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233 条记录 (耗时 0.016 秒)

    SUPPORT BASE
    1.
    发明申请
    SUPPORT BASE 审中-公开

    公开(公告)号：US20190217440A1

    公开(公告)日：2019-07-18

    申请号：US16246724

    申请日：2019-01-14

    申请人： DISCO CORPORATION

    发明人： Sakae MATSUZAKI

    IPC分类号： B24B41/06 ,  B23Q17/20

    CPC分类号： B24B41/068 ,  B23Q17/20

    摘要： A support base supports a plate-shaped workpiece. The support base includes a flat plate-shaped box member having a support face for supporting a workpiece and a placement face that is a face on the opposite side to the support face and is placed on a holding face of a chuck table, a temperature measurement unit accommodated in the box member, and a battery accommodated in the box member and serving as a power supply for the temperature measurement unit. The temperature measurement unit includes a temperature measuring instrument that measures a temperature at the support face, and a recording unit that records the temperature measured by the temperature measuring instrument.

    Processing apparatus
    4.
    发明授权
    Processing apparatus 有权

    公开(公告)号：US09975274B2

    公开(公告)日：2018-05-22

    申请号：US14800904

    申请日：2015-07-16

    申请人： DISCO CORPORATION

    发明人： Ryosuke Nagao

    IPC分类号： B25B11/00 ,  B28D7/04 ,  B24B27/06 ,  B24B55/02

    CPC分类号： B28D7/046 ,  B24B27/0683 ,  B24B41/068 ,  B24B49/08 ,  B24B55/02 ,  B24B55/03 ,  B25B11/005 ,  B28D5/0076 ,  B28D5/0094 ,  H01L21/67017 ,  H01L21/67253 ,  H01L21/6838

    摘要： A processing apparatus includes a chuck table for holding a plate-like workpiece under suction. A suction unit is connected to the chuck table, and a processing unit is configured to process the workpiece while supplying processing water to the workpiece. The suction unit includes a first suction source, a first pipe providing fluid communication between the first suction source and the chuck table, a separator arranged in the first pipe, for separating a gas and a liquid drawn in from the chuck table, and a water discharging unit configured to discharge the liquid separated by the separator. The water discharging unit includes a second suction source, a second pipe providing fluid communication between the second suction source and a water discharge port of the separator, and a check valve arranged in the second pipe, for preventing a fluid from flowing from the second suction source to the separator.

    GLASS-PLATE WORKING APPARATUS
    5.
    发明申请
    GLASS-PLATE WORKING APPARATUS 审中-公开

    公开(公告)号：US20180036856A1

    公开(公告)日：2018-02-08

    申请号：US15553025

    申请日：2016-05-13

    申请人： BANDO KIKO CO., LTD.

    发明人： Kazuaki BANDO

    IPC分类号： B24B9/10 ,  C03C19/00 ,  B24B41/06

    CPC分类号： B24B9/10 ,  B24B41/06 ,  B24B41/068 ,  B65G49/064 ,  B65G49/066 ,  B65G2249/04 ,  C03B33/033 ,  C03C19/00

    摘要： A glass-plate working apparatus 1 includes: two grinding worktables 17A and 17B which undergo NC controlled movement or angularly controlled rotation independently of each other and a grinding head 18 which undergoes NC controlled movement in correspondence with the grinding worktables 17A and 17B, wherein the grinding worktables 17A and 17B are adapted to alternately move in a planar coordinate system in cooperation with the grinding head 18 and alternately repeat operation in which while one of the grinding worktables 17A and 17B, while holding a glass plate 2, is effecting the grinding of the glass plate 2 by the grinding head 18, the other one of the grinding worktables 17A and 17B effects an operation of discharging the glass plate 2 and receiving a next glass plate 2, to thereby allow the grinding head 18 to proceed with grinding on a continual basis.

    RUBBING DEVICE AND RUBBING METHOD
    7.
    发明申请
    RUBBING DEVICE AND RUBBING METHOD 有权
    橡胶装置和橡胶方法

    公开(公告)号：US20150065015A1

    公开(公告)日：2015-03-05

    申请号：US14235423

    申请日：2013-12-31

    申请人： Shihying Sun

    发明人： Shihying Sun

    IPC分类号： G02F1/1337 ,  B24B1/00 ,  G02F1/1368

    CPC分类号： G02F1/133784 ,  B24B1/00 ,  B24B7/07 ,  B24B7/228 ,  B24B9/065 ,  B24B27/0076 ,  B24B41/068 ,  B24B55/06 ,  G02F1/1337

    摘要： The present invention relates to a rubbing device and a rubbing method. The rubbing device includes: a substrate carrier, an aligning roller having a surface that is rubbing fabric, a driving mechanism that drives the substrate carrier and the substrate that is to be subjected to alignment treatment carried thereby to undergo a translational movement, and an elevation arm. The lower surface of the aligning roller is made suitable to contact and rub the upper surface of the substrate that is to be subjected to alignment treatment and side edges of the upper surface of the substrate that is to be subjected to alignment treatment are made suitable to scrape the lower surface of the aligning roller. The substrate carrier is provided in a top thereof with channels corresponding to two opposite side edges of the substrate that is to be subjected to alignment treatment in the translational movement direction. The channels are arranged to be suitable to have the two side edges of the substrate that is to be subjected to alignment treatment respectively suspending in the channels. The present invention also provides a rubbing method. The rubbing device and the rubbing method of the present invention use a substrate that is to be subjected to alignment treatment to scrape PI chips from the aligning roller into channels so as to prevent the PI chips from moving with the aligning roller to spread over an AA zone of the substrate that is to be subjected to alignment treatment, thereby improving the defects of bright spots and mura generated in a rubbing process.

