METHOD OF FORMING WIRING OF A SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHOD OF FORMING WIRING OF A SEMICONDUCTOR DEVICE 有权
    形成半导体器件布线的方法

    公开(公告)号:US20120231625A1

    公开(公告)日:2012-09-13

    申请号:US13414454

    申请日:2012-03-07

    IPC分类号: H01L21/768

    摘要: A method of forming wiring of a semiconductor device includes: forming an insulating resin on a main surface of a substrate such that an opening portion defining a wiring pattern is provided in the insulating resin; forming a first wiring layer made of a first metal on a bottom surface and side surfaces of the opening portion surrounding and a surface of the insulating resin opposite to the main surface of the substrate, the first wiring layer having a bottom portion formed on the bottom surface of the opening portion and side portions formed on the side surfaces, the bottom portion having a thickness greater than a thickness of at least one of the side portions; and cutting the insulating resin and the first wiring layer such that the insulating resin and the first wiring layer are exposed.

    摘要翻译: 形成半导体器件布线的方法包括:在绝缘树脂中设置绝缘树脂至基片的主表面上,使得限定布线图形的开口部分; 在底面上形成由第一金属构成的第一布线层和围绕的开口部分的侧表面和与基板的主表面相对的绝缘树脂的表面,第一布线层的底部形成在底部 所述开口部的表面和形成在所述侧面上的侧部,所述底部的厚度大于所述侧部中的至少一个的厚度; 以及绝缘树脂和第一布线层的切割,使得绝缘树脂和第一布线层露出。

    Light-emitting apparatus, method of manufacturing light-emitting apparatus, image forming apparatus, and electronic apparatus
    2.
    发明授权
    Light-emitting apparatus, method of manufacturing light-emitting apparatus, image forming apparatus, and electronic apparatus 失效
    发光装置,制造发光装置的方法,图像形成装置和电子装置

    公开(公告)号:US07683540B2

    公开(公告)日:2010-03-23

    申请号:US11468452

    申请日:2006-08-30

    IPC分类号: H01J1/62

    摘要: There is provided a light-emitting apparatus formed by attaching a device substrate where light-emitting device is formed and a sealing substrate which seals the device substrate through a sealing material and sealing the light-emitting device between the device substrate and the sealing substrate through the sealing material, wherein the sealing material includes a first sealing material and a second sealing material, wherein the first sealing material is formed to surround the light-emitting device between the device substrate and the sealing substrate and to have a sealing hole portion formed by not disposing the first sealing material, so that the first sealing material is discontinuous, wherein the sealing hole portion of the first sealing material is closed with the second sealing material, so that the second sealing material and the first sealing material constitute a ring-shaped sealing member, and wherein the first sealing material is provided with guide portions which are formed to be continuous with at least one side where the sealing hole portion is formed and to extend to an inner surface of the device substrate without being covered with the sealing substrate so as to be exposed.

    摘要翻译: 提供了一种发光装置,其通过附着形成发光装置的器件基板和通过密封材料密封器件基板的密封基板而形成,并且将发光器件密封在器件基板和密封基板之间,通过 密封材料,其中所述密封材料包括第一密封材料和第二密封材料,其中所述第一密封材料形成为围绕所述器件基板和所述密封基板之间的发光器件,并且具有由 不设置第一密封材料,使得第一密封材料不连续,其中第一密封材料的密封孔部分用第二密封材料封闭,使得第二密封材料和第一密封材料构成环形 密封构件,并且其中所述第一密封材料设置有用于的引导部分 使其与形成有密封孔部的至少一侧连续并且延伸到装置基板的内表面而不被密封基板覆盖以露出。

    Pipe Assembly Unit With Built-In Flow Sensors
    3.
    发明申请
    Pipe Assembly Unit With Built-In Flow Sensors 有权
    具有内置流量传感器的管道装配单元

