公开(公告)号：US20240240988A1

公开(公告)日：2024-07-18

申请号：US18473668

申请日：2023-09-25

Applicant: Seek Thermal, Inc.

Inventor： William J. Parrish ,  Andreas Engberg ,  Jason Wolfe ,  Derek Moran ,  Blake Henry ,  Ross Williams ,  Russ Mead

IPC: G01J5/02 ,  G01J5/0806 ,  G01J5/20 ,  H04N23/51 ,  H04N23/55 ,  G01J5/00

CPC classification number: G01J5/0205 ,  G01J5/0215 ,  G01J5/0806 ,  G01J5/20 ,  H04N23/51 ,  H04N23/55 ,  G01J2005/0077

Abstract: An ultra-small thermal imaging core, or micro-core. The design of the micro-core may include substrates for mounting optics and electronic connectors that are thermally matched to the imaging Focal Plane Array (FPA). Test fixtures for test and adjustment that allow for operation and image acquisition of multiple cores may also be provided. Tooling may be included to position the optics to set the core focus, either by moving the lens and lens holder as one or by pushing and/or pulling the lens against a lens positioning element within the lens holder, while observing a scene. Test procedures and fixtures that allow for full temperature calibration of each individual core, as well as providing data useful for uniformity correction during operation may also be included as part of the test and manufacture of the core.

公开(公告)号：US20190101454A1

公开(公告)日：2019-04-04

申请号：US16149627

申请日：2018-10-02

Applicant: Maxim Integrated Products, Inc.

Inventor： Jerome C. Bhat ,  Kuolung Lei ,  Craig A. Easson ,  Arvin Emadi ,  Judy Hermann

IPC: G01K1/08 ,  G01J5/12

CPC classification number: G01K1/08 ,  G01J5/0215 ,  G01J5/024 ,  G01J5/045 ,  G01J5/06 ,  G01J5/0806 ,  G01J5/0831 ,  G01J5/12 ,  G01J2005/0048 ,  G01J2005/066 ,  G01J2005/068

Abstract: The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.

公开(公告)号：US09513172B2

公开(公告)日：2016-12-06

申请号：US13750709

申请日：2013-01-25

Applicant: FLIR Systems, Inc.

Inventor： Gregory A. Carlson ,  Alex Matson ,  Andrew Sharpe ,  Davey Beard ,  Paul Schweikert ,  Robert Simes

IPC: G01J5/10 ,  G01J5/04 ,  H04N5/225 ,  H04N5/33 ,  G01J5/02 ,  G01J5/20 ,  G01J1/02 ,  G01J1/44 ,  H01L27/146 ,  G01J5/00

CPC classification number: G01J5/20 ,  G01J1/0204 ,  G01J1/44 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/046 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/204 ,  H01L22/14 ,  H01L22/32 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14669 ,  H01L27/14687 ,  H01L27/14698 ,  H01L37/02 ,  H04N5/2251 ,  H04N5/33 ,  Y10T29/49826

Abstract: An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.

Abstract translation: 用于例如红外相机的红外检测器包括具有红外检测器阵列的基板和与设置在其上表面上的阵列互连的读出集成电路，用于一个或多个实施例。 大致平面的窗口在阵列上方间隔开，窗口基本上对于红外光是透明的。 台面粘合到窗户。 台面已经封闭了边缘侧壁，其设置在窗口的下表面的外周边和基板的上表面的外周之间，并且在窗口和包围阵列的阵列之间限定了封闭的空腔。 焊接密封件将台面连接到基板以便密封空腔。

公开(公告)号：US20160187202A1

公开(公告)日：2016-06-30

申请号：US14979290

申请日：2015-12-22

Applicant: Bosch Automotive Service Solutions Inc. ,  Robert Bosch GmbH

Inventor： Joshua Miller

IPC: G01J5/10 ,  G01J5/04 ,  G01M17/013 ,  G08C17/02

CPC classification number: G01J5/10 ,  G01J5/0003 ,  G01J5/0215 ,  G01J5/025 ,  G01J5/0265 ,  G01J5/04 ,  G01M17/013 ,  G08C17/02

Abstract: An infrared (IR) temperature sensor includes a detector element, a wireless communication element, a memory, and a processor. The detector element detects IR radiation emitted from an object and generates an electrical signal proportional to the detected IR radiation. The memory is configured to store command instructions. The processor is operably connected to the detector element, the wireless communication element, and the memory. The processor is configured to execute the command instructions to transform the electrical signal into an output signal proportional to a temperature of the object and transmit the output signal with the wireless communication element. The IR sensor further includes a body that encloses the detector element, the wireless communication element, the memory, and the processor. The body defines an aperture that extends between the detector element and a mounting surface of the body and faces the object.

