公开(公告)号：US20150000803A1

公开(公告)日：2015-01-01

申请号：US14366921

申请日：2011-12-22

申请人： Jun-Ichi Kumagai ,  Yoshio Abe ,  Akira Saito ,  Shuzo Umezu ,  Ryo Iino

发明人： Jun-Ichi Kumagai ,  Yoshio Abe ,  Akira Saito ,  Shuzo Umezu ,  Ryo Iino

IPC分类号： C22F1/08 ,  C22C9/04 ,  C22C9/06

CPC分类号： C22F1/08 ,  C22C9/04 ,  C22C9/06 ,  H01B1/026

摘要： A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5.

摘要翻译： 本发明的Cu-Ni-Si系铜合金板在保持强度和导电性的同时具有优异的模具耐磨性和剪切加工性，其中含有1.0质量％至4.0质量％的Ni，0.2质量％至0.9质量％ 含有Si，其余部分由Cu和不可避免的杂质构成。 在表面层厚度为20nm〜80nm范围内的Ni-Si析出物颗粒的数量比表面积为整个板厚的20％以粒子数/ mm2表示， 在表面层下面的部分，粒径在20nm〜80nm范围内的Ni-Si析出物颗粒的数量由b颗粒/ mm 2表示，a / b在0.5〜1.5的范围内。

公开(公告)号：US10253405B2

公开(公告)日：2019-04-09

申请号：US14366921

申请日：2011-12-22

申请人： Jun-Ichi Kumagai ,  Yoshio Abe ,  Akira Saito ,  Shuzo Umezu ,  Ryo Iino

发明人： Jun-Ichi Kumagai ,  Yoshio Abe ,  Akira Saito ,  Shuzo Umezu ,  Ryo Iino

IPC分类号： C22C9/04 ,  C22F1/08 ,  C22C9/06 ,  H01B1/02

摘要： A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5.

公开(公告)号：US07029760B2

公开(公告)日：2006-04-18

申请号：US10617125

申请日：2003-07-10

申请人： Akihito Mori ,  Takeshi Suzuki ,  Tadao Sakakibara ,  Shuzo Umezu ,  Masahiko Ishida

发明人： Akihito Mori ,  Takeshi Suzuki ,  Tadao Sakakibara ,  Shuzo Umezu ,  Masahiko Ishida

IPC分类号： B32B15/00 ,  H01H1/02 ,  H01H1/38 ,  C25D5/50

CPC分类号： B32B15/017 ,  H01R13/03 ,  Y10S428/929 ,  Y10S428/941 ,  Y10T428/12389 ,  Y10T428/12715 ,  Y10T428/12993

摘要： A plated material reduces insertion and withdrawal forces when used in a connector. A terminal member for a connector and a connector therewith are also provided. The plated material comprises a substrate 3 made of Cu or a Cu alloy and a metal plating layer 6 formed on the surface of the substrate 3. A soft region 6A spreading in a network-shape and a hard region 6B surrounded by the network of the soft region 6A coexists in the metal plating layer 6. The soft region 6A has a Vickers hardness of 20 to 250, while the hard region 6B has a Vickers hardness of 60 to 700, which is at least 30 higher than that of the soft region 6A. An average size of the network of the soft region 6A is from 5 to 500 μm.

摘要翻译： 电镀材料在连接器中使用时可减少插拔力。 还提供了用于连接器的端子构件和连接器。 电镀材料包括由Cu或Cu合金制成的基板3和形成在基板3的表面上的金属镀层6。 由软区域6A的网络包围的网状形状的软区域6A和硬区域6B共存在金属镀层6中。 软区域6A具有20至250的维氏硬度，而硬区域6B具有60至700的维氏硬度，其比软区域6A的维氏硬度高至少30度。网络的平均尺寸 的软区域6A为5〜500μm。