公开(公告)号：US20110304754A1

公开(公告)日：2011-12-15

申请号：US12958405

申请日：2010-12-02

Applicant: WEN-CHIN TSAI

Inventor： WEN-CHIN TSAI

IPC: H04N5/335 ,  H01L27/00

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An exemplary image sensor module includes a plate, an image sensor, and a number of conductive wires. The plate includes a top surface, a bottom surface, a light passing through hole, a number of spaced receiving holes extending through the top surface and the bottom surface, and a number of conductive pads on the top surface. The receiving holes surround the through hole. The sensor includes a first surface and a number of bonding pads corresponding to the respective conductive pads. The first surface opposes the bottom surface, and is mounted on the bottom surface. The first surface includes a light sensitive region aligned with the through hole, and a light insensitive region surrounding the light sensitive region. The bonding pads are arranged on the light insensitive region. The wires pass through the respective receiving holes, and respectively electrically connect the bonding pads to the corresponding conductive pads.

Abstract translation: 示例性的图像传感器模块包括板，图像传感器和多个导电线。 板包括顶表面，底表面，透光孔，穿过顶表面和底表面延伸的多个间隔的接收孔以及顶表面上的多个导电垫。 接收孔围绕通孔。 传感器包括第一表面和与各个导电焊盘对应的多个焊盘。 第一表面与底面相对，并安装在底面上。 第一表面包括与通孔对准的光敏区域和围绕光敏区域的不透光区域。 接合焊盘布置在光不敏感区域上。 电线穿过相应的接收孔，并将接合焊盘分别电连接到相应的导电焊盘。

公开(公告)号：US20070277419A1

公开(公告)日：2007-12-06

申请号：US11708086

申请日：2007-02-15

Applicant: Wen-Chin Tsai

Inventor： Wen-Chin Tsai

IPC: A47G1/10 ,  B23P11/00

CPC classification number: G02F1/133308 ,  G02F1/133608 ,  G02F2001/13332 ,  G02F2001/133328 ,  G02F2201/46 ,  Y10T29/49826

Abstract: A one-piece-form bezel and its manufacturing method are disclosed here. The present invention utilizes a frame element with a one-piece-form rivet and a frame element with and one-piece-form riveting hole to rivet frame elements with each other and to complete the assemble by punching. The present invention is not necessary to utilize extra assembling processes, such as soldering, solvent, adhesive or gluing process, to joint frame elements and is only to utilize the normal punching equipments to form the present one-piece-form bezel.

Abstract translation: 这里公开了一体式挡板及其制造方法。 本发明利用具有一体式铆钉的框架元件和具有一体式铆接孔的框架元件将框架元件彼此铆接并通过冲压完成组装。 本发明不需要利用诸如焊接，溶剂，粘合剂或胶合工艺的附加组装过程到接合框架元件，并且只能利用普通的冲压设备来形成本单件式的挡板。

公开(公告)号：USD508008S1

公开(公告)日：2005-08-02

申请号：US29212163

申请日：2004-08-27

Applicant: Wen-Chin Tsai

Designer： Wen-Chin Tsai

公开(公告)号：US08421911B2

公开(公告)日：2013-04-16

申请号：US12958405

申请日：2010-12-02

Applicant: Wen-Chin Tsai

Inventor： Wen-Chin Tsai

IPC: H04N5/225 ,  H01L27/00

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An exemplary image sensor module includes a plate, an image sensor, and a number of conductive wires. The plate includes a top surface, a bottom surface, a light passing through hole, a number of spaced receiving holes extending through the top surface and the bottom surface, and a number of conductive pads on the top surface. The receiving holes surround the through hole. The sensor includes a first surface and a number of bonding pads corresponding to the respective conductive pads. The first surface opposes the bottom surface, and is mounted on the bottom surface. The first surface includes a light sensitive region aligned with the through hole, and a light insensitive region surrounding the light sensitive region. The bonding pads are arranged on the light insensitive region. The wires pass through the respective receiving holes, and respectively electrically connect the bonding pads to the corresponding conductive pads.

Abstract translation: 示例性的图像传感器模块包括板，图像传感器和多个导电线。 板包括顶表面，底表面，透光孔，穿过顶表面和底表面延伸的多个间隔的接收孔以及顶表面上的多个导电垫。 接收孔围绕通孔。 传感器包括第一表面和与各个导电焊盘对应的多个焊盘。 第一表面与底面相对，并安装在底面上。 第一表面包括与通孔对准的光敏区域和围绕光敏区域的不透光区域。 接合焊盘布置在光不敏感区域上。 电线穿过相应的接收孔，并将接合焊盘分别电连接到相应的导电焊盘。

公开(公告)号：US20120287373A1

公开(公告)日：2012-11-15

申请号：US13281384

申请日：2011-10-25

Applicant: Wen Chin Tsai ,  Wang Sheng Lin

Inventor： Wen Chin Tsai ,  Wang Sheng Lin

IPC: G02F1/1335 ,  F21V29/00 ,  B29C65/00 ,  B32B37/14 ,  B29C47/00 ,  F21S4/00 ,  G09F13/04

CPC classification number: G02F1/133615 ,  G02B6/0085 ,  G02B6/0088 ,  G02F2001/133628 ,  Y10T156/10

Abstract: A light source device for a backlight module, including a heat sink; and a light bar including a plurality of light emitting diodes (LEDs) and a substrate on which the LEDs are electrically provided. The substrate is bonded to the heat sink via a bonding portion through which heat generated by LEDs is transferred to the heat sink. Also, a method for manufacturing a light source device, including providing a light bar having a plurality of LEDs thereon; providing a heat sink; and bonding a substrate of the light bar to an upper surface of the heat sink such that they are integrated firmly into one piece. In this way, the heat dissipation effect can be improved by means of preventing the substrate of the light bar from deforming and further separating from the heat sink.

