公开(公告)号：US06721602B2

公开(公告)日：2004-04-13

申请号：US09934281

申请日：2001-08-21

Applicant: David B. Engmark ,  Thomas Ceballos ,  Richard A. Bruchmann ,  Kevin K. Tidemand ,  George Patras ,  Todd Schaefer ,  Robert L. Olson

Inventor： David B. Engmark ,  Thomas Ceballos ,  Richard A. Bruchmann ,  Kevin K. Tidemand ,  George Patras ,  Todd Schaefer ,  Robert L. Olson

IPC: A61N1375

CPC classification number: A61N1/3754 ,  A61N1/375

Abstract: In general, the invention is directed to an implantable medical device assembly having a more space-efficient housing and components, as well as processes for assembling the implantable medical device with reduced assembly cost and less complexity. The implantable medical device may incorporate a battery, capacitor, circuit assembly, feedthrough assembly, and interconnect assembly with respective electrical terminals. This configuration permits the use of automated electronic module assembly techniques such as parallel gap or ribbon bond welding to electrically connect the terminals. A feedthrough assembly may present a set of terminals adjacent a corresponding set of circuit terminals, also enabling the use of automated welding techniques.

公开(公告)号：US20060122658A1

公开(公告)日：2006-06-08

申请号：US11004175

申请日：2004-12-03

Applicant: Christine Kronich ,  Todd Schaefer ,  Scott Robinson

Inventor： Christine Kronich ,  Todd Schaefer ,  Scott Robinson

IPC: A61N1/375

CPC classification number: A61N1/375 ,  H01R13/5224 ,  Y10S439/909

Abstract: A laser ribbon bond pad array connector is disclosed for electrically connecting a RF module to an IMD circuit board in an implantable medical device. The array connector includes a connector body with a plurality of electrically isolated bonding fingers embedded in the connector body. Each bonding finger includes a solder pad that is on a first surface of the connector body and a laser ribbon bond pad that is on a second surface of the connector body. The first and second surfaces are spaced apart in angular relations thereof.

Abstract translation: 公开了用于将RF模块电连接到可植入医疗装置中的IMD电路板的激光带接合焊盘阵列连接器。 阵列连接器包括具有嵌入在连接器主体中的多个电隔离的接合指的连接器本体。 每个接合手指包括位于连接器主体的第一表面上的焊盘和位于连接器主体的第二表面上的激光带接合焊盘。 第一和第二表面以其角度关系间隔开。

公开(公告)号：US20060089682A1

公开(公告)日：2006-04-27

申请号：US10973137

申请日：2004-10-26

Applicant: Christine Kronich ,  Todd Schaefer ,  Gregory Haubrich

Inventor： Christine Kronich ,  Todd Schaefer ,  Gregory Haubrich

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  A61N1/37229 ,  H01R12/592 ,  H01R13/5224 ,  H01R2201/02 ,  H01R2201/12 ,  Y10S439/909

Abstract: An RF antenna flexible circuit interconnect is disclosed with unique micro connectors. The RF antenna flexible circuit interconnect further includes a planer flexible body having an embedded RF transmission line with a first end and a second end. A first antenna micro connector is electrically coupled to the first end of the RF transmission line and a second antenna micro connector is electrically coupled to the second end of the RF transmission line. Each of the first and second antenna micro connectors include an antenna micro connector housing and an antenna central contact socket securely positioned within the antenna micro connector housing. The antenna central contact socket may also include inward bending fingers and may be designed to engage a pin that is inserted into the central contact socket.

Abstract translation: 公开了具有独特的微型连接器的RF天线柔性电路互连。 RF天线柔性电路互连还包括具有带有第一端和第二端的嵌入式RF传输线的刨床柔性体。 第一天线微连接器电耦合到RF传输线的第一端，并且第二天线微连接器电耦合到RF传输线的第二端。 第一和第二天线微连接器中的每一个包括天线微连接器壳体和天线中心接触插座，其牢固地定位在天线微连接器壳体内。 天线中心接触插座还可以包括向内弯曲的指状物并且可以被设计成接合插入到中心接触插座中的销。