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公开(公告)号:US5740956A
公开(公告)日:1998-04-21
申请号:US570849
申请日:1995-12-12
申请人: Seong Min Seo , Suck Ju Jang
发明人: Seong Min Seo , Suck Ju Jang
IPC分类号: H01L21/60 , H01L23/485
CPC分类号: H01L24/81 , H01L24/11 , H01L24/13 , H01L2224/1134 , H01L2224/13099 , H01L2224/13111 , H01L2224/13144 , H01L2224/45144 , H01L2224/78301 , H01L2224/81801 , H01L2924/01004 , H01L2924/01013 , H01L2924/01018 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082
摘要: This invention is related to providing a bonding method for flip chips in which the circuit part is oriented to be face-down on a substrate after bonding bumps are formed on the semiconductor chip namely, forming Au bumps by Au wire ball bonding employing a wire ball bonding device onto aluminum bond pads of the semiconductor chips; coating the Au bumps with Sn/Pb alloy bumps also by wire ball bonding using a wire ball bonding device; with or without re-forming the Sn/Pb alloy bumps into a desired ball-shape by performing a heat treatment in a furnace after an activation solvent is applied to the Sn/Pb alloy bumps; and bonding (by the heat treatment in the furnace) the substrate to the coated bumps containing chip by a heat treatment in the furnace.
摘要翻译: 本发明涉及提供一种用于倒装芯片的接合方法,其中在半导体芯片上形成接合凸点之后,将电路部分取向为面朝下,即通过使用线球的Au线球接合形成Au凸块 接合装置到半导体芯片的铝接合焊盘上; 使用丝球接合装置通过丝球焊接,用Sn / Pb合金凸块涂覆Au凸块; 在Sn / Pb合金凸块施加活化溶剂后,通过在炉中进行热处理,将Sn / Pb合金凸块重新形成为期望的球状, 并且通过在炉中的热处理将基板(通过炉中的热处理)粘合到涂覆的凸起包含芯片。