公开(公告)号：US20090068413A1

公开(公告)日：2009-03-12

申请号：US11822414

申请日：2007-07-05

申请人： Hiroshi Takanashi ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Tomoya Kudo

IPC分类号： B32B3/00 ,  G03F7/028

CPC分类号： G03F7/031 ,  Y10T428/24802

摘要： A negative-working photosensitive resin composition is dis-closed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I): R1—X  (I) wherein —X represents —OR2, —COOH, —SO3H, —CONHR2, —COR2, —SO2NHR2, —HNCONHR2, or —HNCOOR2; R1 and R2, which may be the same or different, each represents a hydrogen atom, a substituted or unsubstituted, saturated or unsaturated hydrocarbon group, provided that it does not contain a radical polymerizable ethylenic double bond, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, or a heterocyclic group; they may have an ether bond in the chain, provided that when —X is —OH, then R1 represents a group other than a hydrogen atom and an aromatic hydrocarbon group, in a range of 0.001-0.3 wt % based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

摘要翻译： 负成色感光性树脂组合物是闭合的，其包含（A）成膜聚合物，（B）具有可自由基聚合的烯属双键的不饱和化合物，（C）光聚合引发剂，和（D）热聚合 抑制剂，其中所述树脂组合物还含有（E）选自下述式（I）表示的化合物中的至少一种：<？在线式描述=“在线式”末端=“铅”→> R1- 其中-X表示-OR2，-COOH，-SO3H，-CONHR2，-COR2，-SO2NHR2，-HNCONHR2，其中-X表示 - ，或-HNCOOR2; 可以相同或不同的R 1和R 2各自表示氢原子，取代或未取代的饱和或不饱和烃基，条件是它不含可自由基聚合的烯属双键，取代或未取代的脂环族烃基， 取代或未取代的芳族烃基或杂环基; 它们可以在链中具有醚键，条件是当-X是-OH时，则R1代表氢原子和芳香族烃基以外的基团，其重量在0.001-0.3重量％的范围内 感光性树脂组合物。 还公开了使用该感光性树脂组合物的感光性树脂板。 通过本发明，提供了特别优异的高亮区域和独立细线的再现性并且具有深的非印刷深度和良好的分辨性的负型感光性树脂组合物和使用该树脂组合物的感光性树脂板。

公开(公告)号：US20070111141A1

公开(公告)日：2007-05-17

申请号：US11646326

申请日：2006-12-28

申请人： Hiroshi Takanashi ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Tomoya Kudo

IPC分类号： G03C1/00

CPC分类号： G03F7/031 ,  G03F7/027

摘要： A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

摘要翻译： 公开了一种负性感光性树脂组合物，其包含（A）成膜性聚合物，（B）具有自由基聚合性烯键式双键的不饱和化合物，（C）光聚合引发剂，（D）热聚合抑制剂， 其中所述树脂组合物还含有（E）选自下式表示的化合物中的至少一种：基于感光性树脂组合物的重量为3.5重量％以下的范围。 还公开了使用该感光性树脂组合物的感光性树脂板。 通过本发明，提供了特别优异的高亮区域和独立细线的再现性并且具有深的非印刷深度和良好的分辨性的负型感光性树脂组合物和使用该树脂组合物的感光性树脂板。

公开(公告)号：US20060275702A1

公开(公告)日：2006-12-07

申请号：US11504080

申请日：2006-08-15

申请人： Hiroshi Takanashi ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Tomoya Kudo

IPC分类号： G03C1/00

CPC分类号： G03F7/031 ,  Y10T428/24802

摘要： A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I): R1-X   (I) wherein -X represents —OR2, —COOH, —SO3H, —CONHR2, —COR2, —SO2NHR2, —HNCONHR2, or —HNCOOR2; R1 and R2, which may be the same or different, each represents a hydrogen atom, a substituted or unsubstituted, saturated or unsaturated hydrocarbon group, provided that it does not contain a radical polymerizable ethylenic double bond, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, or a heterocyclic group; they may have an ether bond in the chain, provided that when -X is —OH, then R1 represents a group other than a hydrogen atom and an aromatic hydrocarbon group, in a range of 0.001-0.3 wt % based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

公开(公告)号：US20060147838A1

公开(公告)日：2006-07-06

申请号：US11363204

申请日：2006-02-28

申请人： Hiroshi Takanashi ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Tomoya Kudo

