公开(公告)号：US20170076971A1

公开(公告)日：2017-03-16

申请号：US15245977

申请日：2016-08-24

申请人： DISCO CORPORATION

发明人： Takeomi Fukuoka

IPC分类号： H01L21/683 ,  B28D5/00 ,  B28D5/02

CPC分类号： H01L21/6838 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024 ,  H01L21/67346 ,  H01L21/6835 ,  H01L2221/68327

摘要： A workpiece support jig includes a support plate supporting a workpiece on a first surface while covering a support surface of a chuck table with a second surface opposite to the first surface and a retainer plate including an area sufficient to cover the whole of the workpiece and sandwiching the workpiece, held on the first surface of the support plate, between the support plate and itself. The support plate includes a plurality of groove parts corresponding to projected division lines of the supported workpiece and a plurality of through holes formed in chip-holding regions demarcated and divided by the intersecting groove parts. When the workpiece divided by a processing unit into chips is unloaded from the chuck table, the workpiece is unloaded while being sandwiched between the support plate and the retainer plate.

摘要翻译： 工件支撑夹具包括：在第一表面上支撑工件的支撑板，同时覆盖具有与第一表面相对的第二表面的卡盘台的支撑表面;以及保持板，该保持板包括足以覆盖整个工件并夹持 保持在支撑板的第一表面上的工件在支撑板和本身之间。 支撑板包括对应于被支撑工件的投影分割线的多个凹槽部分和形成在由交叉凹槽部分划分和划分的芯片保持区域中的多个通孔。 当将由加工单元划分成切屑的工件从卡盘卸载时，工件在夹持在支撑板和保持板之间时被卸载。

公开(公告)号：US20130014738A1

公开(公告)日：2013-01-17

申请号：US13545093

申请日：2012-07-10

申请人： Paolo Molino ,  Rodolfo Bovo

发明人： Paolo Molino ,  Rodolfo Bovo

IPC分类号： B28D1/04

CPC分类号： B28D5/023 ,  B28D5/024 ,  B28D5/029

摘要： Systems and methods are provided for cutting silicon into seed rods for use in a chemical vapor deposition polysilicon reactor. A method includes cutting the silicon ingot with saw blades into silicon slabs, rotating the silicon slabs, and cutting the silicon slabs into smaller-sized silicon seed rods for use in the chemical vapor deposition polysilicon reactor.

摘要翻译： 提供了将硅切割成用于化学气相沉积多晶硅反应器的种子棒的系统和方法。 一种方法包括将具有锯片的硅锭切割成硅板，旋转硅片，以及将硅片切割成用于化学气相沉积多晶硅反应器的较小尺寸的硅种子棒。

公开(公告)号：US20070068504A1

公开(公告)日：2007-03-29

申请号：US11604482

申请日：2006-11-27

申请人： Warren Farnworth ,  Tom Muntifering

发明人： Warren Farnworth ,  Tom Muntifering

IPC分类号： B28D1/04

CPC分类号： H01L21/67092 ,  B28D5/0082 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024 ,  B28D5/029 ,  Y10T83/037 ,  Y10T83/0505 ,  Y10T83/0543 ,  Y10T83/7709

摘要： A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

公开(公告)号：US20050045009A1

公开(公告)日：2005-03-03

申请号：US10927465

申请日：2004-08-27

申请人： Koichi Shigematsu

发明人： Koichi Shigematsu

IPC分类号： G01B13/00 ,  B23D59/00 ,  B23Q17/00 ,  B28D5/00 ,  B28D5/02 ,  H01L21/301 ,  B26F3/00

CPC分类号： B23Q17/006 ,  B23D59/002 ,  B28D5/0094 ,  B28D5/023 ,  Y10T83/364

摘要： To prevent a blowout nozzle from colliding with a workpiece due to a trouble of a backpressure sensor so as to avoid damage to the workpiece in a processing apparatus provided with a backpressure sensor, the backpressure sensor is formed capable of being freely moved at the blowout nozzle thereof in the air blowout direction and in the direction opposite thereto, and provided with a free-movement detecting sensor adapted to detect an actual free-movement of the blowout nozzle.

