Abstract:
A process for reducing Ag electromigration in electronic circuitry includes the step of treating the electronic circuitry with an electromigration resistant composition. This process is useful in fabricating electronic devices having electronic circuitry that is close together, such as resistors, capacitors, and displays, e.g., a plasma display panel (PDP) or a liquid crystal display (LCD).
Abstract:
A substrate structure for a plasma display panel (PDP), a method of manufacturing a PDP substrate structure of the PDP, and a PDP including the PDP substrate are provided. The PDP substrate structure includes a substrate, an electrode on the substrate and including a first layer and a second layer, the second layer including an aluminum (Al) material, the first layer being between the substrate and the second layer and including a conductive material, the first layer having lower specific resistance than that of the second layer; and a light absorbable layer on the substrate. The light absorbable layer is an oxidization product of the conductive material of the first layer.
Abstract:
Embodiments of the present invention provide a paste for forming a PDP electrode, a method of manufacturing a PDP electrode using the paste, and a PDP including the electrode. The paste includes an aluminum solution containing aluminum particles and a surface treatment agent. The aluminum particles have an average particle size of about 5 μm or less. The surface treatment agent is configured to withstand sintering temperatures of about 550° C. or greater, and remains on the surface of the aluminum particles after sintering. The electrode manufactured from the paste has a specific resistance of about 20 μΩ·cm or less, making it suitable for use as an electrode in a PDP having a reliability of 90% or greater.
Abstract:
A plasma display panel includes a front panel wherein an electrode, a dielectric layer and a protective layer are formed on a substrate of the front panel; and a rear panel wherein an electrode, a dielectric layer and a barrier rib and a phosphor layer are formed on a substrate of the rear panel. The front panel and the rear panel are oppositely disposed to each other. The electrode of the front panel is composed of a transparent electrode and a bus electrode, and the bus electrode comprises a melted-solidified portion obtained by a melting and subsequent solidifying of electrically-conductive particles.
Abstract:
In an electronic component having a wiring and/or an electrode prepared through firing of a paste or in an electronic component having a wiring in contact with a glass or glass ceramic member, provided is an electronic component using a Cu-based wiring material which less suffers from increase in electric resistance due to oxidation, which less causes bubbles in the glass or glass ceramic, and has satisfactory migration resistance. The Cu—Al alloy powder includes a Cu—Al alloy powder including Cu and, preferably, 50 percent by weight or less of Al; and an aluminum oxide film having a thickness of 80 nm or less and being present on the surface of the Cu—Al alloy powder. The powder, when compounded with a glass or glass ceramic material to give a paste, can be used to form wiring (interconnections), electrodes, and/or contact members.
Abstract:
A plasma display panel (PDP) includes a first plate, and a second plate disposed to face the first plate via a discharge space and providing barrier ribs. A plurality of first electrodes and a plurality of second electrodes extending in a first direction, and a dielectric layer covering the first electrodes and the second electrodes are provided on the first plate. A plurality of address electrodes extending in a second direction, and a protective layer covering the dielectric layer and the address electrodes and exposing at least a part of the protective layer to the discharge space are provided on the dielectric layer. The address electrodes are made up by including a conductive layer formed by either one of aluminum and an alloy containing aluminum and copper and by not including a layer of a simple substance of copper.
Abstract:
A plasma display device and a method of manufacturing a plasma display panel (PDP) are provided. The method includes applying onto a substrate a black matrix paste for forming a black matrix and an electrode paste for forming an electrode; laminating a dielectric material on the substrate; and firing the black matrix paste, the electrode paste, and the dielectric material at the same time. Therefore, it is possible to simplify the manufacture of a PDP by firing electrodes, black matrices, and a dielectric material at the same time. In addition, it is possible to reduce the probability of the generation of air bubbles by appropriately reducing the amount of glass frit in a paste. Moreover, it is possible to enhance the efficiency of driving a PDP and the reliability of a plasma display device.
Abstract:
Disclosed herein is a composition for electrodes that enables a firing process in air at a temperature of 600° C. or less and does not cause an increase in absolute resistance and a substantial variation of the resistance even when the composition is repeatedly subjected to the firing process. The composition for electrodes comprises: about 5 to about 95% by weight of aluminum powder, the aluminum powder having a particle size distribution of about 2.0 or less as expressed by the following Equation (1) and having D50 in the range of about 0.1 μm≦D50≦about 20 μm; about 3 to about 60% by weight of an organic binder; and the balance of a solvent: Particle size distribution=(D90−D10)/D50 (1) wherein D10, D50, and D90 represent particle diameters at 10%, 50% and 90% points on an accumulation curve of a particle size distribution when the total weight is 100%. An electrode and a PDP fabricated using the composition are also disclosed.
Abstract:
An example embodiment is directed to a composition for preparation of an electrode, including: a conductive material, the conductive material including Ni, Ag, and ITO, an organic binder, a glass fit, and a black pigment.
Abstract:
The PDP has a front panel, and a back panel with address electrodes formed thereon. The front panel has display electrodes including first electrodes and second electrodes formed on front glass substrate, and a dielectric layer covering the display electrodes. Further, first electrodes and the dielectric layer include glass frit containing bismuth oxide, with a softening point exceeding 550° C. The glass frit contained in the second electrodes has a softening point lower than that contained in the first electrodes. The above-described configuration reduces the number of firing steps for display electrodes and the dielectric layer, thereby providing a PDP with improved production efficiency and a method of manufacturing the PDP.