公开(公告)号：US06241942B1

公开(公告)日：2001-06-05

申请号：US09050078

申请日：1998-03-30

申请人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

发明人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

IPC分类号： C22C1302

CPC分类号： B23K35/262

摘要： A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.

摘要翻译： 具有相对低的熔融温度并适合用于焊接电子器件的无铅焊料合金基本上由以下组成：7至10重量％的Zn; 0.01〜1重量％的Ni，0.1〜3.5重量％的Ag和0.1〜3重量％的Cu中的至少1种; 可选地，0.2至6重量％的Bi，0.5至3重量％的In和0.001至1重量％的P中的至少一个; 和Sn的平衡。 另一种这样的无铅焊料合金主要由以下组成：2至10重量％的Zn; Bi的10〜30重量％ 0.05〜2重量％的Ag; 任选地0.001至1重量％的P，余量为Sn。 这些焊料合金具有至少5kgf / mm 2的拉伸强度和至少10％的伸长率。

公开(公告)号：US06488888B2

公开(公告)日：2002-12-03

申请号：US09828164

申请日：2001-04-09

申请人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

发明人： Toshikazu Murata ,  Hiroji Noguchi ,  Sadao Kishida ,  Toshihiko Taguchi ,  Shozo Asano ,  Ryo Oishi ,  Takashi Hori

IPC分类号： C22C1302

CPC分类号： B23K35/262

摘要： A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.

摘要翻译： 具有相对低的熔融温度并适合用于焊接电子器件的无铅焊料合金基本上由以下组成：7至10重量％的Zn; 0.01〜1重量％的Ni，0.1〜3.5重量％的Ag和0.1〜3重量％的Cu中的至少1种; 可选地，0.2至6重量％的Bi，0.5至3重量％的In和0.001至1重量％的P中的至少一个; 和Sn的平衡。 另一种这样的无铅焊料合金主要由以下组成：2至10重量％的Zn; Bi的10〜30重量％ 0.05〜2重量％的Ag; 任选地0.001至1重量％的P，余量为Sn。 这些焊料合金具有至少5kgf / mm 2的拉伸强度和至少10％的伸长率。

公开(公告)号：US4988395A

公开(公告)日：1991-01-29

申请号：US472522

申请日：1990-01-30

申请人： Toshihiko Taguchi ,  Shozo Asano ,  Ken'ichi Osawa ,  Hiroo Nagai ,  Hisao Ikeda

发明人： Toshihiko Taguchi ,  Shozo Asano ,  Ken'ichi Osawa ,  Hiroo Nagai ,  Hisao Ikeda

IPC分类号： B23K35/36

CPC分类号： B23K35/3612 ,  B23K35/36

摘要： A water-soluble soldering flux and paste solder using the flux are disclosed, the flux comprising, as a main fluxing agent, a resinous reaction product of at least one carboxyl-containing compound having 8 or less carbon atoms, selected from the group consisting of monocarboxylic acids, polycarboxylic acids, and hydroxy-carboxylic acids with tris-(2,3-epoxypropyl)-isocyanurate.