公开(公告)号：US20110068674A1

公开(公告)日：2011-03-24

申请号：US12885005

申请日：2010-09-17

申请人： Erika TAKENAKA ,  Tomohiro Sanpei ,  Takeo Idezuki

发明人： Erika TAKENAKA ,  Tomohiro Sanpei ,  Takeo Idezuki

IPC分类号： H01J5/50

CPC分类号： F21K9/23 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.

摘要翻译： 根据一个实施例，发光装置包括包括电源导体，框架构件和密封构件的基板。 电源导体形成在基板上。 包括电极的多个发光元件安装在基板上。 与电源导体相邻的发光元件的电极通过多根接合线电连接到电源导体。 框架构件由涂覆在基板上以围绕发光元件和接合线的树脂制成。 密封构件填充在由框架构件包围的区域中，并且密封发光元件和接合线。

公开(公告)号：US08354783B2

公开(公告)日：2013-01-15

申请号：US12885005

申请日：2010-09-17

申请人： Erika Takenaka ,  Tomohiro Sanpei ,  Takeo Idezuki

发明人： Erika Takenaka ,  Tomohiro Sanpei ,  Takeo Idezuki

IPC分类号： H01J5/50

CPC分类号： F21K9/23 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.

摘要翻译： 根据一个实施例，发光装置包括包括电源导体，框架构件和密封构件的基板。 电源导体形成在基板上。 包括电极的多个发光元件安装在基板上。 与电源导体相邻的发光元件的电极通过多根接合线电连接到电源导体。 框架构件由涂覆在基板上以围绕发光元件和接合线的树脂制成。 密封构件填充在由框架构件包围的区域中，并且密封发光元件和接合线。