公开(公告)号：US5746434A

公开(公告)日：1998-05-05

申请号：US675994

申请日：1996-07-09

申请人： Trace L. Boyd ,  Richard D. Beer ,  Eric A. Terbeek ,  Vernon W. H. Wong

发明人： Trace L. Boyd ,  Richard D. Beer ,  Eric A. Terbeek ,  Vernon W. H. Wong

IPC分类号： F16J15/02 ,  H01J37/18 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/6719 ,  H01J37/18 ,  H01J37/32458 ,  H01L21/67126 ,  H01L21/67196 ,  H01J2237/166 ,  Y10S414/139

摘要： Disclosed is a method for implementing a vacuum seal between an interface of a transport chamber interface port of a transport chamber and another chamber. The transport chamber being configured to mate with the another chamber in an adjacent relationship. The method includes placing an insert plate having a sealing surface containing a first O-ring into the transport chamber interface port such that the first O-ring is sandwiched between the sealing surface and a surface of the another chamber. Therefore, a vacuum seal is achieved between the transport chamber and the another chamber within the transport chamber interface port via the first O-ring.

公开(公告)号：US5262029A

公开(公告)日：1993-11-16

申请号：US440478

申请日：1989-11-21

申请人： David Erskine ,  Randall S. Mundt ,  Dariush Rafinejad ,  Vernon W. H. Wong ,  Gerald Z. Yin

发明人： David Erskine ,  Randall S. Mundt ,  Dariush Rafinejad ,  Vernon W. H. Wong ,  Gerald Z. Yin

IPC分类号： C23C16/458 ,  H01L21/687 ,  C23F1/02

CPC分类号： H01L21/68721 ,  C23C16/4585 ,  H01L21/68735

摘要： A wafer clamping mechanism includes a clamp ring having a central opening corresponding to the geometry of a conventional semiconductor wafer. An overhang located about the opening engages the corresponding semiconductor wafer when in place on an electrode of a plasma reactor. The clamp ring is resiliently mounted on a housing which holds a second electrode. The clamp ring is automatically engaged against the wafer as the spacing between the two electrodes is adjusted to a desired gap width. A raised annular barrier on the lower electrode circumscribes the wafer and engages a mating surface on the clamp ring in order to enhance alignment of the clamp.

摘要翻译： 晶片夹持机构包括具有对应于常规半导体晶片的几何形状的中心开口的夹紧环。 当位于等离子体反应器的电极上时，位于开口周围的突出端与相应的半导体晶片接合。 夹环弹性地安装在保持第二电极的壳体上。 夹紧环自动地接合在晶片上，因为两个电极之间的间距被调节到期望的间隙宽度。 下电极上的凸起的环形阻挡件限制晶片并与夹紧环上的配合表面接合，以增强夹具的对准。

公开(公告)号：US6010133A

公开(公告)日：2000-01-04

申请号：US883951

申请日：1997-06-27

申请人： Trace L. Boyd ,  Richard D. Beer ,  Eric A. Terbeek ,  Vernon W. H. Wong

发明人： Trace L. Boyd ,  Richard D. Beer ,  Eric A. Terbeek ,  Vernon W. H. Wong

IPC分类号： F16J15/02 ,  H01J37/18 ,  H01L21/00 ,  H01L21/677 ,  F16J15/00

CPC分类号： H01L21/6719 ,  H01J37/18 ,  H01J37/32458 ,  H01L21/67126 ,  H01L21/67196 ,  H01J2237/166 ,  Y10S414/139

摘要： Disclosed is a method for implementing a vacuum seal between an interface of a transport chamber interface port of a transport chamber and another chamber. The transport chamber being configured to mate with the another chamber in an adjacent relationship. The method includes placing an insert plate having a sealing surface containing a first O-ring into the transport chamber interface port such that the first O-ring is sandwiched between the sealing surface and a surface of the another chamber. Therefore, a vacuum seal is achieved between the transport chamber and the another chamber within the transport chamber interface port via the first O-ring.

摘要翻译： 公开了一种用于在传送室的传送室接口端口的接口与另一个室之间实现真空密封的方法。 传送室被配置为以相邻的关系与另一个室配合。 该方法包括将具有包含第一O形环的密封表面的插入板放置在输送室接口端口中，使得第一O形环夹在密封表面和另一个室的表面之间。 因此，通过第一O形环在传送室接口端口内的传送室和另一个室之间实现真空密封。