IPC分类号： G03C1/76

CPC分类号： G03F7/031 ,  G03F7/027

摘要： A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

摘要翻译： 公开了一种负性感光性树脂组合物，其包含（A）成膜性聚合物，（B）具有自由基聚合性烯键式双键的不饱和化合物，（C）光聚合引发剂，（D）热聚合抑制剂， 其中所述树脂组合物还含有（E）选自下式表示的化合物中的至少一种：基于感光性树脂组合物的重量为3.5重量％以下的范围。 还公开了使用该感光性树脂组合物的感光性树脂板。 通过本发明，提供了特别优异的高亮区域和独立细线的再现性并且具有深的非印刷深度和良好的分辨性的负型感光性树脂组合物和使用该树脂组合物的感光性树脂板。

公开(公告)号：US20060057495A1

公开(公告)日：2006-03-16

申请号：US11263847

申请日：2005-11-02

申请人： Hiroshi Takanashi ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Tomoya Kudo

IPC分类号： G03C1/76

CPC分类号： G03F7/031 ,  Y10T428/24802

摘要： A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I): R1—X  (I) wherein —X represents —OR2, —COOH, —SO3H, —CONHR2, —COR2, —SO2NHR2, —HNCONHR2, or —HNCOOR2; R1 and R2, which may be the same or different, each represents a hydrogen atom, a substituted or unsubstituted, saturated or unsaturated hydrocarbon group, provided that it does not contain a radical polymerizable ethylenic double bond, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, or a heterocyclic group; they may have an ether bond in the chain, provided that when —X is —OH, then R1represents a group other than a hydrogen atom and an aromatic hydrocarbon group, in a range of 0.001-0.3 wt % based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

摘要翻译： 公开了一种负性感光性树脂组合物，其包含（A）成膜性聚合物，（B）具有自由基聚合性烯键式双键的不饱和化合物，（C）光聚合引发剂，（D）热聚合抑制剂， 其中所述树脂组合物还含有（E）至少一种选自下式（

公开(公告)号：US20100068480A1

公开(公告)日：2010-03-18

申请号：US12591301

申请日：2009-11-16

申请人： Hiroshi Takanashi ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Tomoya Kudo

IPC分类号： G03F7/004 ,  B32B5/00

CPC分类号： G03F7/031 ,  Y10T428/24802

摘要： A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I): R1—X   (I) wherein —X represents —OR2, —COOH, —SO3H, —CONHR2, —COR2, —SO2NHR2, —HNCONHR2, or —HNCOOR2; R1 and R2, which may be the same or different, each represents a hydrogen atom, a substituted or unsubstituted, saturated or unsaturated hydrocarbon group, provided that it does not contain a radical polymerizable ethylenic double bond, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, or a heterocyclic group; they may have an ether bond in the chain, provided that when —X is —OH, then R1 represents a group other than a hydrogen atom and an aromatic hydrocarbon group, in a range of 0.001-0.3 wt % based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

摘要翻译： 公开了一种负性感光性树脂组合物，其包含（A）成膜性聚合物，（B）具有自由基聚合性烯键式双键的不饱和化合物，（C）光聚合引发剂，（D）热聚合抑制剂， 其中所述树脂组合物还含有（E）选自下述式（I）表示的化合物中的至少一种：R1-X（I）其中-X表示-OR2，-COOH，-SO3H，-CONHR2，-COR2， - SO2NHR2，-HNCONHR2或-HNCOOR2; 可以相同或不同的R 1和R 2各自表示氢原子，取代或未取代的饱和或不饱和烃基，条件是它不含可自由基聚合的烯属双键，取代或未取代的脂环族烃基， 取代或未取代的芳族烃基或杂环基; 它们可以在链中具有醚键，条件是当-X是-OH时，则R1代表氢原子和芳香族烃基以外的基团，其重量在0.001-0.3重量％的范围内 感光性树脂组合物。 还公开了使用该感光性树脂组合物的感光性树脂板。 通过本发明，提供了特别优异的高亮区域和独立细线的再现性并且具有深的非印刷深度和良好的分辨性的负型感光性树脂组合物和使用该树脂组合物的感光性树脂板。

公开(公告)号：US20100055612A1

公开(公告)日：2010-03-04

申请号：US12588905

申请日：2009-11-02

申请人： Hiroshi Takanashi ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Tomoya Kudo

IPC分类号： G03F7/004

CPC分类号： G03F7/031 ,  G03F7/027

摘要： A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep nonprinting depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

摘要翻译： 公开了一种负性感光性树脂组合物，其包含（A）成膜性聚合物，（B）具有自由基聚合性烯键式双键的不饱和化合物，（C）光聚合引发剂，（D）热聚合抑制剂， 其中所述树脂组合物还含有（E）选自下式表示的化合物中的至少一种：基于感光性树脂组合物的重量为3.5重量％以下的范围。 还公开了使用该感光性树脂组合物的感光性树脂板。 通过本发明，提供了一种特别优异的高亮区域和独立细线的再现性并且具有深的非印刷深度和良好的分辨性的负性感光性树脂组合物和使用该树脂组合物的感光性树脂板。