Abstract translation: 一种用于背光模块的光源装置，包括散热片; 以及包括多个发光二极管（LED）的光棒和其上电连接LED的基板。 基板通过结合部分结合到散热器，通过该结合部分，由LED产生的热量传递到散热器。 另外，一种光源装置的制造方法，其特征在于，包括在其上设置有多个LED的光棒; 提供散热器; 以及将所述灯条的基板结合到所述散热器的上表面，使得它们牢固地集成成一体。 以这种方式，可以通过防止光棒的基板变形并进一步与散热器分离来提高散热效果。

公开(公告)号：US08074460B2

公开(公告)日：2011-12-13

申请号：US12170915

申请日：2008-07-10

Applicant: An-Bang Wang ,  Chia-Fong Lee ,  Wen-Chin Tsai ,  I-Chun Lin ,  Fei-Yau Lu ,  Chih-Chieh Chen ,  Liang-Jenq Leu ,  Chuin-Shan Chen ,  Wen-Pin Shih

Inventor： An-Bang Wang ,  Chia-Fong Lee ,  Wen-Chin Tsai ,  I-Chun Lin ,  Fei-Yau Lu ,  Chih-Chieh Chen ,  Liang-Jenq Leu ,  Chuin-Shan Chen ,  Wen-Pin Shih

IPC: F28D3/00 ,  F28D5/00

CPC classification number: F24F5/0046 ,  F24F6/12 ,  F24F2006/125 ,  F24F2110/30 ,  Y02B30/80

Abstract: A device for adjusting a temperature and a humidity using a wind power is provided. The device includes an inlet; an outlet connected to the inlet; a sprayer spraying a nebulized liquid into the device; and an airflow sensor electrically connected to the sprayer for activating the sprayer when an airflow passes through.

Abstract translation: 提供了一种使用风力来调节温度和湿度的装置。 该装置包括入口; 连接到入口的出口; 喷雾器将喷雾的液体喷射到装置中; 以及气流传感器，其电连接到喷雾器，用于当空气流通过时激活喷雾器。

公开(公告)号：US20110189885A1

公开(公告)日：2011-08-04

申请号：US12953566

申请日：2010-11-24

Applicant: Wen Chin TSAI

Inventor： Wen Chin TSAI

IPC: H01R13/70 ,  H01R3/00

CPC classification number: H01R13/701 ,  H01R13/5213 ,  H01R13/7037

Abstract: A connector assembly includes a socket connector with a transformer circuit and a plug connector that is releasably fit to the socket connector. The plug connector includes a slidable power switch containing a magnet and a magnetic detection element that detects the magnetic field of the magnet. When the slidable power switch changes position to bring the magnet close to the magnetic detection element, a closed circuit is formed and a power supply is activated. When the magnet is moved away from the magnetic detection element, the circuit is open and the power supply is cut off. The plug connector has a front end with a rotatable water-tight collar. The socket connector includes a closure cap arranged at an end for temporarily engaging an external thread of the socket connector in order to protect the assembly when the socket connector is engaged with the plug connector.

Abstract translation: 连接器组件包括具有变压器电路的插座连接器和可释放地配合到插座连接器的插头连接器。 插头连接器包括容纳磁体的可滑动的电源开关和检测磁体的磁场的磁检测元件。 当可滑动电源开关改变位置以使磁体靠近磁检测元件时，形成闭合电路并且激活电源。 当磁体远离磁检测元件时，电路断开，电源被切断。 插头连接器具有前端，其具有可旋转的防水套环。 插座连接器包括一个封闭盖，该封闭盖布置在端部，用于临时接合插座连接器的外螺纹，以便当插座连接器与插头连接器接合时保护组件。

公开(公告)号：US20080151479A1

公开(公告)日：2008-06-26

申请号：US11823448

申请日：2007-06-26

Applicant: Wen-Chin Tsai

Inventor： Wen-Chin Tsai

IPC: H05K5/02

CPC classification number: G02F1/133308 ,  G02F2001/133328

Abstract: A one-piece-form 3-dimentional bezel and its manufacturing method are disclosed here. The present invention utilizes a 3-dimentional frame element with one-piece-form rivet portions on a top side and on a lateral side and a 3-dimentional frame element with one-piece-form riveting holes on a top side and a lateral side to rivet 3-dimentional frame elements with each other and to complete the assemble by punching. The present invention is not necessary to utilize extra assembling processes, such as soldering, melting, adhesive or gluing process, to joint frame elements and is only to utilize the normal punching equipments to form the present one-piece-form 3-dimentional bezel.

Abstract translation: 这里公开了一体式三维表圈及其制造方法。 本发明使用在顶侧和侧面上具有一体式铆钉部分的三维框架元件和在顶侧和侧面上具有单件式铆接孔的3维框架元件 将三维框架元件彼此铆接，并通过冲压完成组装。 本发明不需要对接头框架元件采用诸如焊接，熔化，粘合或胶合加工的额外的组装过程，并且只能利用普通冲压设备来形成本发明的单件式三维表圈。

公开(公告)号：USD504376S1

公开(公告)日：2005-04-26

申请号：US29211085

申请日：2004-08-11

Applicant: Wen-Chin Tsai

Designer： Wen-Chin Tsai

公开(公告)号：USD501169S1

公开(公告)日：2005-01-25

申请号：US29209368

申请日：2004-07-15

Applicant: Wen-Chin Tsai

Designer： Wen-Chin Tsai