-
公开(公告)号：US09490180B2
公开(公告)日：2016-11-08
申请号：US14344191
申请日：2012-08-30
申请人： Shinya Kanno
发明人： Shinya Kanno
IPC分类号： G01B11/28 , H01L21/66 , B24B37/013 , B24B37/08 , B24B49/12 , B24B7/17 , G01B11/06 , B24B37/28
CPC分类号： H01L22/12 , B24B7/17 , B24B37/013 , B24B37/08 , B24B37/28 , B24B49/12 , G01B11/0608 , H01L22/20
摘要： The invention provides a method for processing a wafer by inserting the wafer into a holding hole of a carrier to hold the wafer, and interposing the carrier holding the wafer between an upper turn table and a lower turn table to process both surfaces of the wafer simultaneously, including: before processing the wafer, detecting a height position of the upper turn table by a laser displacement sensor while interposing the carrier holding the wafer between the upper turn table and the lower turn table; and determining that the wafer is not normally held to redo the holding of the wafer if a difference between the detected height position and a reference position exceeds a threshold. The method can automatically detect accurately a failure in holding the wafer before processing to prevent the wafer from breaking and eliminate the necessity of operator's inspection using touch to improve operation efficiency.
摘要翻译： 本发明提供了一种通过将晶片插入载体的保持孔中以保持晶片来处理晶片的方法，并且将保持晶片的载体插入上转台和下转台之间以同时处理晶片的两个表面 包括：在处理晶片之前，通过激光位移传感器检测上转台的高度位置，同时将保持晶片的载体插入在上转台和下转台之间; 并且如果检测到的高度位置和参考位置之间的差异超过阈值，则确定晶片通常不被保持以重新进行晶片的保持。 该方法能够准确地检测在处理之前保持晶片的故障，以防止晶片破裂，并且消除操作者使用触摸检查以提高操作效率的必要性。
-
公开(公告)号：US08120731B2
公开(公告)日：2012-02-21
申请号：US11900602
申请日：2007-09-11
IPC分类号： G02F1/1335 , G02F1/1333
CPC分类号： G02B5/201 , Y10T428/24174
摘要： An article having a color pattern formed therein comprises a substrate, banks on the substrate, and a colored layer provided between the banks. The colored layer has a thickness of 80-120% of an average thickness thereof. In addition, the banks have an ink repelling agent or the upper apex portion of the banks has ink repelling ability.
摘要翻译： 具有其中形成的彩色图案的制品包括基板，基板上的堤，以及设置在堤之间的着色层。 着色层的厚度为其平均厚度的80-120％。 此外，银行具有防墨剂或银行的上顶部具有防墨水能力。
-
公开(公告)号：US20090068396A1
公开(公告)日：2009-03-12
申请号：US11900602
申请日：2007-09-11
IPC分类号： B32B7/00
CPC分类号： G02B5/201 , Y10T428/24174
摘要： An article having a color pattern formed therein comprises a substrate, banks on the substrate, and a colored layer provided between the banks. The colored layer has a thickness of 80-120% of an average thickness thereof. In addition, the banks have an ink repelling agent or the upper apex portion of the banks has ink repelling ability.
摘要翻译： 具有其中形成的彩色图案的制品包括基板，基板上的堤，以及设置在堤之间的着色层。 着色层的厚度为其平均厚度的80-120％。 此外，银行具有防墨剂或银行的上顶部具有防墨水能力。
-
公开(公告)号：US20140320867A1
公开(公告)日：2014-10-30
申请号：US14344191
申请日：2012-08-30
申请人： Shinya Kanno
发明人： Shinya Kanno
CPC分类号： H01L22/12 , B24B7/17 , B24B37/013 , B24B37/08 , B24B37/28 , B24B49/12 , G01B11/0608 , H01L22/20
摘要： The invention provides a method for processing a wafer by inserting the wafer into a holding hole of a carrier to hold the wafer, and interposing the carrier holding the wafer between an upper turn table and a lower turn table to process both surfaces of the wafer simultaneously, including: before processing the wafer, detecting a height position of the upper turn table by a laser displacement sensor while interposing the carrier holding the wafer between the upper turn table and the lower turn table; and determining that the wafer is not normally held to redo the holding of the wafer if a difference between the detected height position and a reference position exceeds a threshold. The method can automatically detect accurately a failure in holding the wafer before processing to prevent the wafer from breaking and eliminate the necessity of operator's inspection using touch to improve operation efficiency.
摘要翻译： 本发明提供了一种通过将晶片插入载体的保持孔中以保持晶片来处理晶片的方法，并且将保持晶片的载体插入上转台和下转台之间以同时处理晶片的两个表面 包括：在处理晶片之前，通过激光位移传感器检测上转台的高度位置，同时将保持晶片的载体插入在上转台和下转台之间; 并且如果检测到的高度位置和参考位置之间的差异超过阈值，则确定晶片通常不被保持以重新进行晶片的保持。 该方法能够准确地检测在处理之前保持晶片的故障，以防止晶片破裂，并且消除操作者使用触摸检查以提高操作效率的必要性。
-
-
-
搜索结果
4 条记录 (耗时 0.011 秒)
