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公开(公告)号:US5027505A
公开(公告)日:1991-07-02
申请号:US488129
申请日:1990-03-05
IPC分类号: G09F3/00 , H01L25/075 , H05K1/02 , H05K3/00
CPC分类号: H05K1/0266 , G09F3/00 , H01L25/0753 , H05K3/0052 , H01L2924/0002 , H05K2201/09063 , H05K2201/0909 , H05K2201/09927 , H05K2201/10106 , H05K2203/1545 , Y10T29/4913 , Y10T29/49789 , Y10T29/49819 , Y10T29/53261
摘要: The present invention provides a method of producing electronic components such as LED displays and hybrid IC's from a broad supply frame. The frame comprises a parallel pair of elongate side bands, and a plurality of unit circuit boards integrally incorporated in the frame by means of connecting webs and arranged between the pair of side bands at a predetermined interval therealong. Various process steps such as chip bonding and wire bonding are performed with respect to the individual circuit boards while they are still in the frame. In a final step, each unit circuit board or electronic component is separated from the frame. The frame may be provided with an identification pattern to identify the type of unit circuit boards incorporated in the frame.
摘要翻译: 本发明提供从广泛供应框架制造诸如LED显示器和混合IC的电子部件的方法。 该框架包括平行的一对细长边带,以及多个单元电路板,其通过连接腹板一体地结合在框架中,并且以一定间隔在该对边带之间布置。 当各个电路板仍在框架中时,执行诸如芯片接合和引线键合的各种工艺步骤。 在最后一步中,每个单元电路板或电子部件与框架分离。 该框架可以设置有识别图案,以识别结合在框架中的单元电路板的类型。