摘要:
A method of forming wiring of a semiconductor device includes: forming an insulating resin on a main surface of a substrate such that an opening portion defining a wiring pattern is provided in the insulating resin; forming a first wiring layer made of a first metal on a bottom surface and side surfaces of the opening portion surrounding and a surface of the insulating resin opposite to the main surface of the substrate, the first wiring layer having a bottom portion formed on the bottom surface of the opening portion and side portions formed on the side surfaces, the bottom portion having a thickness greater than a thickness of at least one of the side portions; and cutting the insulating resin and the first wiring layer such that the insulating resin and the first wiring layer are exposed.
摘要:
There is provided a light-emitting apparatus formed by attaching a device substrate where light-emitting device is formed and a sealing substrate which seals the device substrate through a sealing material and sealing the light-emitting device between the device substrate and the sealing substrate through the sealing material, wherein the sealing material includes a first sealing material and a second sealing material, wherein the first sealing material is formed to surround the light-emitting device between the device substrate and the sealing substrate and to have a sealing hole portion formed by not disposing the first sealing material, so that the first sealing material is discontinuous, wherein the sealing hole portion of the first sealing material is closed with the second sealing material, so that the second sealing material and the first sealing material constitute a ring-shaped sealing member, and wherein the first sealing material is provided with guide portions which are formed to be continuous with at least one side where the sealing hole portion is formed and to extend to an inner surface of the device substrate without being covered with the sealing substrate so as to be exposed.
摘要:
Cost is reduced by simplifying piping work and reducing the number of parts. At the same time, the degree of freedom in the arrangement of piping is raised by making the mounting posture of the piping variable. A pipe assembly unit with built-in sensors 1 is fabricated by integrating a main pipe 2 and multiple branch pipes 3, 3, . . . which branch from the main pipe 2 and by building, in the multiple branch pipes 3, 3, . . . , a flow sensor 4 which detects the flow rate of a fluid flowing through a conduit 31 of each of the branch pipes 3, and the use of a conventional seal construction using a nipple in connections between the main pipe 2 and the branch pipes 3 is abolished. A pipe adapter 73 having legs 734 is detachably attached to opening ends of the main pipe 2 and the legs 734 are fixed to an installation surface A by changing the orientation of the pipe adapter 73, whereby the mounting posture of the pipe assembly unit 1 is made variable.
摘要:
A longitudinal support base 30 is provided with a rotating support base 10 that can be slide in a longitudinal direction of the vehicle. A seat body is placed on the rotating support base 10 via a rotary disc 13 so as to rotate. The longitudinal support base 30 is provided with an intermediate gear 22 that is engaged with a rack 21 extending in the longitudinal direction of the vehicle seat. The seat body 2 side is provided with a pinion gear 24 that is engaged with the intermediate gear 11. The rotary disc 13 is rotated by means of a driving force of an electric motor 41. Thus, when the electric motor 41 is rotated, the seat body 2 rotates and slides in the longitudinal direction.
摘要:
A method of forming wiring of a semiconductor device includes: forming an insulating resin on a main surface of a substrate such that an opening portion defining a wiring pattern is provided in the insulating resin; forming a first wiring layer made of a first metal on a bottom surface and side surfaces of the opening portion surrounding and a surface of the insulating resin opposite to the main surface of the substrate, the first wiring layer having a bottom portion formed on the bottom surface of the opening portion and side portions formed on the side surfaces, the bottom portion having a thickness greater than a thickness of at least one of the side portions; and cutting the insulating resin and the first wiring layer such that the insulating resin and the first wiring layer are exposed.
摘要:
Cost is reduced by simplifying piping work and reducing the number of parts. At the same time, the degree of freedom in the arrangement of piping is raised by making the mounting posture of the piping variable. A pipe assembly unit with built-in sensors is fabricated by integrating a main pipe and multiple branch pipes, which branch from the main pipe and by building, in the multiple branch pipes a flow sensor which detects the flow rate of a fluid flowing through a conduit of each of the branch pipes, and the use of a conventional seal construction using a nipple in connections between the main pipe and the branch pipes is abolished. A pipe adapter having legs is detachably attached to opening ends of the main pipe and the legs are fixed to an installation surface A by changing the orientation of the pipe adapter, whereby the mounting posture of the pipe assembly unit is made variable.
摘要:
There is provided a light-emitting apparatus formed by attaching a device substrate where light-emitting device is formed and a sealing substrate which seals the device substrate through a sealing material and sealing the light-emitting device between the device substrate and the sealing substrate through the sealing material, wherein the sealing material includes a first sealing material and a second sealing material, wherein the first sealing material is formed to surround the light-emitting device between the device substrate and the sealing substrate and to have a sealing hole portion formed by not disposing the first sealing material, so that the first sealing material is discontinuous, wherein the sealing hole portion of the first sealing material is closed with the second sealing material, so that the second sealing material and the first sealing material constitute a ring-shaped sealing member, and wherein the first sealing material is provided with guide portions which are formed to be continuous with at least one side where the sealing hole portion is formed and to extend to an inner surface of the device substrate without being covered with the sealing substrate so as to be exposed.
摘要:
A magnet catch wherein a magnet assembly is installed in a case from the front opening in such a way that it can be moved back and forth, an adjust cam is secured to an adjust spindle rotatably mounted to one side portion of the case and disposed in a direction perpendicular to that in which the magnet assembly advances and retracts, a cam groove is formed on the adjust cam in such a manner that the cam groove radius from the adjust spindle as the rotating center continuously changes, and a cam pin projecting from the magnet assembly is engaged with the cam groove.