Abstract translation: 红外（IR）温度传感器包括检测器元件，无线通信元件，存储器和处理器。 检测器元件检测从物体发射的IR辐射并产生与检测到的IR辐射成比例的电信号。 内存被配置为存储命令指令。 处理器可操作地连接到检测器元件，无线通信元件和存储器。 处理器被配置为执行命令指令以将电信号变换成与对象的温度成比例的输出信号，并且与无线通信元件发送输出信号。 IR传感器还包括包围检测器元件的主体，无线通信元件，存储器和处理器。 主体限定一个在检测器元件和主体的安装表面之间延伸并面向物体的孔。

公开(公告)号：US20140061468A1

公开(公告)日：2014-03-06

申请号：US14003743

申请日：2012-03-21

Applicant: Kenzo Nakamura ,  Mototaka Ishikawa ,  Gakuji Uozumi

Inventor： Kenzo Nakamura ,  Mototaka Ishikawa ,  Gakuji Uozumi

IPC: G01J5/10

CPC classification number: G01J5/10 ,  G01J5/0215 ,  G01J5/20 ,  G01J2005/067 ,  H01L37/02

Abstract: Provided is a lightweight infrared sensor which is readily and stably erected to a substrate. The infrared sensor includes an insulating film; a first and a second heat sensitive element are disposed on one surface of the insulating film separately; a first and second conductive film on one surface of the insulating film and are respectively connected to the first and the second heat sensitive element; and an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element. The infrared sensor further includes a reinforcing plate on which a sensor part window corresponding to a sensor part is formed and which is adhered to the insulating film; and a first and a second terminal electrode are respectively connected to the first and the second wiring film, are formed on the edge of the insulating film.

Abstract translation: 提供了一种容易且稳定地竖立到基板的轻质红外传感器。 红外线传感器包括绝缘膜; 第一和第二热敏元件分别设置在绝缘膜的一个表面上; 绝缘膜的一个表面上的第一和第二导电膜分别连接到第一和第二热敏元件; 以及在绝缘膜的另一个表面上的红外反射膜，以面对第二个热敏元件。 红外线传感器还包括加强板，在该加强板上形成有对应于传感器部分的传感器部分窗口，并粘附到绝缘膜上; 并且第一和第二端子电极分别连接到第一和第二布线膜，形成在绝缘膜的边缘上。

公开(公告)号：US08466797B2

公开(公告)日：2013-06-18

申请号：US12674697

申请日：2008-08-15

Applicant: Wolfgang Schwörer ,  Frank Eder ,  Kerstin Tetzlaff

Inventor： Wolfgang Schwörer ,  Frank Eder ,  Kerstin Tetzlaff

IPC: G08B17/00

CPC classification number: G01J5/02 ,  G01J5/0215 ,  G01J5/025 ,  G01J5/0265 ,  G01J5/08 ,  G01J5/0846 ,  G01J5/0859 ,  G01J5/089 ,  G01J5/0896

Abstract: The invention relates to a handheld device (1) for infrared temperature measurement, comprising an infrared radiation detector (3) for measuring the temperature of a measuring spot (4) on an object under measurement (5), comprising an optical pickup device (2) for sensing the region containing the measuring spot (4) and comprising a display means (6) for presenting the measured temperature value. To provide a handheld device (1) which uses simple means to enable an operator to line up a measuring spot (4) on an object under measurement (5) and at the same time give the operator information on one or more ambient variables during this operation, it is proposed to design the display means (6) for continuously presenting the region of the object under measurement (5) that contains the measuring spot (4) and at least one item of temperature information that is correlated synchronously in time with the presentation.

Abstract translation: 本发明涉及一种用于红外温度测量的手持式设备（1），包括用于测量被测物体（5）上的测量点（4）的温度的红外辐射探测器（3），其包括光学拾取装置（2） ），用于感测包含测量点（4）的区域并且包括用于呈现所测量的温度值的显示装置（6）。 提供一种手持式设备（1），其使用简单的手段使操作者能够对测量对象（5）上的测量点（4）进行排列，同时在此期间向操作者提供关于一个或多个环境变量的信息 提出设计用于连续显示包含测量点（4）的测量对象（5）的区域的显示装置（6）和与时间相关的至少一个温度信息项目 介绍。

公开(公告)号：US20120235044A1

公开(公告)日：2012-09-20

申请号：US13513426

申请日：2010-12-17

Applicant: Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

Inventor： Mitsuhiko Ueda ,  Takami Okubayashi ,  Takanori Sugiyama ,  Yoshiharu Sanagawa ,  Takanori Aketa ,  Yushi Nakamura ,  Masao Kirihara

IPC: G01J5/04 ,  G01J5/02

CPC classification number: G01J5/16 ,  G01J5/02 ,  G01J5/0205 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/046 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0875 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00

