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公开(公告)号:US06787425B1
公开(公告)日:2004-09-07
申请号:US10462409
申请日:2003-06-16
申请人: Antonio Luis Pacheco Rotondaro , Trace Quentin Hurd , Stephanie Watts Butler , Majid M. Mansoori
发明人: Antonio Luis Pacheco Rotondaro , Trace Quentin Hurd , Stephanie Watts Butler , Majid M. Mansoori
IPC分类号: H01L21336
CPC分类号: H01L29/66583 , H01L29/665 , H01L29/66545 , H01L29/66628 , H01L29/66772 , H01L29/7834
摘要: Methods are presented for fabricating MOS transistors, in which a sacrificial material such as silicon germanium is formed over a gate contact material prior to gate patterning. The sacrificial material is then removed following sidewall spacer formation to provide a recess at the top of the gate structure. The recess provides space for optional epitaxial silicon formation and suicide formation over the gate contact material without overflowing the tops of the sidewall spacers to minimize shorting between the gate and the source/drains in the finished transistor.
摘要翻译: 提出了用于制造MOS晶体管的方法,其中在栅极图案化之前在栅极接触材料上形成诸如硅锗的牺牲材料。 然后在侧壁间隔物形成之后去除牺牲材料,以在栅极结构的顶部提供凹陷。 该凹槽为栅极接触材料上的任选的外延硅形成和硅化物形成提供了空间,而不会溢出侧壁间隔物的顶部,以最小化最终晶体管中的栅极和源极/漏极之间的短路。
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2.
公开(公告)号:US20110117751A1
公开(公告)日:2011-05-19
申请号:US12921262
申请日:2009-03-06
申请人: Prerna Sonthalia , Emanuel I. Cooper , David Minsek , Peng Zhang , Melissa A. Petruska , Brittany Serke , Trace Quentin Hurd
发明人: Prerna Sonthalia , Emanuel I. Cooper , David Minsek , Peng Zhang , Melissa A. Petruska , Brittany Serke , Trace Quentin Hurd
IPC分类号: H01L21/306 , C09K13/00 , C09K13/06
CPC分类号: C11D7/10 , C11D1/62 , C11D3/2044 , C11D3/2068 , C11D3/33 , C11D3/3719 , C11D7/263 , C11D7/3245 , C11D11/0047 , H01L21/02063 , H01L21/31111
摘要: Composition and method to remove undoped silicon-containing materials from microelectronic devices at rates greater than or equal to the removal of doped silicon-containing materials.
摘要翻译: 从微电子器件以大于或等于去除掺杂含硅材料的速率除去未掺杂的含硅材料的组合物和方法。
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公开(公告)号:US07132365B2
公开(公告)日:2006-11-07
申请号:US10914928
申请日:2004-08-10
IPC分类号: H01L21/4763
CPC分类号: H01L21/28518 , H01L21/76829
摘要: A method of preparing a die comprises treating exposed silicon to form an oxide prior to silicide formation; and depositing metal on the oxide. The metal may comprise titanium, cobalt, nickel, platinum, palladium, tungsten, molybdenum, or combinations thereof on the oxide. The oxide may be less than or equal to about 15 angstroms thick. In various embodiments, treating exposed silicon to form an oxide comprises forming a non-thermal oxide. Treating exposed silicon to form an oxide may also comprise treating the exposed silicon with an oxidizing plasma; alternatively, treating exposed silicon to form an oxide may comprise forming a chemical oxide. In certain other embodiments, treating exposed silicon to form an oxide comprises treating exposed silicon with a solution comprising ammonium hydroxide, hydrogen peroxide, and water; hydrochloric acid, hydrogen peroxide, and water; hydrogen peroxide; ozone; ozonated deionized water; or combinations thereof.
摘要翻译: 制备模具的方法包括在硅化物形成之前处理暴露的硅以形成氧化物; 并在氧化物上沉积金属。 金属可以在氧化物上包含钛,钴,镍,铂,钯,钨,钼或其组合。 氧化物可以小于或等于约15埃厚。 在各种实施方案中,处理暴露的硅以形成氧化物包括形成非热氧化物。 处理暴露的硅以形成氧化物还可以包括用氧化等离子体处理暴露的硅; 或者,处理暴露的硅以形成氧化物可包括形成化学氧化物。 在某些其他实施方案中,处理暴露的硅以形成氧化物包括用包含氢氧化铵,过氧化氢和水的溶液处理暴露的硅; 盐酸,过氧化氢和水; 过氧化氢; 臭氧; 臭氧化去离子水; 或其组合。
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