. The stoichiometric ratio of the entire polyamine to the entire epoxy resin in the composition is 0.7-1.3. Additional embodiments of the invention relate to other aspects of the invention.
摘要:
A liquid aliphatic polyamine material, sealed in a container, has an ammonia concentration of at most about 100 ppm, and can be made by removing volatile odor forming components from a liquid comprised of aliphatic polyamine, and enclosing it in an air-tight container, with substantially no oxygen present, whereby the odor of the liquid aliphatic polyamine is reduced to a very low level even after extended storage.
摘要:
An embodiment of the invention relates to an epoxy resin composition for fiber reinforced composite material having an epoxy resin that is liquid at room temperature (component 1), aromatic polyamine that is liquid at room temperature (component 2) and diaminodiphenylsulfone (component 3). The proportion of component (1) relative to the entire epoxy resin in the composition is 60-100 wt %. The sum of the proportions of components (2) and (3) relative to the entire polyamine in the composition is 70-100 wt %. The proportion of component (3) relative to the entire polyamine in the composition is 25-60 wt %. The stoichiometric ratio of the entire polyamine to the entire epoxy resin in the composition is 0.7-1.3. Additional embodiments of the invention relate to other aspects of the invention.
摘要:
Disclosed is a microcapsule-type curing agent comprising (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin dissolvable to the thermosetting resin by heating. The microcapsule-type curing agent is formed as a particle-like material in which the component (A) is coated with a layer whose main constituent is the component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule-type curing agent, a thermosetting resin composition and a prepreg which are good in storage stability at a room temperature and excellent in thermal resistance of a cured product made therefrom can be obtained. Further, a fiber reinforced composite material obtained using this thermosetting resin composition is excellent in curing uniformity and thermal resistance.
摘要:
An embodiment of the invention relates to an epoxy resin composition for fiber reinforced composite material having an epoxy resin that is liquid at room temperature (component 1), aromatic polyamine that is liquid at room temperature (component 2) and diaminodiphenylsulfone (component 3). The proportion of component (1) relative to the entire epoxy resin in the composition is 60-100 wt %. The sum of the proportions of components (2) and (3) relative to the entire polyamine in the composition is 70-100 wt %. The proportion of component (3) relative to the entire polyamine in the composition is 25-60 wt %. The stoichiometric ratio of the entire polyamine to the entire epoxy resin in the composition is 0.7-1.3. Additional embodiments of the invention relate to other aspects of the invention.
摘要:
The present invention relates: to an epoxy resin composition comprising at least (A) an epoxy resin having a cycloalkane ring or cyclohexene ring but having neither aromatic ring nor aminic nitrogen atom, (B) a carboxylic anhydride having no aromatic ring, and (C) an ultraviolet absorbent, wherein a content of component (A) is from 70 to 100 percents by weight based on the total weight of epoxy resins, and a content of component (B) is from 70 to 100 percents by weight based on the total weight of carboxylic anhydrides. By this constitution, the present invention can provide an epoxy resin composition whose cured product excels in mechanical properties and weatherability, and a fiber reinforced composite material having excellent mechanical properties and weatherability.
摘要:
The present invention relates to an epoxy resin composition comprising at least (A) an epoxy resin having a cycloalkane ring or cyclohexene ring but having neither aromatic ring nor aminic nitrogen atom, (B) a carboxylic anhydride having no aromatic ring, and (C) an ultraviolet absorbent, wherein a content of component (A) is from 70 to 100 percents by weight based on the total weight of epoxy resins, and a content of component (B) is from 70 to 100 percents by weight based on the total weight of carboxylic anhydrides. By this constitution, the present invention can provide an epoxy resin composition whose cured product excels in mechanical properties and weatherability, and a fiber reinforced composite material having excellent mechanical properties and weatherability.
摘要:
An epoxy resin composition having a low viscosity around a room temperature and excellent reinforcing fiber impregnating properties provides a composite material having excellent heat resistance and mechanical properties including compressive strength. The epoxy resin composition includes an aromatic epoxy resin having at least di-functionality, an aromatic amine compound and/or an alicyclic amine compound, wherein 5 minutes after the main agent comprising the epoxy resin and the curing agent comprising the aromatic amine compound and/or the alicyclic amine compound are mixed, the composition shows a viscosity at 25° C. in the range of from 1 to 1500 mPa sec, and Tc, tc, and Tg satisfy the following equation (1): Tg≧Tc+20−k×(Tc−90) (1), wherein k=0 when 60≦Tc
摘要:
Disclosed is a microcapsule curing agent including (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin. The microcapsule curing agent is formed as a particle-like material in which component (A) is coated with a layer whose main constituent is component (B) and the mean particle diameter of which is in the range of 0.1 to 20 .mu.m. By using the microcapsule curing agent, a thermosetting resin composition and a prepreg which exhibit good storage stability at room temperature and are excellent in thermal resistance for cured products made therefrom can be obtained. A fiber reinforced composite material obtained using the thermosetting resin composition is excellent in curing uniformity and thermal resistance.