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公开(公告)号:US20060191629A1
公开(公告)日:2006-08-31
申请号:US10868714
申请日:2004-06-15
申请人: Jun Wei , Stephen Khuen Wong , Sharon Ling Nai
发明人: Jun Wei , Stephen Khuen Wong , Sharon Ling Nai
CPC分类号: C04B37/005 , B32B2315/02 , B81C3/001 , B81C2203/031 , C03C27/00 , C03C27/08 , C04B37/003 , C04B37/006 , C04B2237/04 , C04B2237/064 , C04B2237/083 , C04B2237/122 , C04B2237/341 , C04B2237/343 , C04B2237/36 , C04B2237/368 , H01L21/4857 , H01L23/49833 , H01L24/83 , H01L2224/83 , H01L2924/0132 , H01L2924/14 , H01L2924/01014 , H01L2924/01032 , H01L2924/01015 , H01L2924/01049 , H01L2924/01031 , H01L2924/01033 , H01L2924/00
摘要: A method of bonding components comprising the following steps. At least a first ceramic component and a second ceramic component are provided. A first conductive layer is formed over the upper surface of the first ceramic component. An intermediate film is formed over the first conductive layer. A second conductive layer is formed over the lower surface of the second ceramic component. The second ceramic component is stacked over the first ceramic component wherein the second conductive layer on the second ceramic component opposes the intermediate film on the first component. The first and second ceramic components are anodically bonded together.
摘要翻译: 一种粘接部件的方法,包括以下步骤。 提供至少第一陶瓷部件和第二陶瓷部件。 在第一陶瓷部件的上表面上形成第一导电层。 在第一导电层上形成中间膜。 在第二陶瓷部件的下表面上形成第二导电层。 第二陶瓷部件堆叠在第一陶瓷部件上,其中第二陶瓷部件上的第二导电层与第一部件上的中间膜相对。 第一和第二陶瓷部件阳极结合在一起。