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公开(公告)号：US12103115B2
公开(公告)日：2024-10-01
申请号：US17268683
申请日：2019-08-20
发明人： Wataru Masuda , Daigo Kiga , Aoi Tazuru , Satoshi Moriya
IPC分类号： B23K35/28 , B23K35/02 , B23K35/36 , B23K35/362 , B23K103/10 , C22C21/00 , C22C21/02
CPC分类号： B23K35/286 , B23K35/0244 , B23K35/36 , B23K35/3601 , B23K35/3613 , B23K35/3616 , B23K35/362 , C22C21/00 , C22C21/02 , B23K2103/10
摘要： A brazing material for brazing aluminum or an aluminum alloy includes fluoride-based flux, a solidifying agent, and an organic viscosity reducing agent and is solid at 25° C.
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公开(公告)号：US11897063B2
公开(公告)日：2024-02-13
申请号：US17158885
申请日：2021-01-26
申请人： Hobart Brothers LLC
发明人： Mario Anthony Amata , Joseph C. Bundy , Steven Edward Barhorst , Susan Renata Fiore , Daryl L. Duncan
IPC分类号： B23K9/16 , B23K35/02 , B23K35/30 , B23K9/24 , B23K35/40 , B23K35/36 , B23K35/368 , B23K9/173 , B23K101/10 , B23K101/06 , B23K103/04
CPC分类号： B23K9/164 , B23K9/173 , B23K9/24 , B23K35/0244 , B23K35/0261 , B23K35/0266 , B23K35/3073 , B23K35/36 , B23K35/3607 , B23K35/368 , B23K35/3608 , B23K35/406 , B23K2101/06 , B23K2101/10 , B23K2103/04 , Y10T29/49117
摘要： The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). In one embodiment, a tubular welding wire includes a sheath and a core. The tubular welding wire is configured to form a weld deposit on a structural steel workpiece, wherein the weld deposit includes less than approximately 2.5% manganese by weight.
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公开(公告)号：US20190047081A1
公开(公告)日：2019-02-14
申请号：US16075260
申请日：2016-12-13
发明人： Nao Kamakura , Yuki Sugo , Satoshi Honda
CPC分类号： B23K20/16 , B22F3/14 , B22F7/08 , B22F2201/01 , B22F2201/02 , B22F2201/20 , B22F2999/00 , B23K20/026 , B23K35/0222 , B23K35/0238 , B23K35/0244 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , B23K35/38 , B23K2101/36 , B23K2101/40 , B23K2103/56 , B32B5/16 , B32B15/00 , B32B37/04 , B32B37/06 , B32B37/1009 , B32B37/24 , B32B2305/342 , B32B2305/80 , B32B2309/022 , B32B2309/125 , B32B2309/68 , B32B2311/04 , B32B2311/08 , B32B2311/12 , B32B2311/22 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/27436 , H01L2224/29294 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/32225 , H01L2224/32227 , H01L2224/83065 , H01L2224/83075 , H01L2224/8309 , H01L2224/83191 , H01L2224/83204 , H01L2224/8384 , H01L2224/94 , H01L2224/97 , H01L2224/83 , H01L2224/27
摘要： Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.
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公开(公告)号：US10081852B2
公开(公告)日：2018-09-25
申请号：US12923319
申请日：2010-09-14
申请人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
发明人： Naohiko Hirano , Akira Tanahashi , Yoshitsugu Sakamoto , Kaichi Tsuruta , Takashi Ishii , Satoshi Soga
CPC分类号： C22C13/00 , B22F1/025 , B23K35/0244 , B23K35/262 , B23K35/3033 , B23K35/36
摘要： A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.
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公开(公告)号：US09956649B2
公开(公告)日：2018-05-01
申请号：US14442597
申请日：2014-08-28
发明人： Kazuki Ikeda , Kosuke Inoue , Kazuya Ichikawa , Tadashi Takemoto
IPC分类号： C22C13/02 , B23K35/26 , C22C13/00 , B23K35/02 , B23K35/22 , B23K35/36 , H05K3/34 , B23K35/362 , B23K101/36 , B23K101/42
CPC分类号： B23K35/262 , B23K35/0205 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/36 , B23K35/3606 , B23K35/3612 , B23K35/3613 , B23K35/3616 , B23K35/3618 , B23K35/362 , B23K2101/36 , B23K2101/42 , C22C13/00 , C22C13/02 , H05K3/3457 , H05K3/3484
摘要： A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass % or more and 4 mass % or less; the content ratio of the indium is 6.2 mass % or more and 9.0 mass % or less; the content ratio of the bismuth is 0.7 mass % or more and 5.0 mass % or less; the content ratio of the antimony is 0.3 mass % or more and 5.0 mass % or less; and the content ratio of the tin is the remaining ratio and the value of A is 4.36 or less wherein A=0.87×[In content ratio (mass %)]−0.41×[Ag content ratio (mass %)]−0.82×[Sb content ratio (mass %)].
