公开(公告)号：US20240167447A1

公开(公告)日：2024-05-23

申请号：US18281572

申请日：2022-03-10

申请人： Akira SAITO

发明人： Akira SAITO

IPC分类号： F03B3/12

CPC分类号： F03B3/121 ,  F05B2250/25

摘要： Provided is a helically shaped wing including a column-shaped shaft portion and a blade portion disposed helically on a side surface of the shaft portion. The blade portion includes a winglet on an end portion thereof.

公开(公告)号：US20210268728A1

公开(公告)日：2021-09-02

申请号：US16805560

申请日：2020-02-28

申请人： Akira Saito ,  Koji Takimoto ,  Andrew J. Boydston ,  Chang-Uk Lee ,  Mark A. Ganter ,  Duane W. Storti

发明人： Akira Saito ,  Koji Takimoto ,  Andrew J. Boydston ,  Chang-Uk Lee ,  Mark A. Ganter ,  Duane W. Storti

IPC分类号： B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00

摘要： The present invention provides methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using 3D printing. A layer of prepolymer is deposited on a build plate to form a powder bed. Then, solutions of first and/or second binding agents are printed on the powder bed in a predetermined pattern. After a predetermined period of time, sequential layers are printed to provide the three-dimensional article. The removable binding agent is then removed. The removable binding agent may be solubilized polyetheretherketone. Examples of solubilized polyetheretherketone include, but are not limited to, sulfonated polyetheretherketone and/or nitrated polyetheretherketone. The three-dimensional object can be cured to produce the three-dimensional article composed of the final polymers.

公开(公告)号：US11066758B2

公开(公告)日：2021-07-20

申请号：US15656214

申请日：2017-07-21

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： B32B5/16 ,  D01F6/66 ,  C08J3/12 ,  B33Y70/00 ,  C08K3/04 ,  B05D3/06 ,  C08K3/16 ,  C08K3/22 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US11045978B2

公开(公告)日：2021-06-29

申请号：US16184244

申请日：2018-11-08

申请人： Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Toshiyuki Iseki ,  Mitsuru Naruse ,  Akira Saito ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Toshiyuki Iseki ,  Mitsuru Naruse ,  Akira Saito ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： B29B9/12 ,  B29C64/153 ,  B33Y70/00 ,  B33Y10/00 ,  B29B9/06 ,  C08J3/12 ,  B29K101/12

摘要： A particle for solid freeform fabrication having a columnar form has end surfaces and a side surface, wherein one of the end surfaces partially covers the side surface.

公开(公告)号：US20190241734A1

公开(公告)日：2019-08-08

申请号：US16268529

申请日：2019-02-06

申请人： Mitsuru Naruse ,  Akira Saito ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Kiichi Kamoda ,  Sohichiroh Iida ,  Shinzo Higuchi ,  Toshiyuki Iseki

发明人： Mitsuru Naruse ,  Akira Saito ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Kiichi Kamoda ,  Sohichiroh Iida ,  Shinzo Higuchi ,  Toshiyuki Iseki

IPC分类号： C08L67/02 ,  B29C64/153 ,  B33Y70/00 ,  C08J3/12

CPC分类号： C08L67/02 ,  B29B9/04 ,  B29B9/06 ,  B29B9/12 ,  B29B9/16 ,  B29C64/153 ,  B29K2105/0094 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08J3/12 ,  C08J2367/02 ,  C08J2467/02 ,  C08L2205/025

摘要： A powder for solid freeform fabrication includes a first resin particle and a second resin particle, wherein MFR2 is greater than MFR1 and a ratio of MFR2 to MFR1 is from 2 to 5, where MFR1 represents a melt mass-flow rate (MFR) of the first resin particle and MFR2 represents a melt mass-flow rate of the second resin particle.

公开(公告)号：US20180273756A1

公开(公告)日：2018-09-27

申请号：US15991595

申请日：2018-05-29

申请人： Akira SAITO ,  Yasuo SUZUKI ,  Mitsuru NARUSE ,  Nozomu TAMOTO ,  Shinzo HIGUCHI

发明人： Akira SAITO ,  Yasuo SUZUKI ,  Mitsuru NARUSE ,  Nozomu TAMOTO ,  Shinzo HIGUCHI

IPC分类号： C08L101/14 ,  C08L1/08 ,  C08L3/04 ,  C08L29/04 ,  C08L33/02 ,  C08L39/06 ,  C08L71/02 ,  C08K5/09 ,  C08K5/1545 ,  B29C64/40

CPC分类号： C08L101/14 ,  B29C64/118 ,  B29C64/40 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y70/00 ,  C08K5/09 ,  C08K5/092 ,  C08K5/1545 ,  C08K13/02 ,  C08L1/08 ,  C08L3/04 ,  C08L29/04 ,  C08L33/02 ,  C08L39/06 ,  C08L71/02 ,  C08K5/04 ,  C08L1/02

摘要： Provided is a water-disintegrable resin composition including at least a water-soluble resin (A) and an acidic substance (B).

