公开(公告)号：US07070864B2

公开(公告)日：2006-07-04

申请号：US10474124

申请日：2002-04-19

申请人： Takuhei Ohta ,  Katsufumi Hiraishi ,  Taeko Takarabe ,  Syuji Takiyama ,  Eri Kabemura ,  Kazuya Miyamoto ,  Takashi Matsuda ,  Tazo Sawamura

发明人： Takuhei Ohta ,  Katsufumi Hiraishi ,  Taeko Takarabe ,  Syuji Takiyama ,  Eri Kabemura ,  Kazuya Miyamoto ,  Takashi Matsuda ,  Tazo Sawamura

IPC分类号： B32B27/06 ,  C08G73/10 ,  C08G69/26

CPC分类号： C08G73/10 ,  B32B27/00 ,  H05K1/0346 ,  Y10T428/31721

摘要： This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol % or more of 4,4′-diamino-2,2′-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol % or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bis[4-(4-aminophenoxy)phenyl]propane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.

摘要翻译： 本发明涉及无铅焊接所需的吸湿性优异的层压体，适用于柔性印刷线路板或HDD悬浮液。 本发明的电子材料用层叠体由导体层和具有聚酰亚胺系树脂层（A）和聚酰亚胺系树脂层（B）的绝缘性树脂层构成。 构成绝缘层的聚酰亚胺系树脂层（A）包括通过使含有40摩尔％以上的4,4'-二氨基-2,2'-二甲基联苯的二胺与芳香族四羧酸反应得到的聚酰亚胺系树脂， 聚酰亚胺系树脂层（B）含有由双（4-氨基苯氧基）苯或2,2-双[4-（4-氨基苯氧基）苯基 ]丙烷，均苯四酸，二苯甲酮四羧酸，二苯基磺酸四羧酸或联苯四羧酸。

公开(公告)号：US06998455B1

公开(公告)日：2006-02-14

申请号：US10110316

申请日：2000-10-20

申请人： Takuhei Ohta ,  Katsufumi Hiraishi ,  Makoto Shimose ,  Kazuto Okamura ,  Naoya Okabayashi ,  Kazunori Oomizo

发明人： Takuhei Ohta ,  Katsufumi Hiraishi ,  Makoto Shimose ,  Kazuto Okamura ,  Naoya Okabayashi ,  Kazunori Oomizo

IPC分类号： C08F122/40

CPC分类号： C08G73/10 ,  H05K1/0346 ,  H05K1/056

摘要： This invention relates to a laminate which changes in dimension to such a small extent as not to cause curling and warpage when the ambient humidity changes and is useful for flexible printed wiring boards. The laminate possesses a polyimide layer or layers of polyimides formed on a conductor by coating and at least one of the polyimide layers is composed of polyimide of low hygroscopic expansion obtained by the reaction of diamines containing 20 mol % or more of 4,4′-diamino-2,2′-dimethylbiphenyl with a tetracarboxylic acid compound and exhibiting a coefficient of linear hygroscopic expansion of 15×10−6/% RH or less.

摘要翻译： 本发明涉及一种层叠体，其尺寸变化到如此小的程度，当环境湿度变化时不会引起卷曲和翘曲，并且可用于柔性印刷线路板。 层压体具有通过涂布在导体上形成的聚酰亚胺层或聚酰亚胺层，并且至少一个聚酰亚胺层由通过使含有20摩尔％以上的4,4'-二羧酸的二胺反应获得的低吸湿膨胀性的聚酰亚胺构成， 二氨基-2,2'-二甲基联苯与四羧酸化合物，线性吸湿膨胀系数为15×10 -6 /％RH以下。