INTEGRATED HEAT EXCHANGERS IN A RACK FOR VERTICAL BOARD STYLE COMPUTER SYSTEMS
    1.
    发明申请
    INTEGRATED HEAT EXCHANGERS IN A RACK FOR VERTICAL BOARD STYLE COMPUTER SYSTEMS 审中-公开
    用于垂直板式风格计算机系统的集成热交换器

    公开(公告)号:US20080251240A1

    公开(公告)日:2008-10-16

    申请号:US12052599

    申请日:2008-03-20

    IPC分类号: F24H3/06

    摘要: A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.

    摘要翻译: 用于冷却诸如位于机架中的计算机板的发热物体的系统包括其中发热物体位于其中的外壳。 外壳具有空气入口和空气出口,并且风扇通过外壳引导进入空气入口的空气流出出风口。 热交换器位于外壳中,使得热交换器与发热物体间隔开。 通过或通过发热物体的空气被加热,并且热交换器在空气离开外壳之前去除热量。

    Integrated heat exchangers in a rack for vertical board style computer systems
    2.
    发明授权
    Integrated heat exchangers in a rack for vertical board style computer systems 有权
    用于垂直板式计算机系统的机架中的集成热交换器

    公开(公告)号:US07367384B2

    公开(公告)日:2008-05-06

    申请号:US11164187

    申请日:2005-11-14

    IPC分类号: F24H3/06

    摘要: A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.

    摘要翻译: 用于冷却诸如位于机架中的计算机板的发热物体的系统包括其中发热物体位于其中的外壳。 外壳具有空气入口和空气出口,并且风扇通过外壳引导进入空气入口的空气流出出风口。 热交换器位于外壳中,使得热交换器与发热物体间隔开。 通过或通过发热物体的空气被加热,并且热交换器在空气离开外壳之前去除热量。

    ELECTRONIC EQUIPMENT CABINET WITH INTEGRATED, HIGH CAPACITY, COOLING SYSTEM, AND BACKUP VENTILIATION
    3.
    发明申请
    ELECTRONIC EQUIPMENT CABINET WITH INTEGRATED, HIGH CAPACITY, COOLING SYSTEM, AND BACKUP VENTILIATION 有权
    具有集成,高容量,冷却系统和备用通风的电子设备

    公开(公告)号:US20070030650A1

    公开(公告)日:2007-02-08

    申请号:US11458732

    申请日:2006-07-20

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20818 H05K7/20572

    摘要: The disclosure provides an improved cooling system and associated cabinet for electronic equipment, and optionally, a backup ventilation system for cooling related failures. Generally, the disclosure includes a high capacity closed loop refrigeration system in a modified cabinet, while accommodating standard sized computer equipment. Further, the system provides directed heat removal by altering typical airflow paths within the cabinet. The backup ventilation system is powered by auxiliary power in the case of power failure and uses the same fan(s) for ventilation as is used for cooling. The disclosure provides a more efficient, higher capacity cooling cabinet in less space than otherwise known in the art. Further, the cooling system can anticipate heat loads and therefore operate in a predictive capacity by monitoring input power to the electronic equipment and adjusting the cooling for the expected increase or decrease in heat load generated based on the input power.

    摘要翻译: 本公开提供了用于电子设备的改进的冷却系统和相关联的机柜,以及可选地用于冷却相关故障的备用通风系统。 通常,本公开包括在改进的机柜中的高容量闭环制冷系统,同时容纳标准尺寸的计算机设备。 此外,该系统通过改变机柜内的典型气流路径来提供定向散热。 备用通风系统在停电的情况下由辅助电源供电,并使用与冷却相同的风扇进行通风。 本公开以比本领域中已知的更少的空间提供更有效,更高容量的冷却柜。 此外,冷却系统可以预测热负荷,并且因此通过监视对电子设备的输入功率并且基于输入功率调整对于预期的增加或减少的热负荷的冷却来预测能力。

    Computer Room Air Conditioner With Pre-Cooler
    4.
    发明申请
    Computer Room Air Conditioner With Pre-Cooler 审中-公开
    带预冷器的电脑室空调

    公开(公告)号:US20120174612A1

    公开(公告)日:2012-07-12

    申请号:US13106997

    申请日:2011-05-13

    IPC分类号: F28D15/00 F25D31/00

    摘要: A computer room air conditioner (“CRAC”) has a cabinet having an air inlet through which return air from an area is drawn and an air outlet through which air cooled by the CRAC is exhausted. An air moving unit is disposed in the cabinet as are a plurality of cooling coils, which are in separate cooling circuits. The cooling coils are arranged so that the air passes through the cooling coils in serial fashion, that is, first through an upstream cooling coil and then through a downstream cooling cool. The upstream cooling coil acts as a pre-cooler to the subsequent downstream cooling coil. The CRAC includes a controller that controls the cooling provided by the cooling circuits. The controller controls the cooling provided by the upstream cooling circuit so that when it is being used to provide cooling, it provides only sensible cooling.

    摘要翻译: 计算机室空调(“CRAC”)具有一个机壳,其具有空气入口,通过该进气口抽出来自一个区域的回流空气和一个空气出口,由CRAC冷却的空气被排出。 空气移动单元设置在机壳中,多个冷却盘管在分开的冷却回路中。 冷却盘管被布置成使得空气以串联方式通过冷却盘管,即首先通过上游冷却盘管然后通过下游冷却冷却。 上游冷却盘管作为随后的下游冷却盘管的预冷器。 CRAC包括控制由冷却回路提供的冷却的控制器。 控制器控制由上游冷却回路提供的冷却,使其在用于提供冷却时,仅提供明智的冷却。

    COOLING SYSTEM FOR HIGH DENSITY HEAT LOAD
    5.
    发明申请
    COOLING SYSTEM FOR HIGH DENSITY HEAT LOAD 有权
    高密度热负荷冷却系统

    公开(公告)号:US20050120737A1

    公开(公告)日:2005-06-09

    申请号:US10904889

    申请日:2004-12-02

    摘要: A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.

    摘要翻译: 用于将热量从热负荷传递到环境的冷却系统具有挥发性工作流体。 冷却系统包括热连接到第一冷却循环的第一和第二冷却循环。 第一冷却循环不是蒸气压缩循环,并且包括泵,空气 - 液体热交换器和流体 - 流体热交换器。 第二冷却循环可以包括用于将热量从流体 - 流体换热器传递到环境的冷却水系统。 或者,第二冷却循环可以包括用于将热量从流体 - 流体换热器传递到环境的蒸汽压缩系统。

    INTEGRATED HEAT EXCHANGERS IN A RACK FOR VERTICLE BOARD STYLE COMPUTER SYSTEMS
    6.
    发明申请
    INTEGRATED HEAT EXCHANGERS IN A RACK FOR VERTICLE BOARD STYLE COMPUTER SYSTEMS 有权
    整体式热交换器,用于垂直平板电脑系统

    公开(公告)号:US20060102322A1

    公开(公告)日:2006-05-18

    申请号:US11164187

    申请日:2005-11-14

    IPC分类号: F28D15/00

    摘要: A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.

    摘要翻译: 用于冷却诸如位于机架中的计算机板的发热物体的系统包括其中发热物体位于其中的外壳。 外壳具有空气入口和空气出口,并且风扇通过外壳引导进入空气入口的空气流出出风口。 热交换器位于外壳中,使得热交换器与发热物体间隔开。 通过或通过发热物体的空气被加热,并且热交换器在空气离开外壳之前去除热量。