Abstract: An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

Abstract translation: 红外线传感器模块包括：红外线传感器装置，设置在基板上并被配置为接收红外信号; 信号处理电路装置，被配置为处理来自所述红外线传感器装置的输出; 设置在距红外线传感器装置预定距离处的金属壳体，该金属壳体包括设置有用于将红外线传感器装置上的图像与外部红外信号耦合的光学系统的光入射窗，并且容纳红外线传感器装置和 信号处理电路装置; 以及设置在所述红外线传感器装置和所述壳体之间的传感器盖和所述信号处理电路装置，所述传感器盖包括被配置为将经由所述光学系统进入的所述红外线信号引导到所述红外线传感器装置的透光部。

公开(公告)号：US08153972B2

公开(公告)日：2012-04-10

申请号：US12912323

申请日：2010-10-26

Applicant: Robert DeMarco ,  Frank Vallese ,  Gerard DiTaranto

Inventor： Robert DeMarco ,  Frank Vallese ,  Gerard DiTaranto

IPC: G01J5/00

CPC classification number: G01J5/02 ,  G01C3/08 ,  G01J5/0215 ,  G01J5/025 ,  G01J5/0265 ,  G01J5/0275 ,  G01J5/08 ,  G01J5/0846 ,  G01J5/089 ,  G01J5/0896 ,  G01J2005/0077 ,  G01S17/46 ,  H04N5/2256 ,  H04N5/23293 ,  H04N5/33 ,  H04N5/332

Abstract: An infrared camera including optics and a detector sensitive to infrared radiation is used in conjunction with at least one light source, such as a laser, to locate a reference point on a target. Two intersecting line segments are produced by the one light source or a combination of two light sources to locate the reference point on the target. The infrared camera would display both an infrared image as well as a visible image which can be merged onto a single display. The teaching of the present invention could also be used to determine the distance to the target as well as the area of the target.

Abstract translation: 包括光学元件和对红外线辐射敏感的检测器的红外摄像机与至少一个光源（例如激光器）结合使用，以将目标点上的参考点定位。 两个相交的线段由一个光源或两个光源的组合产生以将参考点定位在目标上。 红外摄像机将显示红外图像以及可以合并到单个显示器上的可见图像。 本发明的教导还可以用于确定到目标​​的距离以及目标的面积。

公开(公告)号：US20070076781A1

公开(公告)日：2007-04-05

申请号：US11606969

申请日：2006-12-01

Applicant: Anton Ruettiger

Inventor： Anton Ruettiger

IPC: G01J5/00

CPC classification number: G01J1/02 ,  B60H1/0075 ,  G01J1/0271 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/04 ,  G01J5/045 ,  G01J5/046 ,  G01J5/061 ,  G01J5/08 ,  G01J5/0846 ,  G01J2001/4266 ,  G01J2005/0048 ,  G01K1/20 ,  G01K2201/02

Abstract: A signal (Snormal) is provided to a heat element of a temperature sensor, which is recorded as a step response (Lruh, Lbew). From the difference of the step response compared with the reaction adaptively determined with the temperature sensor at zero air circulation, air flow or no air flow is determined.

公开(公告)号：US20070023414A1

公开(公告)日：2007-02-01

申请号：US10571149

申请日：2004-08-20

Applicant: Stefan Scharf ,  Stefan Neth ,  Bernhard Kraus

Inventor： Stefan Scharf ,  Stefan Neth ,  Bernhard Kraus

IPC: H05B3/68

CPC classification number: G01J5/0003 ,  G01J5/0011 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/046 ,  G01J5/061

Abstract: An infrared sensor with an electrically heatable sensor housing. The housing including a heating device in the form of a strip conductor-like electric heating track, which is controlled by a control device, and applied onto a ceramic substrate. The ceramic substrate comprises an electrically insulated ceramic material providing adequate thermal conductivity and preferably forming the bottom of the sensor housing, and carrying at least one infrared sensor element, e.g., a thermopile sensor. The ceramic substrate having electric strip conductors serving as a contact surface for a corresponding (not-shown) housing cover and through-hole contacts serving as electrical connections between the top side and the bottom side of the ceramic substrate. The electric heating tracks and strip conductors in a preferred embodiment comprise thick-film tracks. The infrared sensor being suitable for a measuring tip of an intra-auricular infrared thermometer.

Abstract translation: 具有电可加热传感器外壳的红外传感器。 壳体包括由带状导体的电加热轨道形式的加热装置，其由控制装置控制并施加到陶瓷基板上。 陶瓷衬底包括提供足够导热性的电绝缘陶瓷材料，优选地形成传感器外壳的底部，并且携带至少一个红外传感器元件，例如热电堆传感器。 具有用作相应（未示出）壳体盖的接触表面的电条导体和用作陶瓷衬底的顶侧和底侧之间的电连接的通孔触点的陶瓷衬底。 在优选实施例中的电加热轨道和带状导体包括厚膜轨道。 红外线传感器适用于耳内红外测温仪的测量头。