    摘要翻译： 摩擦装置和摩擦方法技术领域本发明涉及摩擦装置和摩擦方法。 摩擦装置包括：基板载体，具有作为摩擦织物的表面的对准辊;驱动基板载体的驱动机构和待进行对准处理的基板进行平移运动;以及高度 臂。 对准辊的下表面适于接触和摩擦要进行取向处理的基板的上表面，并且使待对准处理的基板的上表面的侧边缘适于 刮削对齐辊的下表面。 衬底载体在其顶部设置有与沿着平移运动方向进行取向处理的衬底的两个相对侧边缘对应的通道。 这些通道被布置成适于使待经受对准处理的基板的两个侧边缘分别悬挂在通道中。 本发明还提供一种摩擦方法。 本发明的摩擦装置和摩擦方法使用要进行取向处理的基板，将来自对准辊的PI芯片刮擦成通道，以防止PI芯片与对准辊一起移动以扩展到AA 要进行取向处理的基板的区域，从而改善在摩擦处理中产生的亮点和凹痕的缺陷。

    Methods and apparatus for pre-chemical mechanical planarization buffing module
    8.
    发明授权
    Methods and apparatus for pre-chemical mechanical planarization buffing module 有权
    预化学机械平面抛光模块的方法和装置

    公开(公告)号：US08968055B2

    公开(公告)日：2015-03-03

    申请号：US13459177

    申请日：2012-04-28

    申请人： Hui Chen ,  Allen L. D'Ambra ,  Jim Atkinson ,  Hung Chen

    发明人： Hui Chen ,  Allen L. D'Ambra ,  Jim Atkinson ,  Hung Chen

    IPC分类号： B24B1/00

    CPC分类号： B24B37/107 ,  B24B41/068

    摘要： The present invention provides methods and apparatus for a pre-CMP semiconductor substrate buffing module. The invention includes a polishing pad assembly adapted to be rotated against a major surface of a substrate; a chuck adapted to hold the substrate and to rotate the substrate against the polishing pad assembly as the polishing pad assembly is rotated; and a lateral motion motor adapted to oscillate the polishing pad assembly laterally across the major surface of the substrate while the polishing pad assembly is rotated against the rotating substrate. Numerous additional features are disclosed.

    摘要翻译： 本发明提供了用于CMP前半导体衬底抛光模块的方法和装置。 本发明包括适于相对于基底的主表面旋转的抛光垫组件; 当所述抛光垫组件旋转时，卡盘适于保持所述基底并且将所述基底旋转抵靠所述抛光垫组件; 以及横向运动电动机，其适于在抛光垫组件相对于旋转衬底旋转的同时横向穿过衬底的主表面振荡抛光垫组件。 公开了许多附加特征。

    APPARATUSES AND SYSTEMS FOR FINISHING THREE-DIMENSIONAL SURFACES
    9.
    发明申请
    APPARATUSES AND SYSTEMS FOR FINISHING THREE-DIMENSIONAL SURFACES 审中-公开
    完成三维表面的装置和系统

    公开(公告)号：US20140235141A1

    公开(公告)日：2014-08-21

    申请号：US14265028

    申请日：2014-04-29

    申请人： Apple Inc.

    发明人： Max A. Maloney ,  Howard E. Bujtor ,  Brian K. Miehm

    IPC分类号： B24B49/04

    CPC分类号： B24B49/04 ,  B24B27/0038 ,  B24B29/00 ,  B24B37/04 ,  B24B37/30 ,  B24B41/068 ,  B24B49/16

    摘要： A method and an apparatus for smart automation of robotic surface finishing of a three-dimensional surface of a work piece is described. A three-dimensional motion path is created along the surface of the work piece. A variable contact force profile is specified along the three-dimensional motion path. The three-dimensional motion path is modified based on the specified variable contact force profile. The surface of the work piece is finished using one or more surface finishing tools along the modified three-dimensional motion path. The surface of the work piece includes at least a flat region and a curved region.

    摘要翻译： 描述了用于工件的三维表面的机器人表面精加工的智能自动化的方法和装置。 沿着工件的表面产生三维运动路径。 沿三维运动路径指定可变接触力分布。 基于指定的可变接触力曲线修改三维运动路径。 使用一个或多个沿修改的三维运动路径的表面加工工具完成工件的表面。 工件的表面至少包括平坦区域和弯曲区域。