公开(公告)号：US09935305B2

公开(公告)日：2018-04-03

申请号：US13293738

申请日：2011-11-10

申请人： Tetsuya Makino ,  Hiroshi Takabayashi ,  Tomoyuki Nakamura ,  Kunihiko Hayashi ,  Yosuke Konishi ,  Akira Sasaki ,  Akira Saito

发明人： Tetsuya Makino ,  Hiroshi Takabayashi ,  Tomoyuki Nakamura ,  Kunihiko Hayashi ,  Yosuke Konishi ,  Akira Sasaki ,  Akira Saito

IPC分类号： H01M2/06 ,  H01M2/10 ,  H01M4/64 ,  H01M2/22 ,  H01M4/70 ,  H01M4/02

CPC分类号： H01M2/22 ,  H01M4/70 ,  H01M2004/021 ,  H01M2220/30

摘要： There is provided a secondary battery including a battery device that has a thickness of 3 to 20 mm, and a battery discharge capacity of 3 to 50 Ah, and an exterior material that packages the battery device. The battery device includes a positive electrode that has a positive electrode current collector and a positive electrode active material layer, a negative electrode that has a negative electrode current collector and a negative electrode active material layer, a separator that is interposed between the positive electrode and the negative electrode that are alternately laminated, a positive electrode tab that is electrically connected to a positive electrode current collector exposed portion and is led-out to the outside of the exterior material, and a negative electrode tab that is electrically connected to a negative electrode current collector exposed portion and is led-out to the outside of the exterior material.

公开(公告)号：US09836723B2

公开(公告)日：2017-12-05

申请号：US12577903

申请日：2009-10-13

申请人： Nobuyuki Ishikawa ,  Kazuhiro Konno ,  Akira Saito ,  Shigeki Takeuchi ,  Hayato Uenohara

发明人： Nobuyuki Ishikawa ,  Kazuhiro Konno ,  Akira Saito ,  Shigeki Takeuchi ,  Hayato Uenohara

IPC分类号： G06F15/16 ,  G06Q10/10 ,  H04L12/18 ,  H04L12/58

CPC分类号： G06Q10/107 ,  H04L12/1813 ,  H04L51/04

摘要： Message display control means updates and displays messages sequentially on a message list screen each time message receiving means receives a message. When input detection means detects a response message, identification means identifies the latest message at the time of detection and the response message. Response message sending means sends the response message as a response to the identified message to other participants upon completion of input of the response message. Therefore, even in the case where the message list screen is updated due to receiving the subsequent message during the input of the response message, the completed response message is able to be sent back to the response object message.

公开(公告)号：US20170225404A1

公开(公告)日：2017-08-10

申请号：US15418227

申请日：2017-01-27

申请人： Mitsuru NARUSE ,  Shinzo HIGUCHI ,  Akira SAITO ,  Yasuo SUZUKI ,  Nozomu TAMOTO

发明人： Mitsuru NARUSE ,  Shinzo HIGUCHI ,  Akira SAITO ,  Yasuo SUZUKI ,  Nozomu TAMOTO

IPC分类号： B29C67/00 ,  B33Y70/00 ,  C08F220/70 ,  B33Y40/00 ,  C08F120/64 ,  C08F122/38

CPC分类号： B29C67/0092 ,  B29C64/106 ,  B29C64/40 ,  B29C67/0055 ,  B29K2077/00 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y70/00 ,  C08F120/64 ,  C08F122/38 ,  C08F220/28 ,  C08F220/34 ,  C08F220/58 ,  C08F220/70 ,  C08F2220/283 ,  C08F2220/585

摘要： A solid freeform fabrication material having a dissolution starting point in a pH range of 7.5-10.

公开(公告)号：US09435016B2

公开(公告)日：2016-09-06

申请号：US13808351

申请日：2010-07-07

申请人： Takeshi Sakurai ,  Yoshio Abe ,  Akira Saito ,  Yoshihiro Kameyama

发明人： Takeshi Sakurai ,  Yoshio Abe ,  Akira Saito ,  Yoshihiro Kameyama

IPC分类号： C22F1/08 ,  C22C9/06 ,  H01B1/02 ,  C22C9/04 ,  C22F1/00 ,  C22C9/10

CPC分类号： C22F1/08 ,  C22C9/04 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  H01B1/026

摘要： The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.

摘要翻译： Cu-Ni-Si系铜合金板含有1.0质量％〜3.0质量％的Ni，Si的质量％浓度为⅙〜¼的Si，余量为Cu和不可避免的杂质， 当合金结构中每个晶粒的纵横比（晶粒的短轴/晶粒的长轴）的平均值为0.4至0.6时，所有晶粒中GOS的平均值为1.2°至 1.5°，特殊晶界的总特殊晶界长度Lσ与晶界的总晶界长L的比（Lσ/ L）为60％〜70％，弹性弯曲弹性极限为450N / mm2〜600N / mm2，耐热焊接性良好，在150℃，1000小时时深冲加工性优异。