摘要翻译： 为了防止吹出喷嘴由于背压传感器的问题与工件碰撞，以避免在设置有背压传感器的处理设备中损坏工件，所述背压传感器形成为能够在吹出喷嘴处自由移动 并且设置有适于检测吹出喷嘴的实际自由移动的自由移动检测传感器。

公开(公告)号：US20030070520A1

公开(公告)日：2003-04-17

申请号：US10263794

申请日：2002-10-04

发明人： Takayuki Gawazawa

IPC分类号： B26D003/08 ,  B26D007/02

CPC分类号： B28D5/026 ,  B28D5/023 ,  B28D5/024 ,  Y10T29/49798 ,  Y10T83/0348 ,  Y10T83/037 ,  Y10T83/7487 ,  Y10T83/8847

摘要： A cutting machine comprising a chuck table for holding a workpiece, a spindle unit having a rotary spindle for mounting a cutting blade which cuts the workpiece held on the chuck table, and a spindle unit support mechanism for supporting the spindle unit in such a manner that it can move in a cutting direction, wherein the spindle unit support mechanism comprises a movable base, a guide rail which is provided on the movable base and has a predetermined curvature radius, a spindle unit support member which is movably disposed along the guide rail and mounts the spindle unit, and an angle adjustment mechanism for moving the spindle unit support member along the guide rail to adjust the angle.

摘要翻译： 一种切割机，包括用于保持工件的卡盘台，具有用于安装切割保持在卡盘台上的工件的切割刀片的旋转主轴的主轴单元和用于支撑主轴单元的主轴单元支撑机构， 其可以沿切割方向移动，其中所述主轴单元支撑机构包括可移动基座，设置在所述可移动基座上并具有预定曲率半径的导轨，沿所述导轨可移动地设置的主轴单元支撑构件， 安装主轴单元，以及用于使主轴单元支撑构件沿导轨移动以调整角度的角度调节机构。

公开(公告)号：US06358115B1

公开(公告)日：2002-03-19

申请号：US09456123

申请日：1999-12-07

申请人： Shigemitsu Koike ,  Masayuki Inai ,  Hirokazu Kobayashi ,  Toshimichi Shimizu

发明人： Shigemitsu Koike ,  Masayuki Inai ,  Hirokazu Kobayashi ,  Toshimichi Shimizu

IPC分类号： B24B4900

CPC分类号： B28D5/0076 ,  B23D59/001 ,  B28D5/0082 ,  B28D5/0094 ,  B28D5/023 ,  B28D5/024

摘要： A dicing apparatus is provided with a first position for feeding a workpiece before dicing, a movable machining table capable of retaining the workpiece, a second position for mounting the workpiece before dicing on the machining table, a third position for washing the diced workpieces, a fourth position for retaining the washed workpieces, a dicing mechanism provided at a dicing range spaced apart from the second position, for dicing the workpiece, and a transferring mechanism for transferring the workpiece from the first position to the second position, from the second position to the third position, from the third position to fourth position, respectively. The first to the fourth positions are disposed so as to be circumferentially, equally spaced apart from each other by 90 degrees, and the workpiece transferring mechanism has three rotating arms which in conjunction with each other, form a substantial “T” shape, and at its central portion a shaft for pivoting the rotating arms, each of the rotating arms being provided with a suction head for holding the workpiece.

摘要翻译： 切割装置具有第一位置，用于在切割前进给工件，可移动的加工台能够保持工件，第二位置用于在切割之前将加工工件安装在加工台上，第三位置用于清洗切割的工件， 用于保持被冲洗的工件的第四位置，设置在与第二位置间隔开的切割范围处的切割机构，用于切割工件;以及传送机构，用于将工件从第一位置传递到第二位置，从第二位置到 第三名，分别从第三名到第四名。 第一到第四位置被设置成周向地等间隔地相隔90度，并且工件传送机构具有三个旋转臂，它们彼此结合形成大体上的“T”形，并且在 其中心部分是用于枢转旋转臂的轴，每个旋转臂设置有用于保持工件的吸头。

公开(公告)号：US09472440B2

公开(公告)日：2016-10-18

申请号：US14851611

申请日：2015-09-11

申请人： Texas Instruments Incorporated

发明人： Joseph Cruz Yutuc ,  Leody Navarro Olivares

IPC分类号： H01L21/68 ,  H01L21/683 ,  H01L21/687 ,  H01L23/00

CPC分类号： H01L21/6838 ,  B28D5/0094 ,  B28D5/023 ,  H01L21/561 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/687 ,  H01L21/68707 ,  H01L23/3128 ,  H01L24/00 ,  H01L2221/68327

摘要： A plurality of inserts adapted are to be received in a plurality of holes in a support plate having a first surface adapted to engage a first surface of an integrated cicuirt IC package strip. The support plate has a plurality of holes in fluid communication with a vacuum source and are constructed from a first material having a first hardness. The plurality of inserts are constructed from a second material having a second hardness less than said first hardness.

