Thermally developable materials with buried conductive backside coatings
    1.
    发明申请
    Thermally developable materials with buried conductive backside coatings 有权
    具有埋地导电背面涂层的耐热可开发材料

    公开(公告)号:US20070244004A1

    公开(公告)日:2007-10-18

    申请号:US11403782

    申请日:2006-04-13

    IPC分类号: B41M5/24

    摘要: Thermally developable materials including photothermographic and thermographic materials have a buried conductive backside layer comprising one or more binder polymers in which are dispersed each of at least two types of conductive materials: (1) nanoparticles of one or more conductive metal compounds, and (2) one or more organic solvent soluble inorganic alkali metal salt antistatic compounds. These buried conductive backside coatings provide conductivity that is affected minimally by humidity.

    摘要翻译: 包括光热照相和热成像材料的可热显影材料具有包含一种或多种粘合剂聚合物的掩埋导电背面层,其中分散有至少两种导电材料:(1)一种或多种导电金属化合物的纳米颗粒,和(2) 一种或多种有机溶剂可溶性无机碱金属盐抗静电化合物。 这些掩埋的导电背面涂层提供了受湿度影响最小的电导率。