公开(公告)号：US20080119581A1

公开(公告)日：2008-05-22

申请号：US11883063

申请日：2005-12-28

申请人： Hiroshi Takanashi ,  Syozo Miyazawa ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Syozo Miyazawa ,  Tomoya Kudo

IPC分类号： C08F2/46 ,  D06M15/277

CPC分类号： C23C18/06 ,  C07C233/20 ,  C08F2/48 ,  C08F220/58 ,  C23C18/02 ,  C23C18/04 ,  C23C18/08 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/40 ,  G03F7/405 ,  H01L21/76838 ,  H05K1/0306 ,  H05K3/105 ,  H05K3/185 ,  H05K2203/0525 ,  H05K2203/121

摘要： The present invention provides a process for forming a metal pattern in which a metal is chemically absorbed, and a pattern forming material and a crosslinkable monomer used for the process. The process includes: a step for forming a pattern by photolithography including an exposure step for carrying out exposure with a purified water-based developer having a pH of less than 7 on a pattern forming material containing (A) a matrix polymer having at least one of a carboxyl and a sulfonate group, and a rinsing step; a step for forming a metal-containing pattern by immersing the pattern in an aqueous solution containing a metal compound to allow for chemical absorption of a metal ion or a complex ion to the pattern; and a step for forming a metal pattern containing the elemental metal or further containing metal oxide by sintering the metal-containing pattern. A crosslinkable monomer containing a condensation product of a polyhydric alcohol with N-methylol(meth)acrylamide was used.

摘要翻译： 本发明提供一种用于形成其中化学吸收金属的金属图案的方法，以及用于该方法的图案形成材料和可交联单体。 该方法包括：通过光刻形成图案的步骤，包括用于在含有（A）具有至少一个基质聚合物的基质聚合物的图案形成材料上进行用pH小于7的纯化水性显影剂进行曝光的曝光步骤 的羧基和磺酸酯基，和漂洗步骤; 通过将图案浸渍在含有金属化合物的水溶液中以允许化学吸收金属离子或复合离子到图案上来形成含金属图案的步骤; 以及通过烧结含金属图案形成含有元素金属或进一步含有金属氧化物的金属图案的步骤。 使用含有多元醇与N-羟甲基（甲基）丙烯酰胺的缩合物的交联性单体。

公开(公告)号：US20090075200A1

公开(公告)日：2009-03-19

申请号：US12289749

申请日：2008-11-03

申请人： Hiroshi Takanashi ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Tomoya Kudo

IPC分类号： G03F7/028

CPC分类号： G03F7/031 ,  G03F7/027

摘要： A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep nonprinting depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

摘要翻译： 公开了一种负性感光性树脂组合物，其包含（A）成膜性聚合物，（B）具有自由基聚合性烯键式双键的不饱和化合物，（C）光聚合引发剂，（D）热聚合抑制剂， 其中所述树脂组合物还含有（E）选自下式表示的化合物中的至少一种：基于感光性树脂组合物的重量为3.5重量％以下的范围。 还公开了使用该感光性树脂组合物的感光性树脂板。 通过本发明，提供了一种特别优异的高亮区域和独立细线的再现性并且具有深的非印刷深度和良好的分辨性的负性感光性树脂组合物和使用该树脂组合物的感光性树脂板。

公开(公告)号：US20080070160A1

公开(公告)日：2008-03-20

申请号：US11979512

申请日：2007-11-05

申请人： Hiroshi Takanashi ,  Tomoya Kudo

发明人： Hiroshi Takanashi ,  Tomoya Kudo

IPC分类号： G03C1/00

CPC分类号： G03F7/031 ,  G03F7/027

摘要： A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photo-sensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

摘要翻译： 公开了一种负性感光性树脂组合物，其包含（A）成膜性聚合物，（B）具有自由基聚合性烯键式双键的不饱和化合物，（C）光聚合引发剂，（D）热聚合抑制剂， 其中所述树脂组合物还含有（E）选自下式表示的化合物中的至少一种：相对于感光性树脂组合物的重量，在3.5重量％以下的范围内。 还公开了使用该感光性树脂组合物的感光性树脂板。 通过本发明，提供了特别优异的高亮区域和独立细线的再现性并且具有深的非印刷深度和良好的分辨性的负型感光性树脂组合物和使用该树脂组合物的感光性树脂板。