-
1.
公开(公告)号:US4662062A
公开(公告)日:1987-05-05
申请号:US703539
申请日:1985-02-20
IPC分类号: H01L29/73 , H01L21/331 , H01L29/10 , H01L29/732 , H01L21/225
CPC分类号: H01L29/66295 , H01L29/1004 , Y10S148/01 , Y10S148/151
摘要: Manufacturing of a graft-base transistor is characterized by: first, forming a layer (8) of oxide of silicon with opening on an n-semiconductor layer (2), at a part to become a base region (3, 4, 3) (FIG. 2a)); then, forming a polycrystalline silicon layer (9) and an overriding silicon nitride layer (10) with an opening (11) thereon (FIG. 2(b)); selectively diffusing P or As to form an n-emitter region (5) (FIG. 2(c)); forming a second silicon oxide layers (12, 13) only on the emitter region (5) and on peripheral regions thereabout, and removing the polycrystalline layer (9) and the silicon nitride layer (10), (FIG. 2(d)) (FIG. 2(e)); and implanting B.sup.+ ions, thereby to form deeper and higher concentration base contact regions (3, 3) and shallower and lower concentration active base region (4).
摘要翻译: 接枝基晶体管的制造的特征在于:首先,在n半导体层(2)上形成具有开口的硅氧化物层(8),部分成为基极区域(3,4) (图2a)); 然后,在其上形成多晶硅层(9)和其上具有开口(11)的覆盖氮化硅层(10)(图2(b)); 选择性地扩散P或As以形成n-发射极区(5)(图2(c)); 仅在发射极区域(5)上形成第二氧化硅层(12,13),并且在其周边区域上形成第二氧化硅层(12,13),并去除多晶层(9)和氮化硅层(10),(图2(d)) (图2(e)); 并注入B +离子,从而形成更深和更高浓度的碱接触区域(3,3)和较浅和较低浓度的活性碱性区域(4)。