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公开(公告)号：US20180005975A1
公开(公告)日：2018-01-04
申请号：US15705311
申请日：2017-09-15
IPC分类号： H01L23/00
CPC分类号： H01L24/81 , B23K1/0016 , B23K1/203 , B23K35/262 , B23K35/36 , B23K35/3618 , B23K35/362 , B23K2101/42 , C21D9/50 , C23G1/00 , C23G5/00 , H01L2224/1145 , H01L2224/1146 , H01L2224/13111 , H01L2224/16227 , H01L2224/81011 , H01L2224/81024 , H01L2224/81815 , H01L2224/8191 , H01L2224/81911 , H01L2224/81948 , H01L2924/014 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/00014
摘要： An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.
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公开(公告)号：US20180001426A1
公开(公告)日：2018-01-04
申请号：US15613895
申请日：2017-06-05
发明人： Masayuki SUZUKI , Naoko IZUMITA , Shunsaku YOSHIKAWA , Ken TACHIBANA , Rei FUJIMAKI , Hikaru NOMURA
CPC分类号： B23K35/025 , B23K35/0222 , B23K35/0244 , B23K35/26 , B23K35/262 , B23K35/36 , C22C13/00 , C22C13/02 , H05K3/3463 , H05K2201/10636 , Y02P70/611 , Y10T403/479
摘要： Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.
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公开(公告)号：US09849534B2
公开(公告)日：2017-12-26
申请号：US14387061
申请日：2013-03-27
发明人： Per Sjödin , Kristian Walter
IPC分类号： B23K35/24 , B23K1/20 , B23K35/02 , B23K35/36 , B23K35/365 , B23K35/00 , C22C19/00 , C22C1/02 , B23K1/00 , B23K35/34 , B23K35/362 , C23C30/00 , B21D53/04 , F28D9/00 , B32B15/01 , C23C24/10 , B23K20/00 , B23K20/24 , F28F3/04 , F28F21/08 , B23K101/00
CPC分类号： B23K1/20 , B21D53/04 , B23K1/00 , B23K1/0008 , B23K1/0012 , B23K1/203 , B23K20/002 , B23K20/24 , B23K35/00 , B23K35/001 , B23K35/004 , B23K35/007 , B23K35/02 , B23K35/0244 , B23K35/025 , B23K35/24 , B23K35/34 , B23K35/36 , B23K35/3613 , B23K35/362 , B23K35/365 , B23K2101/00 , B32B15/01 , C22C1/02 , C22C19/00 , C23C24/10 , C23C30/00 , C23C30/005 , F28D9/0012 , F28D9/0062 , F28F3/042 , F28F21/083 , F28F21/089 , Y10T29/49366 , Y10T403/479 , Y10T428/12778 , Y10T428/12986 , Y10T428/25 , Y10T428/259 , Y10T428/266 , Y10T428/273 , Y10T428/2924 , Y10T428/2982
摘要： The present invention relates to a blend of at least one boron source and at least one silicon source, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 5:100 to about 2:1, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of powders, and wherein particles in the powders have an average particle size less than 250 μm. The present invention relates further to a composition comprising the blend a substrate applied with the blend, a method for providing a brazed product, and uses.
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公开(公告)号：US09757818B2
公开(公告)日：2017-09-12
申请号：US15298824
申请日：2016-10-20
申请人： PROMERUS, LLC
发明人： W. C. Peter Tsang , Andrew Bell , Hongshi Zhen , Keitaro Seto
CPC分类号： B23K35/3618 , B23K35/0244 , B23K35/025 , B23K35/0255 , B23K35/36 , B23K35/3612 , B23K35/3613 , B81C1/00301 , B81C1/00317 , B81C2201/019 , C09D167/02 , H05K3/3489 , H05K2203/0485
摘要： A thermally decomposable polymer composition comprising a polyester of a dicarboxylic acid and a tertiary cyclohexanediols of Formulae V and VI are disclosed, which are useful in the forming of microelectronic assemblies: a representative example of a dicarboxylic acid is an oxalic acid and representative example of thermally decomposable polyester is the polyester of the formula: wherein m is at least about 100.
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公开(公告)号：US20170243852A1
公开(公告)日：2017-08-24
申请号：US15052461
申请日：2016-02-24
IPC分类号： H01L23/00
CPC分类号： H01L24/81 , B23K1/0016 , B23K1/203 , B23K35/36 , B23K2101/42 , H01L2224/1145 , H01L2224/1146 , H01L2224/13111 , H01L2224/16227 , H01L2224/81011 , H01L2224/81024 , H01L2224/81815 , H01L2224/8191 , H01L2224/81911 , H01L2224/81948 , H01L2924/014 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/00014
摘要： An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.
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