公开(公告)号：US08952331B2

公开(公告)日：2015-02-10

申请号：US13513426

申请日：2010-12-17

申请人： Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

发明人： Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

IPC分类号： G01J5/20 ,  G01J5/16 ,  G01J5/02 ,  G01J5/04 ,  G01J5/08

CPC分类号： G01J5/16 ,  G01J5/02 ,  G01J5/0205 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/046 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0875 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00

摘要： An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

摘要翻译： 红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离处的金属壳体，该金属壳体包括设置有用于将红外线传感器装置上的图像与外部红外信号耦合的光学系统的光入射窗，并且容纳红外线传感器装置和 信号处理电路装置; 以及设置在所述红外线传感器装置和所述壳体之间的传感器盖和所述信号处理电路装置，所述传感器盖包括被配置为将经由所述光学系统进入的所述红外线信号引导到所述红外线传感器装置的透光部。

公开(公告)号：US20120235044A1

公开(公告)日：2012-09-20

申请号：US13513426

申请日：2010-12-17

申请人： Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

发明人： Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

IPC分类号： G01J5/04 ,  G01J5/02

CPC分类号： G01J5/16 ,  G01J5/02 ,  G01J5/0205 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/046 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0875 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00

摘要： An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

摘要翻译： 红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离处的金属壳体，该金属壳体包括设置有用于将红外线传感器装置上的图像与外部红外信号耦合的光学系统的光入射窗，并且容纳红外线传感器装置和 信号处理电路装置; 以及设置在所述红外线传感器装置和所述壳体之间的传感器盖和所述信号处理电路装置，所述传感器盖包括被配置为将经由所述光学系统进入的所述红外线信号引导到所述红外线传感器装置的透光部。