    公开(公告)号:US20070044574A1

    公开(公告)日:2007-03-01

    申请号:US11463478

    申请日:2006-08-09

    IPC分类号: G01F1/28

    摘要: Cost is reduced by simplifying piping work and reducing the number of parts. At the same time, the degree of freedom in the arrangement of piping is raised by making the mounting posture of the piping variable. A pipe assembly unit with built-in sensors 1 is fabricated by integrating a main pipe 2 and multiple branch pipes 3, 3, . . . which branch from the main pipe 2 and by building, in the multiple branch pipes 3, 3, . . . , a flow sensor 4 which detects the flow rate of a fluid flowing through a conduit 31 of each of the branch pipes 3, and the use of a conventional seal construction using a nipple in connections between the main pipe 2 and the branch pipes 3 is abolished. A pipe adapter 73 having legs 734 is detachably attached to opening ends of the main pipe 2 and the legs 734 are fixed to an installation surface A by changing the orientation of the pipe adapter 73, whereby the mounting posture of the pipe assembly unit 1 is made variable.

    摘要翻译: 通过简化管道工作并减少零件数量,可以降低成本。 同时,通过使管道的安装姿势变化,可以提高管道排列的自由度。 具有内置传感器1的管组件单元通过集成主管2和多个分支管3,3而制造。 。 。 其从主管2分支并且通过在多个分支管3,3中构建。 。 。 检测流过各分支管3的导管31的流体的流量的流量传感器4以及在主管2与支管3之间的连接中使用接头的常规的密封结构的使用, 废除 具有腿部734的管路适配器73可拆卸地安装到主管2的开口端,并且腿部734通过改变管道适配器73的方向而固定到安装表面A,由此管道组件单元1的安装姿态为 做变量。

    Method of forming wiring of a semiconductor device
    5.
    发明授权
    Method of forming wiring of a semiconductor device 有权
    形成半导体器件布线的方法

    公开(公告)号:US08859415B2

    公开(公告)日:2014-10-14

    申请号:US13414454

    申请日:2012-03-07

    摘要: A method of forming wiring of a semiconductor device includes: forming an insulating resin on a main surface of a substrate such that an opening portion defining a wiring pattern is provided in the insulating resin; forming a first wiring layer made of a first metal on a bottom surface and side surfaces of the opening portion surrounding and a surface of the insulating resin opposite to the main surface of the substrate, the first wiring layer having a bottom portion formed on the bottom surface of the opening portion and side portions formed on the side surfaces, the bottom portion having a thickness greater than a thickness of at least one of the side portions; and cutting the insulating resin and the first wiring layer such that the insulating resin and the first wiring layer are exposed.

    摘要翻译: 形成半导体器件布线的方法包括:在绝缘树脂中设置绝缘树脂至基片的主表面上,使得限定布线图形的开口部分; 在底面上形成由第一金属构成的第一布线层和围绕的开口部分的侧表面和与基板的主表面相对的绝缘树脂的表面,第一布线层的底部形成在底部 所述开口部的表面和形成在所述侧面上的侧部,所述底部的厚度大于所述侧部中的至少一个的厚度; 以及绝缘树脂和第一布线层的切割,使得绝缘树脂和第一布线层露出。

    Pipe assembly unit with built-in flow sensors
    6.
    发明授权
    Pipe assembly unit with built-in flow sensors 有权
    管道装配单元,内置流量传感器

    公开(公告)号:US07225685B2

    公开(公告)日:2007-06-05

    申请号:US11463478

    申请日:2006-08-09

    IPC分类号: G01F15/00

    摘要: Cost is reduced by simplifying piping work and reducing the number of parts. At the same time, the degree of freedom in the arrangement of piping is raised by making the mounting posture of the piping variable. A pipe assembly unit with built-in sensors is fabricated by integrating a main pipe and multiple branch pipes, which branch from the main pipe and by building, in the multiple branch pipes a flow sensor which detects the flow rate of a fluid flowing through a conduit of each of the branch pipes, and the use of a conventional seal construction using a nipple in connections between the main pipe and the branch pipes is abolished. A pipe adapter having legs is detachably attached to opening ends of the main pipe and the legs are fixed to an installation surface A by changing the orientation of the pipe adapter, whereby the mounting posture of the pipe assembly unit is made variable.

