公开(公告)号：US06705782B2

公开(公告)日：2004-03-16

申请号：US10026601

申请日：2001-12-27

申请人： Tsai Ching Cheng

发明人： Tsai Ching Cheng

IPC分类号： B41J516

CPC分类号： G06F1/1616 ,  G06F1/1662 ,  G06F3/0221 ,  H01H9/52 ,  H01H2209/024 ,  H01H2221/006 ,  H01H2223/002 ,  H01H2227/002 ,  H01H2227/036 ,  H01H2239/034

摘要： A keyboard for a computer includes a bottom board arranged to contain keys, and a sealing layer adhered to the lower surface of the bottom board; wherein the sealing layer is installed with a dividing structure consisted of at least one or more grooves, slits or apertures. The dividing structure is used for breaking up the totality of the sealing layer, so that when the bottom board and the sealing layer are to be adhered integrally via the baking procedure, the condition of distortion therebetween caused by the different thermal expansion coefficients of the two materials due to temperature change is to be prevented, so as to maintain the smoothness of the keyboard, and expedite the assembly process.

摘要翻译： 计算机的键盘包括布置成容纳键的底板和粘附到底板的下表面的密封层; 其中所述密封层安装有由至少一个或多个凹槽，狭缝或孔组成的分隔结构。 分隔结构用于破坏密封层的总体，使得当底板和密封层通过烘烤程序被一体地粘合时，由两个不同的热膨胀系数引起的变形条件 要防止由于温度变化引起的材料，从而保持键盘的平滑度，并且加快组装过程。