公开(公告)号：US06881117B2

公开(公告)日：2005-04-19

申请号：US10407252

申请日：2003-04-07

Applicant: Wen-Rung Huang ,  Cheng-Min Chen ,  Ching-Chung Cheng ,  Shun-An Lin

Inventor： Wen-Rung Huang ,  Cheng-Min Chen ,  Ching-Chung Cheng ,  Shun-An Lin

IPC: H01J9/02 ,  H01J11/12 ,  H01J11/24 ,  H01J9/00 ,  H01J9/14

CPC classification number: H01J11/12 ,  H01J9/02 ,  H01J11/24 ,  H01J2211/225

Abstract: A bus electrode of the present invention is formed by first coating a Ru-containing layer on the front plate and the transparent electrodes. Then, an Ag-containing layer is coated over the Ru-containing layer. In accordance with the present invention, the coating area of the Ru-containing layer is larger than the coating area of the Ag-containing layer to improve adhesion between the bus electrodes, glass plate and the transparent electrodes. Then, a photolithography process is performed to define the bus electrodes.

Abstract translation: 通过首先在前板和透明电极上涂覆含Ru层来形成本发明的母线电极。 然后，将含Ag层涂覆在含Ru层上。 根据本发明，含Ru层的涂层面积大于含Ag层的涂布面积，以改善总线电极，玻璃板和透明电极之间的粘合性。 然后，执行光刻处理以限定总线电极。