公开(公告)号：US07070864B2

公开(公告)日：2006-07-04

申请号：US10474124

申请日：2002-04-19

申请人： Takuhei Ohta ,  Katsufumi Hiraishi ,  Taeko Takarabe ,  Syuji Takiyama ,  Eri Kabemura ,  Kazuya Miyamoto ,  Takashi Matsuda ,  Tazo Sawamura

发明人： Takuhei Ohta ,  Katsufumi Hiraishi ,  Taeko Takarabe ,  Syuji Takiyama ,  Eri Kabemura ,  Kazuya Miyamoto ,  Takashi Matsuda ,  Tazo Sawamura

IPC分类号： B32B27/06 ,  C08G73/10 ,  C08G69/26

CPC分类号： C08G73/10 ,  B32B27/00 ,  H05K1/0346 ,  Y10T428/31721

摘要： This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol % or more of 4,4′-diamino-2,2′-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol % or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bis[4-(4-aminophenoxy)phenyl]propane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.

摘要翻译： 本发明涉及无铅焊接所需的吸湿性优异的层压体，适用于柔性印刷线路板或HDD悬浮液。 本发明的电子材料用层叠体由导体层和具有聚酰亚胺系树脂层（A）和聚酰亚胺系树脂层（B）的绝缘性树脂层构成。 构成绝缘层的聚酰亚胺系树脂层（A）包括通过使含有40摩尔％以上的4,4'-二氨基-2,2'-二甲基联苯的二胺与芳香族四羧酸反应得到的聚酰亚胺系树脂， 聚酰亚胺系树脂层（B）含有由双（4-氨基苯氧基）苯或2,2-双[4-（4-氨基苯氧基）苯基 ]丙烷，均苯四酸，二苯甲酮四羧酸，二苯基磺酸四羧酸或联苯四羧酸。

公开(公告)号：US06203918B1

公开(公告)日：2001-03-20

申请号：US09242568

申请日：1999-02-19

申请人： Makoto Shimose ,  Hisashi Watanabe ,  Seigo Oka ,  Yuji Matsushita ,  Eri Kabemura

发明人： Makoto Shimose ,  Hisashi Watanabe ,  Seigo Oka ,  Yuji Matsushita ,  Eri Kabemura

IPC分类号： B32B1508

CPC分类号： G11B5/484 ,  G11B21/00 ,  H05K1/0346 ,  H05K1/056 ,  Y10T428/31681 ,  Y10T428/31721

摘要： This invention relates to laminates for use in HDD suspensions which are composed of a stainless steel base material and successive layers formed thereon of polyimides and an electrical conductor and in which the linear expansion coefficient of the polyimide layer is controlled in the range of 1×10−5/° C. to 3×10−5/° C. and the adhesive strength between stainless steel and polyimide and that between polyimide and electrical conductor are controlled at 0.5 kg/cm or more. This invention also relates to a process for preparing laminates for use in HDD suspensions comprising applying a solution of polyimide precursors or polyimides to a stainless steel base material with a thickness of 10 to 70 &mgr;m in one layer or more, drying, performing heat treatment at 250° C. or more to form a layer of polyimides with a thickness of 3 to 20 &mgr;m and a linear expansion coefficient of 1×10−5/° C. to 3×10−5/° C. and contact-bonding said layer of polyimides under heat to a layer of electrical conductor with a thickness of 3 to 20 &mgr;m. Laminates of this invention for use in HDD suspensions are practically free of deflection during etching and are suited for integrally-wired HDD suspensions.

摘要翻译： 本发明涉及用于HDD悬浮液的层压板，其由不锈钢基材和其上形成的连续层组成聚酰亚胺和电导体，其中聚酰亚胺层的线膨胀系数控制在1×10-5 /℃至3×10-5 /℃，不锈钢和聚酰亚胺之间的粘合强度以及聚酰亚胺和电导体之间的粘合强度控制在0.5kg / cm以上。 本发明还涉及一种制备用于HDD悬浮液的层压板的方法，包括将聚酰亚胺前体或聚酰亚胺溶液涂覆在一层或多层中具有10-70μm厚度的不锈钢基材，干燥，进行热处理 250℃或更高以形成厚度为3至20μm的线性膨胀系数为1×10 -5 /℃至3×10 -5 /℃的聚酰亚胺层，并将所述聚酰亚胺层接触粘合在 加热到厚度为3至20微米的电导体层。用于HDD悬架的本发明的层压板在蚀刻期间实际上不会发生偏转，并且适用于整体连接的HDD悬架。