摘要:
There is provided a process of producing a laminate type optical disk comprising the steps of: (1) molding a pair of substrates of a transparent resin at least one of which substrates has irregularities on its one main surface; (2) forming a metal thin film on said one main surface having the irregularities, and then (3) laminating the pair of the substrates while the metal thin film is located inside and bonding the substrates by means of an adhesive which is supplied between the substrates, the process being characterized in that after the step (1), a waiting treatment is carried out in which the molded substrates are cooled to such a temperature that a difference between said temperature and a temperature of an atmosphere surrounding the substrates is not greater than 5° C. while keeping a moisture (or water) content of the substrates not larger than 0.1% by weight, and then the step (2) is carried out.
摘要:
There is provided a process of producing a laminate type optical disk comprising the steps of: (1) molding a pair of substrates of a transparent resin at least one of which substrates has irregularities on its one main surface; (2) forming a metal thin film on said one main surface having the irregularities, and then (3) laminating the pair of the substrates while the metal thin film is located inside and bonding the substrates by means of an adhesive which is supplied between the substrates, the process being characterized in that after the step (1), a waiting treatment is carried out in which the molded substrates are cooled to such a temperature that a difference between said temperature and a temperature of an atmosphere surrounding the substrates is not greater than 5° C. while keeping a moisture (or water) content of the substrates not larger than 0.1% by weight, and then the step (2) is carried out.
摘要:
A half-transmissive film of an optical disk is formed using a Cu oxide instead of Au, while achieving similar reflectivity characteristics to those of Au. Alternatively, the half-transmissive film may comprise a compound of Cu with a corrosion-resistant material, or a stack of layers comprising a lower layer film of Cu, Ag, or Al and an upper layer film of a corrosion-resistant material. Further, the half-transmissive film may comprise ZnS.SiO2, a nitride of Ti, indium-tin-oxide, or an alloy of Au and Cu or a compound including Au and Cu.