    摘要翻译: 通过简化管道工作并减少零件数量,可以降低成本。 同时,通过使管道的安装姿势变化,可以提高管道排列的自由度。 具有内置传感器的管道组件单元通过将主管和多个分支管从主管分支并通过在多个分支管中构建而形成,该流量传感器检测流过一个流体的流体的流量 每个支管的导管,以及使用在主管和分支管之间的连接中使用接头的传统密封结构的使用被废除。 具有腿部的管道适配器可拆卸地附接到主管的开口端,并且通过改变管道适配器的取向来将腿固定到安装表面A,由此使管组件单元的安装姿态可变。

    LIGHT-EMITTING APPARATUS, METHOD OF MANUFACTURING LIGHT-EMITTING APPARATUS, IMAGE FORMING APPARATUS, AND ELECTRONIC APPARATUS
    7.
    发明申请
    LIGHT-EMITTING APPARATUS, METHOD OF MANUFACTURING LIGHT-EMITTING APPARATUS, IMAGE FORMING APPARATUS, AND ELECTRONIC APPARATUS 失效
    发光装置,制造发光装置的方法,图像形成装置和电子装置

    公开(公告)号:US20070069644A1

    公开(公告)日:2007-03-29

    申请号:US11468452

    申请日:2006-08-30

    IPC分类号: H01J1/62

    摘要: There is provided a light-emitting apparatus formed by attaching a device substrate where light-emitting device is formed and a sealing substrate which seals the device substrate through a sealing material and sealing the light-emitting device between the device substrate and the sealing substrate through the sealing material, wherein the sealing material includes a first sealing material and a second sealing material, wherein the first sealing material is formed to surround the light-emitting device between the device substrate and the sealing substrate and to have a sealing hole portion formed by not disposing the first sealing material, so that the first sealing material is discontinuous, wherein the sealing hole portion of the first sealing material is closed with the second sealing material, so that the second sealing material and the first sealing material constitute a ring-shaped sealing member, and wherein the first sealing material is provided with guide portions which are formed to be continuous with at least one side where the sealing hole portion is formed and to extend to an inner surface of the device substrate without being covered with the sealing substrate so as to be exposed.

    摘要翻译: 提供了一种发光装置,其通过附着形成发光装置的器件基板和通过密封材料密封器件基板的密封基板而形成,并且将发光器件密封在器件基板和密封基板之间,通过 密封材料,其中所述密封材料包括第一密封材料和第二密封材料,其中所述第一密封材料形成为围绕所述器件基板和所述密封基板之间的发光器件,并且具有由 不设置第一密封材料,使得第一密封材料不连续,其中第一密封材料的密封孔部分用第二密封材料封闭,使得第二密封材料和第一密封材料构成环形 密封构件,并且其中所述第一密封材料设置有用于的引导部分 使其与形成有密封孔部的至少一侧连续并且延伸到装置基板的内表面而不被密封基板覆盖以露出。

    Magnet catch
    8.
    发明授权
    Magnet catch 失效
    磁铁抓

    公开(公告)号:US4790576A

    公开(公告)日:1988-12-13

    申请号:US164850

    申请日:1988-03-07

    IPC分类号: E05C19/16 E05C17/56

    摘要: A magnet catch wherein a magnet assembly is installed in a case from the front opening in such a way that it can be moved back and forth, an adjust cam is secured to an adjust spindle rotatably mounted to one side portion of the case and disposed in a direction perpendicular to that in which the magnet assembly advances and retracts, a cam groove is formed on the adjust cam in such a manner that the cam groove radius from the adjust spindle as the rotating center continuously changes, and a cam pin projecting from the magnet assembly is engaged with the cam groove.