摘要:
An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, lead borate glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.
摘要:
An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.
摘要:
An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.
摘要:
Layered interface materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.
摘要:
Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.
摘要:
A composition of matter in liquid form at a temperature of 50° C. or less comprising a monofunctional benzoxazine compound embraced by the structure where R is a member selected from C1-40 alkyl, C2-40 alkenyl, each of which being optionally substituted or interrupted by one or more O, N, S, C═O, COO, and NHC═O, and C6-20 aryl, m is 0-4, and R1-R5 are independently selected from C1-10 alkyl, C2-40 alkenyl, each of which being optionally substituted or interrupted by one or more O, N, S, C═O, COOH, and NHC═O, and C6-20 aryl, and at least one of R1-R5 are present, is provided.
摘要:
A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or “soft gel”. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material is needed to change some of the physical properties of the composition. A method for forming the crosslinkable thermal interface materials disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the crosslinked rubber-resin mixture. The contemplated thermal interface material can be provided as a dispensable liquid paste, a gel, a tape, or a film. Applications of the contemplated thermal interface materials described herein comprise incorporating the materials into a layered material, an electronic component or a finished electronic product.
摘要:
Described is an organosilicon-containing composition with enhanced adhesive properties having about 10 to 80 wt. % of an organic compound component, about 20 to 90 wt. % of one of boron nitride or silver and at least about 0.1 wt. % carbon fibers. The component comprises the reaction product of about 40 to 90 wt. % of the reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form.
摘要:
A rapid curing adhesive formulation that contains 10-40 wt. % of a cyanate ester vehicle having a cyanate ester, alkylphenol and a metal curing catalyst and 60-90 wt. % of thermally and/or electrically conductive filler. The adhesive formulation has a maximum curing time of 5 minutes, preferably 2 minutes, at 200.degree. C. and is adapted for use in high speed processes for production of bonded semiconductor assemblies.