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公开(公告)号：US5164119A
公开(公告)日：1992-11-17
申请号：US604050
申请日：1990-10-29
IPC分类号： C03C8/18 , H01L23/482 , H01L23/498
CPC分类号： H01L23/49883 , C03C8/18 , H01L23/4828 , H01L2924/0002
摘要： An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.
摘要翻译： 一种改进的银玻璃糊料，用于将硅晶片结合到基本上由银薄片，玻璃，树脂，含有亲液和疏液基团的表面活性剂和溶剂组成的陶瓷基底上。 表面活性剂在银和玻璃周围提供空间屏障，以稳定浆料，并且当使用糊料将模具结合到基底时减少空隙和开裂。
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公开(公告)号：US4986849A
公开(公告)日：1991-01-22
申请号：US248120
申请日：1988-09-23
IPC分类号： B23K35/363 , C03C8/18 , H01L23/482 , H01L23/498
CPC分类号： H01L23/4828 , C03C8/18 , H01L23/49883 , H01L2924/0002 , H01L2924/12044
摘要： An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, lead borate glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.
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公开(公告)号：US5183784A
公开(公告)日：1993-02-02
申请号：US760454
申请日：1991-09-17
IPC分类号： C03C8/18 , H01B1/16 , H01L21/60 , H01L23/498
CPC分类号： H01L24/83 , C03C8/18 , H01B1/16 , H01L23/49883 , H01L24/29 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01056 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/10253 , H01L2924/15787
摘要： An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.
摘要翻译： 一种用于将半导体元件粘合到包含金属树脂酸盐的基底上的改进的银玻璃糊剂。 还可以包括含有亲液和疏液基团的表面活性剂。
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公开(公告)号：US5084421A
公开(公告)日：1992-01-28
申请号：US558327
申请日：1990-07-27
申请人： Thomas L. Herrington
发明人： Thomas L. Herrington
IPC分类号： C03C8/18 , C03C8/24 , H01B1/16 , H01L21/58 , H01L23/482
CPC分类号： H01L24/83 , C03C8/18 , C03C8/24 , H01B1/16 , H01L23/4828 , H01L24/29 , H01L2224/29 , H01L2224/29288 , H01L2224/29339 , H01L2224/8319 , H01L2224/8385 , H01L2224/8389 , H01L2924/00013 , H01L2924/01006 , H01L2924/01011 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787
摘要： An improved sliver-glass paste for bonding a semiconductive element to a substrate comprising silver flake, glass frit, a surfactant, a thixotrope and a low boiling paraffinic hydrocarbon solvent.
摘要翻译： 一种用于将半导体元件粘合到包括银薄片，玻璃料，表面活性剂，触变剂和低沸点链烷烃溶剂的基材上的改进的条状玻璃糊料。
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