公开(公告)号：US20070068504A1

公开(公告)日：2007-03-29

申请号：US11604482

申请日：2006-11-27

申请人： Warren Farnworth ,  Tom Muntifering

发明人： Warren Farnworth ,  Tom Muntifering

IPC分类号： B28D1/04

CPC分类号： H01L21/67092 ,  B28D5/0082 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024 ,  B28D5/029 ,  Y10T83/037 ,  Y10T83/0505 ,  Y10T83/0543 ,  Y10T83/7709

摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

公开(公告)号：US20070062511A1

公开(公告)日：2007-03-22

申请号：US11604415

申请日：2006-11-27

申请人： Warren Farnworth ,  Tom Muntifering

发明人： Warren Farnworth ,  Tom Muntifering

IPC分类号： B28D1/04

CPC分类号： H01L21/67092 ,  B28D5/0082 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024 ,  B28D5/029 ,  Y10T83/037 ,  Y10T83/0505 ,  Y10T83/0543 ,  Y10T83/7709

摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

摘要翻译： 公开了一种半导体晶片锯及其用于切割半导体晶片的方法，其包括具有可变横向分度能力的晶片锯和多个叶片。 晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。

公开(公告)号：US20060065262A1

公开(公告)日：2006-03-30

申请号：US11281695

申请日：2005-11-17

申请人： Warren Farnworth ,  Tom Muntifering

发明人： Warren Farnworth ,  Tom Muntifering

IPC分类号： B28D1/04

CPC分类号： H01L21/67092 ,  B28D5/0082 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024 ,  B28D5/029 ,  Y10T83/037 ,  Y10T83/0505 ,  Y10T83/0543 ,  Y10T83/7709

摘要： A semiconductor wafer saw for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

摘要翻译： 公开了一种用于切割半导体晶片的半导体晶片锯，其包括具有可变横向分度能力的晶片锯和多个叶片。 晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。

公开(公告)号：US20050186761A1

公开(公告)日：2005-08-25

申请号：US11108496

申请日：2005-04-18

申请人： Warren Farnworth ,  Tom Muntifering

发明人： Warren Farnworth ,  Tom Muntifering

IPC分类号： B28D5/00 ,  B28D5/02 ,  H01L21/00 ,  H01L21/301 ,  H01L21/50 ,  H01L23/02

CPC分类号： H01L21/67092 ,  B28D5/0082 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024 ,  B28D5/029 ,  Y10T83/037 ,  Y10T83/0505 ,  Y10T83/0543 ,  Y10T83/7709

摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

摘要翻译： 公开了一种半导体晶片锯及其用于切割半导体晶片的方法，其包括具有可变横向分度能力的晶片锯和多个叶片。 晶片锯由于其可变的分度能力，可将其上具有多个不同尺寸的半导体器件的晶片切割成其各自的分立元件。 此外，具有多个叶片的晶片锯，其中一些可相对于其它叶片独立地横向或垂直移动，可以更有效地将硅晶片切割成单独的半导体器件。