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公开(公告)号:US4507078A
公开(公告)日:1985-03-26
申请号:US479197
申请日:1983-03-28
申请人: Johann Tam , Jalal Ashjaee , Nobuo B. Kuwaki , Tuan M. Ngo , Susan W. Kung
发明人: Johann Tam , Jalal Ashjaee , Nobuo B. Kuwaki , Tuan M. Ngo , Susan W. Kung
IPC分类号: B65G43/08 , B65G49/07 , B65H5/02 , B65H9/14 , G03F7/26 , H01L21/00 , H01L21/027 , H01L21/677 , H01L21/68 , F27D3/00 , B65G15/00 , B65G43/00 , F27B9/14
CPC分类号: H01L21/681 , H01L21/67103 , H01L21/67109 , H01L21/67706 , Y10S414/136
摘要: A wafer handling method and apparatus insures proper centering of a wafer at a work station and controls the heat transferred to the wafer in a baking operation. The amount of heat transferred and the rate at which the heat is transferred to the wafer are regulated by controlling the distance between the wafer and a hot plate. The hot plate is maintained at a constant temperature higher than the bake out or equilibrium temperature to which the wafer is to be heated.
摘要翻译: 晶片处理方法和装置确保在工作站处适当地对准晶片,并且在烘烤操作中控制传递到晶片的热量。 通过控制晶片和热板之间的距离来调节传递的热量和传递到晶片的速率。 热板保持在高于晶片加热到的烘烤温度或平衡温度的恒定温度。