公开(公告)号：US20240339337A1

公开(公告)日：2024-10-10

申请号：US18671508

申请日：2024-05-22

申请人： Kokusai Electric Corporation

发明人： Daigi KAMIMURA ,  Tomoshi TANIYAMA ,  Takashi NOGAMI

IPC分类号： H01L21/67 ,  C23C16/44 ,  H01L21/02 ,  H01L21/677

CPC分类号： H01L21/67017 ,  H01L21/02 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67757 ,  C23C16/4412 ,  H01L21/67201

摘要： A substrate processing apparatus includes a first processing module including a first processing module, a second processing module, a first utility system adjacent to a back surface of the first processing module, and a second utility system adjacent to a back surface of the second processing module, a first exhaust box of the first utility system and a second exhaust box of the second utility system being disposed to face each other across a maintenance area located behind a part of the back surface of the first processing module that is close to the second processing module and behind a part of the back surface of the second processing module that is close to the first processing module, and a first supply box of the first utility system and a second supply box of the second utility system being disposed to face each other across the maintenance area.

公开(公告)号：US12073556B2

公开(公告)日：2024-08-27

申请号：US17722031

申请日：2022-04-15

申请人： SK hynix Inc.

发明人： Jeong Ok Park

IPC分类号： G06T7/00 ,  G01N21/95 ,  H01L21/67

CPC分类号： G06T7/001 ,  G01N21/9501 ,  H01L21/67196 ,  H01L21/67288 ,  G01N2201/0634 ,  G06T2207/30148

摘要： A defect inspection system may include an information-obtaining module and a defect inspection module. The information obtaining module may be arranged over a transferring apparatus to continuously photograph a surface of a substrate transferred by the transferring apparatus. The defect inspection module may generate an image signal based on information of the substrate provided from the information-obtaining module. The defect inspection module may compare the image signal with a reference to detect a defect of the substrate.

公开(公告)号：US20240153797A1

公开(公告)日：2024-05-09

申请号：US18387524

申请日：2023-11-07

申请人： SINFONIA TECHNOLOGY CO., LTD.

发明人： Gengoro Ogura ,  Toshihiro Kawai

IPC分类号： H01L21/67

CPC分类号： H01L21/67196

摘要： An EFEM includes a housing including a transfer chamber in which a processing target object is transferred, and a connection module provided between the transfer chamber and a front chamber, wherein the housing includes a rear member having a housing-side opening through which the processing target object is capable of passing, the connection module includes a first frame part arranged around the housing-side opening and pressed by a transfer chamber-side surface of the rear member, a second frame part provided in the front chamber and arranged around a front chamber-side opening, and connected to the first frame part, and a sealing part configured to seal the second frame part and the front chamber, and the sealing part includes a flexible portion capable of expanding and contracting at least in a predetermined direction, and an enclosure portion connected to the flexible portion and configured to enclose the front chamber-side opening.

公开(公告)号：US11948816B2

公开(公告)日：2024-04-02

申请号：US17563850

申请日：2021-12-28

申请人： TOKYO ELECTRON LIMITED

发明人： Masahiro Dogome ,  Masatomo Kita

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/67196 ,  H01L21/67742 ,  H01L21/68764

摘要： A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.

公开(公告)号：US11948810B2

公开(公告)日：2024-04-02

申请号：US15906689

申请日：2018-02-27

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Li-Chao Yin ,  Yuling Chiu ,  Yu-Lung Yang ,  Hung-Bin Lin

IPC分类号： H01L21/67

CPC分类号： H01L21/67017 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67126 ,  H01L21/67201

摘要： A vacuum apparatus includes process chambers, and a transfer chamber coupled to the process chambers. The transfer chamber includes one or more vacuum ports, thorough which a gas inside the transfer chamber is exhausted, and vent ports, from which a vent gas is supplied. The one or more vacuum ports and the vent ports are arranged such that air flows from at least one of the vent ports to the one or more vacuum ports are line-symmetric with respect to a center line of the transfer chamber.