摘要翻译： 适合的多个插入件将被容纳在支撑板中的多个孔中，该支撑板具有适于接合集成电路IC封装带的第一表面的第一表面。 支撑板具有与真空源流体连通的多个孔，并且由具有第一硬度的第一材料构成。 多个插入件由具有小于所述第一硬度的第二硬度的第二材料构成。

公开(公告)号：US20160293501A1

公开(公告)日：2016-10-06

申请号：US15080919

申请日：2016-03-25

申请人： DISCO CORPORATION

发明人： Satoshi Miyata ,  Makoto Tanaka ,  Sombat Chanvilai

IPC分类号： H01L21/66 ,  H01L21/683 ,  H01L21/78

CPC分类号： H01L22/20 ,  B28D5/0064 ,  B28D5/023 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/12 ,  H01L2221/68327

摘要： Disclosed herein is a method of dividing a wafer including an exposed area incising step of lowering a cutting blade to a preset lowered position for fully severing the wafer to cause the cutting blade to incise an exposed area of a wafer unit, an image capturing step of capturing an image of the exposed area which the cutting blade has incised in the exposed area incising step, with image capturing means, a determining step of determining whether or not it is possible to fully sever the wafer on the basis of the captured image in the image capturing step, and an adjusting step of increasing a distance by which to lower the cutting blade if it is determined that it is impossible to fully sever the wafer in the determining step.

摘要翻译： 本文公开了一种将包括将切割刀片降低到预设降低位置的暴露区域切割步骤的晶片分割的方法，以完全切断晶片以使切割刀片切割晶片单元的暴露区域，图像捕获步骤 拍摄在所述曝光区域切割步骤中所述切割刀片已经切割的所述暴露区域的图像;以及图像捕获装置，确定步骤，基于所述图像中的所捕获的图像来确定是否可能完全切断所述晶片 图像捕获步骤，以及如果在确定步骤中确定不可能完全切断晶片，则增加用于降低切割刀片的距离的调整步骤。

公开(公告)号：US09159603B1

公开(公告)日：2015-10-13

申请号：US14449950

申请日：2014-08-01

申请人： Texas Instruments Incorporated

发明人： Joseph Cruz Yutuc ,  Leody Navarro Olivares

IPC分类号： H01L21/68 ,  H01L21/687

CPC分类号： H01L21/6838 ,  B28D5/0094 ,  B28D5/023 ,  H01L21/561 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/687 ,  H01L21/68707 ,  H01L23/3128 ,  H01L24/00 ,  H01L2221/68327

摘要： An integrated circuit (“IC”) package strip support assembly for a saw table including a first material having a first hardness and having a surface adapted to engage a first surface of an IC package strip during sawing; and a second material having a second hardness and having a surface adapted to engage the first surface of the IC package strip during sawing wherein the second hardness is less than the first hardness.

摘要翻译： 一种用于锯台的集成电路（“IC”）封装条支撑组件，其包括具有第一硬度的第一材料并具有适于在锯切期间接合IC封装带的第一表面的表面; 以及具有第二硬度并具有适于在锯切期间接合IC封装带的第一表面的表面的第二材料，其中第二硬度小于第一硬度。

公开(公告)号：US07001247B2

公开(公告)日：2006-02-21

申请号：US10927465

申请日：2004-08-27

申请人： Koichi Shigematsu

发明人： Koichi Shigematsu

IPC分类号： B24B49/00

CPC分类号： B23Q17/006 ,  B23D59/002 ,  B28D5/0094 ,  B28D5/023 ,  Y10T83/364

摘要： To prevent a blowout nozzle from colliding with a workpiece due to a trouble of a backpressure sensor so as to avoid damage to the workpiece in a processing apparatus provided with a backpressure sensor, the backpressure sensor is formed capable of being freely moved at the blowout nozzle thereof in the air blowout direction and in the direction opposite thereto, and provided with a free-movement detecting sensor adapted to detect an actual free-movement of the blowout nozzle.

摘要翻译： 为了防止吹出喷嘴由于背压传感器的问题与工件碰撞，以避免在设置有背压传感器的处理设备中损坏工件，所述背压传感器形成为能够在吹出喷嘴处自由移动 并且设置有适于检测吹出喷嘴的实际自由移动的自由移动检测传感器。