公开(公告)号：US20140141169A1

公开(公告)日：2014-05-22

申请号：US14123964

申请日：2012-06-29

申请人： Thomas Huelsmann ,  Arno Clicque ,  Dirk Tews ,  Mirko Kloppisch ,  Andry Liong

发明人： Thomas Huelsmann ,  Arno Clicque ,  Dirk Tews ,  Mirko Kloppisch ,  Andry Liong

IPC分类号： B05D3/10 ,  B05D1/32 ,  B05D1/02

CPC分类号： B05D3/102 ,  B05D1/02 ,  B05D1/32 ,  C23C22/52 ,  C23F1/18 ,  H05K3/28 ,  H05K3/385 ,  Y10T428/265

摘要： The present invention relates to a method for increasing the adhesion of organic resist materials on copper or copper alloy surfaces. The copper or copper alloy surface is contacted with an aqueous adhesion promoting solution comprising at least one organic acid, a peroxide compound and optionally one or more substances selected from the group consisting of urea, derivatives thereof and water-soluble polymers.

摘要翻译： 本发明涉及增加有机抗蚀剂材料在铜或铜合金表面上的粘附性的方法。 铜或铜合金表面与包含至少一种有机酸，过氧化物化合物和任选的一种或多种选自脲，其衍生物和水溶性聚合物的物质的水性粘附促进溶液接触。

公开(公告)号：US06373272B1

公开(公告)日：2002-04-16

申请号：US09142391

申请日：1998-09-16

申请人： Reinhard Welsch ,  Claus Dietrich ,  Thomas Huelsmann ,  Dietmar Runge

发明人： Reinhard Welsch ,  Claus Dietrich ,  Thomas Huelsmann ,  Dietmar Runge

IPC分类号： G01R3126

CPC分类号： G01R31/2887

摘要： The present invention provides an apparatus for the testing of semiconductor structures. The apparatus is provided with a chuck for holding a semiconductor wafer and with needle holders for contact needles, the chuck being provided with a fastening device for the semiconductor wafer and being movable for positioning, controlled using a positioning device, in relation to the contact needles. The object of the present invention is to detect faults, in good time and reliably, of non-serviceable or not fully serviceable chips before separation to avoid unnecessary work for separating and assembling defective chips. The object is attained in that the chuck has a receiving area exposing upwards a lower surface of the semiconductor wafer and a receiving plane therefor. The receiving plane is arranged above the needle carrier, and the contact needles point upwards in such a manner that they contact contact islands of the semiconductor chips on the downwardly directed upper surface of the semiconductor wafer.

摘要翻译： 本发明提供一种用于半导体结构测试的装置。 该设备设置有用于保持半导体晶片和用于接触针的针保持器的卡盘，该卡盘设置有用于半导体晶片的紧固装置，并且可移动以使用定位装置相对于接触针定位 。 本发明的目的是在分离之前及时且可靠地检测不可维修或不可完全维修的芯片的故障，以避免用于分离和组装有缺陷的芯片的不必要的工作。 实现目的在于卡盘具有向上暴露半导体晶片的下表面的接收区域和用于其的接收平面。 接收平面布置在针架上方，并且接触针以这样的方式指向上方，使得它们接触半导体晶片的向下指向的上表面上的半导体芯片的接触岛。

公开(公告)号：US09504161B2

公开(公告)日：2016-11-22

申请号：US13884711

申请日：2011-10-24

申请人： Christian Sparing ,  Thomas Huelsmann ,  Arno Clicque ,  Patrick Brooks ,  Adrian Zee ,  Heiko Brunner

发明人： Christian Sparing ,  Thomas Huelsmann ,  Arno Clicque ,  Patrick Brooks ,  Adrian Zee ,  Heiko Brunner

IPC分类号： C23C22/48 ,  C23F1/18 ,  H05K3/00 ,  H05K3/38

CPC分类号： H05K3/383 ,  C23F1/18 ,  H05K3/00 ,  H05K2203/124

摘要： The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).

摘要翻译： 本发明涉及一种用于预处理铜表面的方法，以及用于预处理铜表面以允许形成与塑料基底的紧密结合的方法。 所述溶液包括：a）过氧化氢，b）至少一种酸，和c）至少一种含氮五元杂环化合物，和d）另外至少一种含氮粘附促进化合物，所述化合物 包含或由其内的一个或多个氮原子与至少一个式（I）的残基连接的内酰胺，非季脂肪胺，酰胺和聚酰胺组成。

公开(公告)号：US20140076461A1

公开(公告)日：2014-03-20

申请号：US13884711

申请日：2011-10-24

申请人： Christian Sparing ,  Thomas Huelsmann ,  Arno Clicque ,  Patrick Brooks ,  Adrian Zee ,  Heiko Brunner

发明人： Christian Sparing ,  Thomas Huelsmann ,  Arno Clicque ,  Patrick Brooks ,  Adrian Zee ,  Heiko Brunner

IPC分类号： H05K3/00

CPC分类号： H05K3/383 ,  C23F1/18 ,  H05K3/00 ,  H05K2203/124

摘要： The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).

摘要翻译： 本发明涉及一种用于预处理铜表面的方法，以及用于预处理铜表面以允许形成与塑料基底的紧密结合的方法。 所述溶液包括：a）过氧化氢，b）至少一种酸，和c）至少一种含氮五元杂环化合物，和d）另外至少一种含氮粘附促进化合物，所述化合物 包含或由其内的一个或多个氮原子与至少一个式（I）的残基连接的内酰胺，非季脂肪胺，酰胺和聚酰胺组成。

公开(公告)号：US20120037312A1

公开(公告)日：2012-02-16

申请号：US13265545

申请日：2010-04-15

申请人： Christian Sparing ,  Thomas Huelsmann ,  Patrick Brooks ,  Arno Clicque

发明人： Christian Sparing ,  Thomas Huelsmann ,  Patrick Brooks ,  Arno Clicque

IPC分类号： B32B37/14

CPC分类号： H05K3/389 ,  H05K3/385 ,  H05K2201/2063 ,  H05K2203/0315

摘要： The present invention relates to a process for manufacture of multilayer printed circuit boards and articles formed thereby, especially IC substrates. The inventive process utilizes in individual process steps inorganic silicates and organosilane bonding mixtures to provide adhesion between layers of copper and dielectric materials. Said process leads to an enhanced adhesive strength, improved mechanical and thermal stress resistance as well as humidity resistance of multilayer printed circuit boards and IC substrates.

摘要翻译： 本发明涉及用于制造由此形成的多层印刷电路板和制品的方法，特别是IC基板。 本发明的方法在单独的工艺步骤中利用无机硅酸盐和有机硅烷键合混合物来提供铜和电介质材料的层之间的粘附。 所述方法导致增强的粘合强度，改进的机械和热应力抗性以及多层印刷电路板和IC基片的耐湿性。