公开(公告)号：US11901206B2

公开(公告)日：2024-02-13

申请号：US18104731

申请日：2023-02-01

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chun-Jung Huang ,  Yung-Lin Hsu ,  Kuang Huan Hsu ,  Jeff Chen ,  Steven Huang ,  Yueh-Lun Yang

IPC分类号： H01L21/677 ,  H01L21/67

CPC分类号： H01L21/67703 ,  H01L21/67196 ,  H01L21/67727

摘要： In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

公开(公告)号：US20240047254A1

公开(公告)日：2024-02-08

申请号：US18139878

申请日：2023-04-26

申请人： Tokyo Electron Limited

发明人： Norihiko Amikura ,  Toshiaki Toyomaki

IPC分类号： H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  B65G47/90 ,  H01L21/687

CPC分类号： H01L21/67766 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67017 ,  H01L21/681 ,  B65G47/90 ,  H01L21/68707 ,  H01L21/67126

摘要： A substrate transfer system includes a load lock module, an atmospheric transfer module having a first sidewall adjacent to the load lock module and a second sidewall remote from the load lock module, the atmospheric transfer module being connected to the load lock module, and a substrate transfer robot disposed in the atmospheric transfer module. The substrate transfer robot includes a base configured to reciprocate along the first sidewall, a substrate transfer arm disposed on the base, and a flow rectifier surrounding the base, the flow rectifier being configured, upon movement of the base, to create an obliquely downward air flow in a direction opposite to a moving direction of the base.

公开(公告)号：US11860528B2

公开(公告)日：2024-01-02

申请号：US17129077

申请日：2020-12-21

申请人： Applied Materials, Inc.

发明人： Ribhu Gautam ,  Vibhu Jindal ,  Sanjay Bhat ,  Praveen Kumar Choragudi ,  Vinodh Ramachandran ,  Arun Rengaraj

IPC分类号： H01L21/67 ,  G03F1/24 ,  H01L21/687 ,  B65G47/90 ,  C23C14/06 ,  C23C14/56 ,  C23C14/58 ,  C23C14/35

CPC分类号： G03F1/24 ,  B65G47/90 ,  C23C14/0641 ,  C23C14/35 ,  C23C14/566 ,  C23C14/568 ,  C23C14/5806 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/68707 ,  H01L21/68742 ,  H01L21/68764

摘要： Substrate processing systems or platforms and methods configured to process substrates including of extreme ultraviolet (EUV) mask blanks are disclosed. Systems or platforms provide a small footprint, high throughput of substrates and minimize defect generation. The substrate processing system platform comprises a single central transfer chamber, a single transfer robot, a substrate flipping fixture, and processing chambers are positioned around the single central transfer chamber.

公开(公告)号：US11850743B2

公开(公告)日：2023-12-26

申请号：US16578791

申请日：2019-09-23

申请人： TOKYO ELECTRON LIMITED

发明人： Takehiro Shindo ,  Toshiaki Kodama

IPC分类号： B25J9/04 ,  B25J18/04 ,  B25J9/12 ,  H01L21/677 ,  H01L21/67 ,  B25J11/00 ,  B25J9/10 ,  B25J9/00 ,  B25J13/08

CPC分类号： B25J9/042 ,  B25J9/126 ,  B25J18/04 ,  H01L21/67196 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/67766 ,  B25J9/0021 ,  B25J9/102 ,  B25J11/0095 ,  B25J13/088

摘要： There is provided a transport apparatus including: an articulated arm including: a first arm in which a drive motor is installed; a second arm configured to be driven by the first arm; a transmission portion configured to convert a rotation of the drive motor into a rotation of the second arm via a joint; a first detector configured to detect a first sensor value corresponding to a rotation angle of an input shaft of the transmission portion; and a second detector configured to detect a second sensor value corresponding to a rotation angle of the second arm; and a controller configured to control the articulated arm, wherein the controller is further configured to control the second arm to a target rotation angle based on the first sensor value and the second sensor value.

公开(公告)号：US20230395405A1

公开(公告)日：2023-12-07

申请号：US18235467

申请日：2023-08-18

申请人： ASM IP Holding B.V.

发明人： Theodorus Oosterlaken ,  Chris de Ridder

IPC分类号： H01L21/67 ,  B65G47/90 ,  F27D3/00 ,  F27D5/00 ,  F27D7/06 ,  H01L21/677

CPC分类号： H01L21/67161 ,  B65G47/90 ,  F27D3/0084 ,  F27D5/0037 ,  F27D7/06 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67766 ,  B65G2201/0297 ,  H01L21/67769

摘要： The disclosure relates to substrate processing apparatus, with a first and second reactor, each reactor configured for processing a plurality of substrates; and, a substrate handling robot constructed and arranged to transfer substrates between a substrate cassette at a substrate transfer position and the first and second reactor. The apparatus is constructed and arranged with a maintenance area between the first and second reactors to allow maintenance of the reactors from the maintenance area to both the first and second reactor.