公开(公告)号：US20060076695A1

公开(公告)日：2006-04-13

申请号：US11234652

申请日：2005-09-23

申请人： Wen-Chen Hsieh ,  Hsiu-Fang Chien ,  Chien-Te Chen

发明人： Wen-Chen Hsieh ,  Hsiu-Fang Chien ,  Chien-Te Chen

IPC分类号： H01L23/28

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L21/566 ,  H01L2224/16 ,  H01L2224/83104 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2224/0401

摘要： A semiconductor package with flash-absorbing mechanism and a fabrication method thereof are proposed, wherein a flash-absorbing structure is formed on a gold-plated copper layer of a substrate, and adhesion between the flash-absorbing structure and a molding material is larger than that between the molding material and a mold, such that flashes of the molding material are not adhered to the mold after completing a molding process unlike the conventional technology, thereby ensuring quality of the fabricated semiconductor package.

摘要翻译： 提出了一种具有闪光吸收机构的半导体封装及其制造方法，其中在衬底的镀金铜层上形成闪光吸收结构，并且闪光吸收结构与成型材料之间的粘合力大于 在模制材料和模具之间，使得成型材料的闪光在完成模制工艺之后不会像传统技术那样粘附到模具上，从而确保制造的半导体封装的质量。