公开(公告)号：US20050213949A1

公开(公告)日：2005-09-29

申请号：US11132539

申请日：2005-05-19

Applicant: Zion Koren ,  Conor O'Carroll ,  Shuen Choy ,  Paul Timans ,  Rudy Cardema ,  James Taoka ,  Arieh Strod

Inventor： Zion Koren ,  Conor O'Carroll ,  Shuen Choy ,  Paul Timans ,  Rudy Cardema ,  James Taoka ,  Arieh Strod

IPC: C23C16/48 ,  C30B25/10 ,  C30B31/12 ,  H01L21/00 ,  A21B2/00 ,  F26B19/00

CPC classification number: H01L21/67115 ,  C23C16/481 ,  C30B25/105 ,  C30B31/12

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

公开(公告)号：US20070297775A1

公开(公告)日：2007-12-27

申请号：US11853414

申请日：2007-09-11

Applicant: Zion Koren ,  Conor O'Carroll ,  Shuen Choy ,  Paul Timans ,  Rudy Santo Cardema ,  James Taoka ,  Arieh Strod

Inventor： Zion Koren ,  Conor O'Carroll ,  Shuen Choy ,  Paul Timans ,  Rudy Santo Cardema ,  James Taoka ,  Arieh Strod

IPC: F26B3/30

CPC classification number: H01L21/67115 ,  C23C16/481 ,  C30B25/105 ,  C30B31/12

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract translation: 公开了一种用于热处理半导体晶片的设备。 该装置包括加热装置，其包含用于将光能发射到晶片上的组装线性灯。 线性灯可以放置在各种配置中。 根据本发明，用于调节光能源的总体辐照度分布的调谐装置包括在加热装置中。 调谐装置可以是例如灯或激光器。