摘要:
A camera having an electromagnetically driven shutter provided with a counter capable upon counting a present number producing a signal. Each time the shutter is closed, the counted value is changed, while the period of actuation of the shutter is controlled to effect a predetermined fraction of an exposure, so that a continuous sequence of shots equal in number to that preset in the counter are taken automatically.
摘要:
In a winding device for a camera in which automatic winding of loaded film from a winding start position to a first picture taking position is effected without interrelation to photographic operation, the automatic film winding is enabled by controlling a control member of the winding device by a change-over member which is actuated in response to a counter displaying the numbers of exposed film frames. When in the rewinding mode, in order to insure that the film can be rewound to the winding start position without failure, actuation of the change-over member is not transmitted to the control member.
摘要:
In a camera capable, upon actuation of a film rewind release member, of cutting off the manual or motorized driving torque from the winding transmission system to render the winding operation impossible, while simultaneously rendering the manual or motorized rewinding operation possible, the rewinding device is provided with means responsive to the actuation of the film rewind release member for cutting off the various charge mechanisms from the manual or motorized driving torque transmission system.
摘要:
In an automatically focusing camera, the lens is driven to infinity during film winding and the film winding spool is blocked when film winding is completed. Upon shutter release actuation of the camera, film winding is unblocked when the automatic focusing circuit energizes a first magnet and lens rotation is blocked at the focused position when the automatic focusing circuit energizes a second magnet. A single control member operates to effect blocking of the film winding mechanism and to drive the lens to infinity when rotated in one direction, and to unblock the film winding mechanism when rotated in the opposite direction.
摘要:
A sound motion picture projection system which can be formed by a combination of a silent film projector and a sound recording and reproducing unit, wherein a silent film projector and a separate sound recording and reproducing unit are provided and minor modification is given to said silent film projector so that said silent film projector can be used as a projection unit only with said minor modification.And especially in this system when said sound unit is attached to said projection unit and continuous film advancing means provided at said sound unit is connected with a driving motor provided at said projection unit through a power transmission mechanism, and at a same time an intermittent film advancing means provided at a projection unit is connected with a part of said power transmission mechanism through a power transmission mechanism of variable speed type, further an output member of a loop sensing means provided at the sound unit is connected with said variable speed power transmission mechanism, so that an operating speed of the intermittent film advancing means at the projection unit is controlled depending on the change in an amount of film loop formed between a projection station of the projection unit and a sound recording and a reproducing station of the sound unit.
摘要:
The present invention relates to an electromagnetically driven shutter device for camera, so designed that a detecting means for detecting the displacement speed of the shutter member and the power supply means for supplying the driving energy to the shutter member are provided in such a manner that the output of the power supply means is varied in accordance with the output of the detecting means so as to maintain the displacement speed of the shutter member constant.
摘要:
A method of manufacturing an epoxy resin composition for semiconductor encapsulating by use of a kneader provided with a suction hole on the downstream side of a kneading region in a conveying direction of the epoxy resin composition, and being provided with a supply orifice and a discharge orifice respectively disposed on the upstream side and the downstream side in the conveying direction of the epoxy resin composition, the method comprising kneading the epoxy resin composition, while discharging a volatile gas from the kneader through the suction hole, and simultaneously introducing outside air to the kneader through the supply orifice and the discharge orifice. Even under conditions of continuous operation of the kneader, it is possible to efficiently discharge a volatile gas, thereby significantly decreasing the quantity of a volatile components remaining in the kneaded epoxy resin composition. Therefore, when semiconductor devices are encapsulated with the epoxy resin composition, the generation of voids can be decreased.
摘要:
To provide a method of producing an encapsulating molding material tablet by which adhesion of an encapsulating molding material to the punch surface of a tablet forming machine can be reduced, an encapsulating molding material tablet produced by this method, and an electronic part apparatus equipped with an element encapsulated using this encapsulating molding material tablet. A method of producing an encapsulating molding material tablet in which a release agent dissolved in a solvent is fed to the punch surface of a tablet forming machine to form a release agent layer having a thickness of over 0.001 μm and less than 0.07 μm on the above-mentioned punch surface, then, an encapsulating molding material is fed to the above-mentioned tablet forming machine for molding the material, an encapsulating molding material tablet produced by this method or having a contact angle ratio of 1.15 or more and less than 1.35, and an electron part apparatus equipped with an element encapsulated using this encapsulating molding material tablet.
摘要:
A method of manufacturing an epoxy resin composition for semiconductor encapsulating by use of a kneader provided with a suction hole on the downstream side of a kneading region in a conveying direction of the epoxy resin composition, and being provided with a supply orifice and a discharge orifice respectively disposed on the upstream side and the downstream side in the conveying direction of the epoxy resin composition, the method comprising kneading the epoxy resin composition, while discharging a volatile gas from the kneader through the suction hole, and simultaneously introducing outside air to the kneader through the supply orifice and the discharge orifice. Even under conditions of continuous operation of the kneader, it is possible to efficiently discharge a volatile gas, thereby significantly decreasing the quantity of a volatile components remaining in the kneaded epoxy resin composition. Therefore, when semiconductor devices are encapsulated with the epoxy resin composition, the generation of voids can be decreased.