公开(公告)号：US4301958A

公开(公告)日：1981-11-24

申请号：US69286

申请日：1979-08-24

申请人： Tatsuo Hatakenaka ,  Kiyouhei Tamaki ,  Tetsuo Nanbu

发明人： Tatsuo Hatakenaka ,  Kiyouhei Tamaki ,  Tetsuo Nanbu

IPC分类号： H01L21/00 ,  H01L21/60 ,  H01L21/58

CPC分类号： H01L24/86 ,  H01L21/67144 ,  B29C2043/5825 ,  B29C2043/5891 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49829

摘要： A system for automatically fabricating and bonding semiconductor devices using lead frames and semiconductor chips, which comprises means for supplying a continuous strip of lead frames, an automatic die bonder for mounting semiconductor chips on the lead frames and forming sheets thereof, buffer means for temporarily storing the sheets formed of the lead frames and semiconductor chips mounted thereon, and at least one automatic wire bonder, all of these apparatuses being arranged in a line. The sheets are automatically and successively fed from the automatic die bonder to the buffer means and from the buffer means to the automatic wire bonder by means of a series of automatic conveyor mechanisms.

摘要翻译： 一种用于使用引线框和半导体芯片自动制造和接合半导体器件的系统，其包括用于提供连续的引线框条的装置，用于将半导体芯片安装在引线框上并形成片的自动管芯接合器，用于临时存储的缓冲装置 由引线框架和安装在其上的半导体芯片形成的片材和至少一个自动引线接合器，所有这些装置都排列成一行。 这些纸张通过一系列自动输送机构自动并连续地从自动模片粘合机进给到缓冲装置，并从缓冲装置自动连接到自动焊接机。