公开(公告)号：US07371684B2

公开(公告)日：2008-05-13

申请号：US11130078

申请日：2005-05-16

申请人： Matthew Earl Colburn ,  Ricardo Alves Donaton ,  Conal E. Murray ,  Satyanarayana Venkata Nitta ,  Sampath Purushothaman ,  Sujatha Sankaran ,  Theodorus Eduardus Fransiscus Maria Standaert ,  Xiao Hu Liu

发明人： Matthew Earl Colburn ,  Ricardo Alves Donaton ,  Conal E. Murray ,  Satyanarayana Venkata Nitta ,  Sampath Purushothaman ,  Sujatha Sankaran ,  Theodorus Eduardus Fransiscus Maria Standaert ,  Xiao Hu Liu

IPC分类号： H01L21/302

CPC分类号： H01L21/32139 ,  H01L21/0271 ,  H01L21/31144 ,  H01L21/7682

摘要： A process for preparing an electronics structure involves coating a substrate stack with a sacrificial multilayer hardmask stack, developing a pattern in a resist layer coated on a topmost layer of the multilayer hardmask stack, transferring the pattern into the hardmask stack, blocking a portion of the pattern, and then transferring an unblocked portion of the pattern into the substrate stack. Electronics structures prepared with the process are useful to prepare electronics devices, such as computers and the like. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims.

摘要翻译： 一种用于制备电子结构的方法包括用牺牲多层硬掩模堆叠涂覆衬底叠层，在涂覆在多层硬掩模堆叠的最上层上的抗蚀剂层中形成图案，将图案转移到硬掩模堆叠中，阻挡一部分 图案，然后将图案的未封闭部分转印到基底叠层中。 使用该方法制备的电子结构对制备电子设备（例如计算机等）是有用的。 要强调的是，该摘要被提供以符合要求抽象的规则，这将允许搜索者或其他读者快速地确定技术公开的主题。 提交它的理解是，它不会用于解释或限制所附权利要求的范围或含义。